Abstract: A detachable guiding mechanism is selectively disposed inside an electronic device and located above a half-height expansion card of the electronic device. The detachable guiding mechanism includes a bridging component and a guiding component. The bridging component includes at least one connecting portion. The guiding component is detachably assembled with the bridging component. The guiding component includes a contacting surface, a first guiding surface, a second guiding surface and at least one fixing portion. The contacting surface contacts against or abuts adjacent to an upper edge of the half-height expansion card since the detachable guiding mechanism is located above the half-height expansion card. The first guiding surface and the second guiding surface are connected to the contacting surface to respectively form a first angle and a second angle. The fixing portion is disposed on the connecting portion to detachably assemble the guiding component with the bridging component.

Abstract: A flow guiding mechanism with flow channel adjusting function is suitable to a heat dissipating module and an electronic device with an interface card. The flow guiding mechanism includes a supporting component, at least one ventilative structure and a plurality of sheltering components. The interface card is assembled with the supporting component in an assembly direction. The ventilative structure includes a plurality of openings, and the plurality of openings is formed on the supporting component in the assembly direction. The plurality of sheltering components is rotatably disposed on the supporting component. One of the plurality of sheltering components covers a corresponding opening of the plurality of openings while the interface card does not contact the foresaid sheltering component, and the interface card rotates the foresaid sheltering component relative to the supporting component to expose the corresponding opening while the interface card is assembled with the supporting component.

Abstract: A heat dissipating module includes a heat dissipating member and an air flow guiding mechanism. The air flow guiding mechanism includes a base, an air guiding plate and a stopping structure. The base is disposed on a side of the heat dissipating member, and the air guiding plate is pivoted to the base. The stopping structure is disposed on the base. A side of the stopping structure abuts against the air guiding plate, so as to allow the air guiding plate to rotate in a first direction and to stop the air guiding plate from rotating in a second direction opposite to the first direction.

Abstract: A heat dissipating module having enhanced heat dissipating efficiency is disclosed. The heat dissipating module includes a heat dissipating member, a base and an air guiding member. The heat dissipating member is installed on a first electronic component for dissipating heat generated by the first electronic component. The base is installed on a side of the heat dissipating member, and the air guiding member is connected to the base. The air guiding member and the base cooperatively guide an air flow passing through the heat dissipating member to a second electronic component located on a side of the first electronic component.

Abstract: A detachable guiding mechanism is selectively disposed inside an electronic device and located above a half-height expansion card of the electronic device. The detachable guiding mechanism includes a bridging component and a guiding component. The bridging component includes at least one connecting portion. The guiding component is detachably assembled with the bridging component. The guiding component includes a contacting surface, a first guiding surface, a second guiding surface and at least one fixing portion. The contacting surface contacts against or abuts adjacent to an upper edge of the half-height expansion card since the detachable guiding mechanism is located above the half-height expansion card. The first guiding surface and the second guiding surface are connected to the contacting surface to respectively form a first angle and a second angle. The fixing portion is disposed on the connecting portion to detachably assemble the guiding component with the bridging component.

Abstract: A backflow prevention device includes a plurality of flaps that are connected pivotally to a casing of a fan. When a blade unit of the fan rotates to generate an airflow entering the casing via an airflow inlet and exiting the casing via an airflow outlet, the flaps are driven to pivot away from the blade unit to open positions, where the flaps serve as stator blades for the fan. When rotation of the blade unit is stopped, the flaps are driven by a reverse flow directed toward the airflow outlet and the blade unit to pivot toward the blade unit to closed positions, where the flaps close the airflow outlet to prevent air from entering the casing via the airflow outlet.

Abstract: A channel diversion device includes a supporting structure, a piercing hole structure, a guiding baffle and a collecting mask. An electronic component can be accommodated inside the supporting structure. The supporting structure includes a first structural layer and a second structural layer. An opening is formed on the second structural layer. The piercing structure is formed on a lateral wall of the first structural layer, and the guiding baffle is disposed by a side of the opening on the second structural layer. The collecting mask is disposed by the first structural layer to cover the piercing hole structure, and a direction of an outlet of the collecting mask is substantially different from a direction of the opening on the second structural layer.

Abstract: An airflow adjustment device is disclosed. The airflow adjustment device is used for a blade server provided for plugging in an interface card, and the interface card includes a bracket. The airflow adjustment device is installed in the blade server, and the airflow adjustment device includes a top cover, a plurality of sidewalls, a bracket plate, and at least one deflector. The bracket plate is used for sheltering the bracket, and air enters the blade server through the at least one deflector and at least one gap area formed by the bracket plate and at least one of the plurality of sidewalls whereby the flow resistance of the blade server is not affected by the type of the bracket.

Abstract: A fan control system, a computer system, and a fan controlling method thereof are disclosed. The fan control system is used in the computer system for controlling a fan device. The fan controlling method includes the following steps: obtaining a temperature value of the computer system; determining whether the temperature value of the computer system is larger than or equal to a predetermined temperature value; if yes, controlling a rotation speed of the fan device according to the temperature value; if no, further obtaining a current value via a heat generating electronic component of the computer system; determining whether the current value of the computer system is larger than or equal to a predetermined current value; and if yes, changing the rotation speed of the fan device according to a variation of the current value.

Abstract: A heat dissipating module includes a heat dissipating member and an air flow guiding mechanism. The air flow guiding mechanism includes a base, an air guiding plate and a stopping structure. The base is disposed on a side of the heat dissipating member, and the air guiding plate is pivoted to the base. The stopping structure is disposed on the base. A side of the stopping structure abuts against the air guiding plate, so as to allow the air guiding plate to rotate in a first direction and to stop the air guiding plate from rotating in a second direction opposite to the first direction.

Abstract: A heat dissipating module having enhanced heat dissipating efficiency is disclosed. The heat dissipating module includes a heat dissipating member, a base and an air guiding member. The heat dissipating member is installed on a first electronic component for dissipating heat generated by the first electronic component. The base is installed on a side of the heat dissipating member, and the air guiding member is connected to the base. The air guiding member and the base cooperatively guide an air flow passing through the heat dissipating member to a second electronic component located on a side of the first electronic component.

Abstract: The present invention discloses a fan control device for controlling a fan. The fan control device includes a barometer, for measuring an atmospheric pressure of an operating environment of the fan, and a maximum rotating speed setting unit, for setting a maximum operable rotating speed of the fan according to the atmospheric pressure.

Abstract: By using a base in cooperation with a moving board, a first flowing area formed by a plurality of openings on the base may be partially blocked by the moving board moving relative to the base, thereby forming a second flowing area that provides different flow resistances. The flow resistance of an adjustable flow resistance device can be adjusted easily and dynamically, without replacing to another device. The flow resistance of the device may also be adjusted to various predefined default settings precisely and speedily by further applying a positioning mechanism that utilizes various predefined positioning holes or a rotary element.

Abstract: An airflow adjustment device is disclosed. The airflow adjustment device is used for a blade server provided for plugging in an interface card, and the interface card includes a bracket. The airflow adjustment device is installed in the blade server, and the airflow adjustment device includes a top cover, a plurality of sidewalls, a bracket plate, and at least one deflector. The bracket plate is used for sheltering the bracket, and air enters the blade server through the at least one deflector and at least one gap area formed by the bracket plate and at least one of the plurality of sidewalls whereby the flow resistance of the blade server is not affected by the type of the bracket.

Abstract: By using a base in cooperation with a moving board, a first flowing area formed by a plurality of openings on the base may be partially blocked by the moving board moving relative to the base, thereby forming a second flowing area that provides different flow resistances. The flow resistance of an adjustable flow resistance device can be adjusted easily and dynamically, without replacing to another device. The flow resistance of the device may also be adjusted to various predefined default settings precisely and speedily by further applying a positioning mechanism that utilizes various predefined positioning holes or a rotary element.

Abstract: A heat dissipating device includes a supporting component installed on a circuit board. A plurality of openings is formed on the supporting component. The heat dissipating device further includes a plurality of heat dissipating components disposed on a side of the supporting component and installed inside the plurality of openings respectively for dissipating heat generated by a plurality of heat sources disposed on the other side of the supporting component. The heat dissipating device further includes a plurality of elastic components for pressing the plurality of heat dissipating components so that the plurality of heat dissipating components contacts the plurality of heat sources closely.

Abstract: A heat dissipating mechanism includes a housing. A hollow space is formed inside the housing. The heat dissipating mechanism further includes an airflow guiding structure installed inside the hollow space for separating the hollow space into a first channel and a second channel. An inlet and an outlet are formed on the airflow guiding structure. Airflow enters the first channel via the inlet and jets out of the outlet for mixing with thermal current generated by a heat source in the second channel.