Patents by Inventor Shih-Hsun Liu

Shih-Hsun Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11984419
    Abstract: Package structures and methods for manufacturing the same are provided. The package structure includes a first bump structure formed over a first substrate. The first bump structure includes a first pillar layer formed over the first substrate and a first barrier layer formed over the first pillar layer. In addition, the first barrier layer has a first protruding portion laterally extending outside a first edge of the first pillar layer. The package structure further includes a second bump structure bonded to the first bump structure through a solder joint. In addition, the second bump structure includes a second pillar layer formed over a second substrate and a second barrier layer formed over the second pillar layer. The first protruding portion of the first barrier layer is spaced apart from the solder joint.
    Type: Grant
    Filed: July 26, 2022
    Date of Patent: May 14, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Cheng-Hung Chen, Yu-Nu Hsu, Chun-Chen Liu, Heng-Chi Huang, Chien-Chen Li, Shih-Yen Chen, Cheng-Nan Hsieh, Kuo-Chio Liu, Chen-Shien Chen, Chin-Yu Ku, Te-Hsun Pang, Yuan-Feng Wu, Sen-Chi Chiang
  • Patent number: 11917230
    Abstract: A system and method for maximizing bandwidth in an uplink for a 5G communication system is disclosed. Multiple end devices generate image streams. A gateway is coupled to the end devices. The gateway includes a gateway monitor agent collecting utilization rate data of the gateway and an image inspector collecting inspection data from the received image streams. An edge server is coupled to the gateway. The edge server includes an edge server monitor agent collecting utilization rate data of the edge server. An analytics manager is coupled to the gateway and the edge server. The analytics manager is configured to determine an allocation strategy based on the collected utilization rate data from the gateway and the edge server.
    Type: Grant
    Filed: October 6, 2021
    Date of Patent: February 27, 2024
    Assignee: Quanta Cloud Technology Inc.
    Inventors: Yi-Neng Zeng, Keng-Cheng Liu, Wei-Ming Huang, Shih-Hsun Lai, Ji-Jeng Lin, Chia-Jui Lee, Liao Jin Xiang
  • Publication number: 20180319543
    Abstract: A container has a body, two handles, a handle combination structure, and one lid. The body has a body space forming in the body. The handles are connected with the body, and each handle has two connecting portions and two folding grooves. The connecting portions are formed between the handle and the body and are bendable. The handle combination structure is formed on the handles to selectively combine the two handles with each other. The lid is connected with the body and has a connecting portion formed between the body and the lid and being bendable. The body and the lid are respectively located in spaces which are respectively formed between the body and the handles.
    Type: Application
    Filed: September 6, 2017
    Publication date: November 8, 2018
    Inventor: Shih-Hsun Liu
  • Patent number: D886604
    Type: Grant
    Filed: September 11, 2017
    Date of Patent: June 9, 2020
    Inventor: Shih-Hsun Liu