Abstract: A package structure including a semiconductor die, a redistribution circuit structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution circuit structure includes a colored dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the inter-dielectric layers. The electronic device is disposed over the colored dielectric layer and electrically connected to the redistribution circuit structure.

Abstract: A method and apparatus for dispensing a resist solution used in a semiconductor device manufacturing process senses the presence of air bubbles in the solution during delivery through a line feeding a dispensing pump. Air bubbles in the line are sensed by an optical photocoupler that senses changes in the intensity of light refracted through the solution caused by air bubbles entrapped in the solution. The sensor produces an air bubble indicating signal that can be used to activate an alarm or to stop the dispensing process.

Abstract: The present invention discloses a method and apparatus for eliminating air bubbles from a liquid dispensing line by utilizing an air bubble tank positioned and connected in fluid communication between a liquid reservoir and an electric pump for feeding the liquid. The air bubble tank cumulates air bubbles in an upper portion of the tank cavity and allows a liquid flow which is substantially free of air bubbles to be outputted from an outlet positioned adjacent to the bottom of the tank to a process machine, while the air bubbles are exhausted out of the tank on a predetermined frequency.