Patents by Inventor Shih-Hsun Kuo

Shih-Hsun Kuo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for forming a semiconductor structure
    Patent number: 9368365
    Abstract: A manufacturing method for forming a semiconductor structure includes: first, a plurality of fin structures are formed on a substrate and arranged along a first direction, next, a first fin cut process is performed, so as to remove parts of the fin structures which are disposed within at least one first fin cut region, and a second fin cut process is then performed, so as to remove parts of the fin structures which are disposed within at least one second fin cut region, where the second fin cut region is disposed along at least one edge of the first fin cut region.
    Type: Grant
    Filed: May 12, 2015
    Date of Patent: June 14, 2016
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Shih-Hsun Kuo, Ting-Cheng Tseng, Tan-Ya Yin, Chia-Wei Huang, Ming-Jui Chen