Abstract: A semiconductor device is provided. The semiconductor includes a supporting silicon layer and a memory module. The memory module and the supporting silicon layer are bonded via a bonding structure. The bonding structure includes at least one bonding film whose thickness is less than 200 ?.

Abstract: A package structure and a formation method are provided. The method includes providing a semiconductor substrate and bonding a first chip structure on the semiconductor substrate through metal-to-metal bonding and dielectric-to-dielectric bonding. The method also includes bonding a second chip structure over the semiconductor substrate through solder-containing bonding structures. The method further includes forming a protective layer surrounding the second chip structure. A portion of the protective layer is between the semiconductor substrate and a bottom of the second chip structure.

Abstract: A semiconductor device includes a substrate, a semiconductor component and a heat dissipation component. The semiconductor component is disposed on the substrate. The heat dissipation component is disposed on the substrate and having a cavity, an inlet and an outlet, wherein the inlet and the outlet communicate with the cavity.

Abstract: Optical devices and methods of manufacture are presented in which a laser die or other heterogeneous device is embedded within an optical device and evanescently coupled to other devices. The evanescent coupling can be performed either from the laser die to a waveguide, to an external cavity, to an external coupler, or to an interposer substrate.

Abstract: A semiconductor device includes a die, an encapsulant over a front-side surface of the die, a redistribution structure on the encapsulant, a thermal module coupled to the back-side surface of the die, and a bolt extending through the redistribution structure and the thermal module. The die includes a chamfered corner. The bolt is adjacent to the chamfered corner.

Abstract: A semiconductor structure includes a first tier, a redistribution circuit structure, and a second tier. The first tier includes at least one first die. The redistribution circuit structure is disposed on the first tier and electrically coupled to the at least one first die, where the redistribution circuit structure has a multi-layer structure and includes a vertical connection structure continuously extending from a first side of the redistribution circuit structure to a second side of the redistribution circuit structure, and the first side is opposite to the second side along a stacking direction of the first tier and the redistribution circuit structure. The second tier includes a plurality of second dies, and is disposed on and electrically coupled to the redistribution circuit structure.

Abstract: Semiconductor package includes a pair of dies, a redistribution structure, and a conductive plate. Dies of the pair of dies are disposed side by side. Each die includes a contact pad. Redistribution structure is disposed on the pair of dies, and electrically connects the pair of dies. Redistribution structure includes an innermost dielectric layer, an outermost dielectric layer, and a redistribution conductive layer. Innermost dielectric layer is closer to the pair of dies. Redistribution conductive layer extends between the innermost dielectric layer and the outermost dielectric layer. Outermost dielectric layer is furthest from the pair of dies. Conductive plate is electrically connected to the contact pads of the pair of dies. Conductive plate extends over the outermost dielectric layer of the redistribution structure and over the pair of dies. Vertical projection of the conductive plate falls on spans of the dies of the pair of dies.

Abstract: A photography device includes a light transmitter, a light receiver, a processor, an adjustable focusing lens, and a driving module. The light transmitter is configured to transmit light to an object. The light receiver is configured to receive the reflected light. The processor is configured to generate a driving value according to transmission and reception of the light. The adjustable focusing lens has a focal length. The driving module is configured to adjust the focal length by driving the adjustable focusing lens according to the driving value.

Abstract: A photography device includes a light transmitter, a light receiver, a processor, an adjustable focusing lens, and a driving module. The light transmitter is configured to transmit light to an object. The light receiver is configured to receive the reflected light. The processor is configured to generate a driving value according to transmission and reception of the light. The adjustable focusing lens has a focal length. The driving module is configured to adjust the focal length by driving the adjustable focusing lens according to the driving value.

Abstract: A system and method for a communication connection in network architecture are provided. First, a client terminal is linked to a target terminal via the Internet. Then whether the link mode is a virtual link or a substantial link is determined. If the link mode is the substantial link, the client terminal is communicationally connected to the target terminal via the substantial link. If the link mode is the virtual link, whether a local area network is linked via a STUN server is determined. If yes, a peer-to-peer link is built via the STUN server. If no, the client terminal is communicationally connected to a management server of the local area network, and then the management server is communicationally connected to the target terminal.

Abstract: A file sharing method includes: transferring content information related to a to-be-shared file to an address mapping server; and the address mapping server providing an accessible address mapped to the to-be-shared file according to the content information. One advantage of using the above file sharing method is that the user who wants to share files does not need to apply network space and upload the files beforehand.

Abstract: A method and a system for setting a domain name and a network device thereof are provided. In the invention, the network device includes built-in identification information, and the identification information is stored in a back-end database. When the network device receives a domain name, it transmits setting information to a server device. Then, the server device queries the identification information in the back-end database according to the setting information to authenticate the network device. After the network device passes the authentication, the server device maps the domain name to an Internet protocol address. Therefore, a step of registering an account and a password is omitted to simplify a procedure of setting the domain name.