Abstract: A cleaning process of wafer polishing pad, the process includes providing a wafer polishing pad, performing a planarization process with the wafer polishing pad, leaving a residue on the wafer polishing pad after the planarization process, and performing a cleaning step with a cleaning nozzle to remove the residue, the cleaning nozzle comprises at least one Y-shaped pipe, one end of which is a water outlet, and the other two ends are respectively a water inlet and an air inlet, wherein a cleaning liquid flows from the water inlet to the water outlet, and a pressurized gas flows in from the air inlet.

Abstract: A process for making a golf ball includes steps of: a) providing a spherical hollow core which is made from a deformable resilient material, which defines a central chamber, and which includes left and right hemispherical bodies with contiguous circular surfaces having separated upper segments movable away from each other to permit placement of a sensing assembly into the central chamber, b) molding an intermediate shell layer at an elevated temperature that is lower than a softening point of the deformable resilient material to enclose the spherical hollow core, and c) molding a cover to enclose the intermediate shell layer.

Abstract: A method for making a golf ball includes: wrapping a sensing module with a polymeric band to produce a spherical core in which the sensing module is entirely enclosed by the polymeric band; molding a molding material to form an intermediate layer that surrounds the spherical core, wherein the polymeric band acts as a barrier to prevent the molding material from intruding into the sensing module through the polymeric band; and molding a shell to surround the intermediate layer. A golf ball is also provided, and includes a spherical core, an intermediate layer surrounding the spherical core, and a shell surrounding the intermediate layer. The spherical core includes a sensing module, and a polymeric band wrapped around and entirely enclosing the sensing module.

Abstract: A cold plate including a cold wall, a first cavity, a first pipe, a second cavity, an expansion unit and a second pipe is provided. The first cavity covers on the cold wall to form a first fluid space, and the first pipe is connected with the first cavity. The second cavity is disposed inside the first cavity and covers on the cold wall to form a second fluid space. The expansion unit is disposed between the second cavity and the cold wall to interconnect the first fluid space and the second fluid space. The second pipe is disposed inside the first pipe and connected with the second cavity. Besides, a refrigeration system including the cold plate mentioned above is also provided.

Abstract: A cold plate including a cold wall, a first cavity, a first pipe, a second cavity, an expansion unit and a second pipe is provided. The first cavity covers on the cold wall to form a first fluid space, and the first pipe is connected with the first cavity. The second cavity is disposed inside the first cavity and covers on the cold wall to form a second fluid space. The expansion unit is disposed between the second cavity and the cold wall to interconnect the first fluid space and the second fluid space. The second pipe is disposed inside the first pipe and connected with the second cavity. Besides, a refrigeration system including the cold plate mentioned above is also provided.