Patents by Inventor Shih-Hua Hsu

Shih-Hua Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220238621
    Abstract: An organic semiconductor substrate includes a base, a first conductive pattern, a second conductive pattern, a first metal oxide pattern, a second metal oxide pattern, an organic flat pattern layer, a source, a drain, an organic semiconductor pattern, an organic gate insulating layer, and a gate. The first conductive pattern and the second conductive pattern are disposed on the base and separated from each other. The first metal oxide pattern and the second metal oxide pattern respectively cover and are electrically connected to the first conductive pattern and the second conductive pattern, respectively. A first portion of the organic flat pattern layer is disposed between the first metal oxide pattern and the second metal oxide pattern. A surface of the first metal oxide pattern has a first distance from the base. A surface of the first portion of the organic flat pattern layer has a second distance from the base. The second distance is less than or equal to the first distance.
    Type: Application
    Filed: July 1, 2021
    Publication date: July 28, 2022
    Applicant: Au Optronics Corporation
    Inventors: Shuo-Yang Sun, Shih-Hua Hsu, Ching-Wen Chen, Ying-Hui Lai
  • Publication number: 20220157911
    Abstract: A semiconductor device is disposed and includes a substrate, on which a scan line, a data line, a source electrode, a drain electrode, an organic semiconductor pattern, an organic insulating layer, a gate electrode, and an organic protection layer are disposed. The source electrode is electrically connected to the data line. The organic semiconductor pattern is disposed between the source electrode and the drain electrode. The organic insulating layer is disposed on an upper surface and a side surface of the organic semiconductor pattern. The organic insulating layer is at least disposed between the side surface of the organic semiconductor pattern and the gate electrode and disposed between the upper surface of the organic semiconductor pattern and the gate electrode. The gate electrode is electrically connected to the scan line. The organic protection layer covers the gate electrode.
    Type: Application
    Filed: June 30, 2021
    Publication date: May 19, 2022
    Applicant: Au Optronics Corporation
    Inventors: Shuo-Yang Sun, Shih-Hua Hsu, Ching-Wen Chen, Ying-Hui Lai
  • Patent number: 10352966
    Abstract: A method for utilizing a probe card includes steps as follows. Providing a probe card having three alignment marks on a reference plane of a circuit board; moving the circuit board to be oriented to a wafer-loading plane of a wafer stage with the reference plane; determining whether a geometric plane defined by the alignment marks is parallel to the wafer-loading plane; and when the geometric plane is not parallel to the wafer-loading plane, adjusting a levelness of the circuit board until the reference plane is parallel to the wafer-loading plane.
    Type: Grant
    Filed: September 1, 2016
    Date of Patent: July 16, 2019
    Assignees: GLOBAL UNICHIP CORPORATION, TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chang-Ming Liu, Chien-Hao Lin, Shih-Hua Hsu, Ning-Chun Hsu
  • Patent number: 9891097
    Abstract: A brightness calibration method used in an optical detection system includes a single source illuminator and a probe card. The single source illuminator is configured to illuminate the probe card. The probe card has a plurality of detection sites. The brightness calibration method includes: sequentially detecting brightness values at the detection sites through one of a plurality of diffusers by a sensing chip; sequentially detecting transparencies of the diffusers at one of the detection sites by the sensing chip; and selecting and respectively disposing the diffusers corresponding to larger ones of the transparencies over the detection sites corresponding to smaller ones of the brightness values, and selecting and respectively disposing the diffusers corresponding to smaller ones of the transparencies over the detection sites corresponding to larger ones of the brightness values.
    Type: Grant
    Filed: September 21, 2015
    Date of Patent: February 13, 2018
    Assignees: GLOBAL UNICHIP CORPORATION, TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chang-Ming Liu, Pi-Tsan Lo, Shih-Hua Hsu, Chien-Hao Lin, Teng-Hui Lee, Tsung-Ju Hsieh
  • Publication number: 20170276701
    Abstract: A method for utilizing a probe card includes steps as follows. Providing a probe card having three alignment marks on a reference plane of a circuit board; moving the circuit board to be oriented to a wafer-loading plane of a wafer stage with the reference plane; determining whether a geometric plane defined by the alignment marks is parallel to the wafer-loading plane; and when the geometric plane is not parallel to the wafer-loading plane, adjusting a levelness of the circuit board until the reference plane is parallel to the wafer-loading plane.
    Type: Application
    Filed: September 1, 2016
    Publication date: September 28, 2017
    Inventors: Chang-Ming LIU, Chien-Hao LIN, Shih-Hua HSU, Ning-Chun HSU
  • Publication number: 20160377477
    Abstract: A brightness calibration method used in an optical detection system includes a single source illuminator and a probe card. The single source illuminator is configured to illuminate the probe card. The probe card has a plurality of detection sites. The brightness calibration method includes: sequentially detecting brightness values at the detection sites through one of a plurality of diffusers by a sensing chip; sequentially detecting transparencies of the diffusers at one of the detection sites by the sensing chip; and selecting and respectively disposing the diffusers corresponding to larger ones of the transparencies over the detection sites corresponding to smaller ones of the brightness values, and selecting and respectively disposing the diffusers corresponding to smaller ones of the transparencies over the detection sites corresponding to larger ones of the brightness values.
    Type: Application
    Filed: September 21, 2015
    Publication date: December 29, 2016
    Inventors: Chang-Ming LIU, Pi-Tsan LO, Shih-Hua HSU, Chien-Hao LIN, Teng-Hui LEE, Tsung-Ju HSIEH
  • Publication number: 20090032681
    Abstract: A detector for detecting an image sensor is provided. The image sensor is electrically connected to a wafer via a contacting pad. The detector includes a parallel light source, a pin and a diffuser. The parallel light source radiates a parallel light. The pin is electrically connected to the contacting pad. The diffuser is disposed between the parallel light source and the pin. The parallel light from the parallel light source passes through the diffuser and then reaches the image sensor on the wafer.
    Type: Application
    Filed: October 19, 2007
    Publication date: February 5, 2009
    Inventors: Sheng-Feng Lu, Choy-Shin Cheong, Shih-Ming Chen, Li-Ming Chin, Shih-Hua Hsu