Abstract: A method for manufacturing a bending-tolerant multilayered flexible circuit board (FPC) suitable for use in a disposable biosensor chip includes manufacturing and bending a single-sided FPC. The single-sided FPC includes a base layer, a wiring layer, and through holes. The wiring layer includes first and second wiring areas. A first bending area is formed between each first wiring area and the corresponding second wiring area, the through holes forming an easy bending line. The second wiring area is bent relative to the first wiring area along the bending line to obtain the multilayered FPC.