Abstract: A method for forming a semiconductor package is provided. The method includes forming a first alignment mark in a first substrate of a first wafer and forming a first bonding structure over the first substrate. The method also includes forming a second bonding structure over a second substrate of a second wafer and trimming the second substrate, so that a first width of the first substrate is greater than a second width of the second substrate. The method further includes attaching the second wafer to the first wafer via the first bonding structure and the second bonding structure, thinning the second wafer until a through-substrate via in the second substrate is exposed, and performing a photolithography process on the second wafer using the first alignment mark.

Abstract: Disclosed are a supplementary bushing, a test probe, and a supplementary testing device. The supplementary bushing has a closed end, an open end, a receiving groove, and at least one first fixing portion. The closed end has a first contact, and the receiving groove is concavely formed from an open end towards the closed end. The first fixing portion is disposed on an inner surface of the receiving groove. The test probe is installed in the receiving hole of a base of the supplementary testing device and has a testing end and a connecting end. The testing end has a second contact, a second fixing portion and a stop portion.

Abstract: A test pin contact buffer, fixed to a test pin base, is a sheet-like structure made of a composite material including a conductive material and an insulating material, and defines at least one contact area corresponding to at least one test pin of the test pin base. The contact area has at least one cutout hole, an insulating deformation structure and a conductive head structure. The insulating deformation structure is extendable and made of the insulating material and extends outward from the conductive head structure. The cutout hole enables the contact area to be in a partial hollow state, which is beneficial for deformation of the insulating deformation structure. The test pin can be used for performing measurement in an indirect manner, reducing the wear of the test pin, prolonging the service life, and improving the measurement speed and efficiency.

Abstract: A bobbin structure of a transformer includes a winding frame. The winding frame includes a first winding section, two second winding sections formed on two sides of the first winding section and a channel penetrating the first winding section and the second winding sections. At least one slot is disposed on each second winding section. Thereby, the assembly process of the bobbin structure of the transformer is simplified and the assembly time is reduced.

Abstract: The present invention is related to an inductor, which includes winding set, a magnetic core, and an auxiliary magnetic core. The magnetic core includes a winding part and two opposite end-surfaces. The auxiliary magnetic core including a top surface is attached on one of the end surface and faces the other end surface so as to form an air gap therebetween. The permeability of the auxiliary magnetic core is smaller than that of the magnetic core. The winding is wound around the winding part, the air gap, and the auxiliary magnetic core. The auxiliary magnetic core achieves magnetic saturation before that of the magnetic core when current flowing through the winding set is increased, which reduces current variation per unit time of the inductor.