Patents by Inventor Shih-Ju Lo

Shih-Ju Lo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11934027
    Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.
    Type: Grant
    Filed: June 21, 2022
    Date of Patent: March 19, 2024
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Chang Hu, Chih-Wei Weng, Chia-Che Wu, Chien-Yu Kao, Hsiao-Hsin Hu, He-Ling Chang, Chao-Hsi Wang, Chen-Hsien Fan, Che-Wei Chang, Mao-Gen Jian, Sung-Mao Tsai, Wei-Jhe Shen, Yung-Ping Yang, Sin-Hong Lin, Tzu-Yu Chang, Sin-Jhong Song, Shang-Yu Hsu, Meng-Ting Lin, Shih-Wei Hung, Yu-Huai Liao, Mao-Kuo Hsu, Hsueh-Ju Lu, Ching-Chieh Huang, Chih-Wen Chiang, Yu-Chiao Lo, Ying-Jen Wang, Shu-Shan Chen, Che-Hsiang Chiu
  • Publication number: 20150029723
    Abstract: The disclosure provides a light-emitting diode (LED) package structure, including: a lead frame; at least two light-emitting diode chips having different light-emitting wavelengths disposed on the lead frame; an encapsulant disposed over the lead frame and covering the light-emitting diode chips, wherein the encapsulant has a first concave portion; and an optical glue disposed in the first concave portion, wherein the optical glue has a plurality of scattering particles to uniformly mix the lights of different wavelengths emitted by the light-emitting diode chips.
    Type: Application
    Filed: April 11, 2014
    Publication date: January 29, 2015
    Applicant: LEXTAR ELECTRONICS CORPORATION
    Inventors: Shih-Ju Lo, Cheng-Ping Chang, Hui-Kai Hsu, I-Chun Lee, Wen-Kai Shao
  • Patent number: D697876
    Type: Grant
    Filed: May 10, 2013
    Date of Patent: January 21, 2014
    Assignee: Lextar Electronics Corp.
    Inventors: Hui-Kai Hsu, Che-Ming Hsu, Shih-Ju Lo, Kuan-Hao Chen
  • Patent number: D697877
    Type: Grant
    Filed: May 10, 2013
    Date of Patent: January 21, 2014
    Assignee: Lextar Electronics Corp.
    Inventors: Hui-Kai Hsu, Che-Ming Hsu, Shih-Ju Lo, Kuan-Hao Chen
  • Patent number: D718726
    Type: Grant
    Filed: November 15, 2013
    Date of Patent: December 2, 2014
    Assignee: Lextar Electronics Corporation
    Inventors: Shih-Ju Lo, Che-Ming Hsu, Lei-Hsin Liu, Yue-Ying Su, Hui-Kai Hsu
  • Patent number: D719111
    Type: Grant
    Filed: November 15, 2013
    Date of Patent: December 9, 2014
    Assignee: Lextar Electronics Corporation
    Inventors: Shih-Ju Lo, Che-Ming Hsu, Lei-Hsin Liu, Yue-Ying Su, Hui-Kai Hsu