Patents by Inventor Shih-Ju Wang

Shih-Ju Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9384651
    Abstract: Disclosed herein is a clinical information management system that includes a nurses station server, a plurality of pressure sensing pads, a wireless router, a system terminal equipment and a mobile device. The sensing pads are distributed to beds, and each sensing pad is connected to a wireless control box. The wireless router receives a pressure-sensing signal from the wireless control box and transmits the pressure-sensing signal to the nurses station server. The system terminal equipment is connected with the nurses station server via the Internet and receives the pressure-sensing signal transmitted from the nurses station server. The mobile device receives the pressure-sensing signal from the nurses station server or the system terminal equipment.
    Type: Grant
    Filed: June 26, 2014
    Date of Patent: July 5, 2016
    Assignee: MedicusTek Inc.
    Inventors: Chia-Ming Hsu, Ling-Hsuan Liu, Shih-Ju Wang, Lavina Che-Hsuan Thong, Han-Wen Tso, Sung-Ho Huang, Mark Daniel Anderson
  • Patent number: 9079272
    Abstract: A solder joint with a multilayer IMC structure is provided. The solder joint includes a Cu pad, a Sn-based solder, a first, a second, and a third IMC layer. The Cu pad is disposed opposite to the Sn-based solder. The first IMC layer is disposed between the Cu pad and the Sn-based solder. The first IMC layer is a Cu3Sn layer. The second IMC layer is disposed between the first IMC layer and the Sn-based solder. The second IMC layer is a (Cu1-x1-y1Nix1Pdy1)6Sn5 layer, wherein x1 is in the range between 0 and 0.15, and y1 is in the range between 0 and 0.02. The third IMC layer is disposed between the second IMC layer and the Sn-based solder. The third IMC layer is a (Cu1-x2-y2Nix2Pdy2)6Sn5 layer, wherein x2 is in the range between 0 and 0.4, y2 is in the range between 0 and 0.02, and x2>x1.
    Type: Grant
    Filed: February 27, 2013
    Date of Patent: July 14, 2015
    Assignee: Yuan Ze University
    Inventors: Cheng-En Ho, Shih-Ju Wang, Yu-Hui Wu
  • Publication number: 20150170494
    Abstract: Disclosed herein is a clinical information management system that includes a nurses station server, a plurality of pressure sensing pads, a wireless router, a system terminal equipment and a mobile device. The sensing pads are distributed to beds, and each sensing pad is connected to a wireless control box. The wireless router receives a pressure-sensing signal from the wireless control box and transmits the pressure-sensing signal to the nurses station server. The system terminal equipment is connected with the nurses station server via the Internet and receives the pressure-sensing signal transmitted from the nurses station server. The mobile device receives the pressure-sensing signal from the nurses station server or the system terminal equipment.
    Type: Application
    Filed: June 26, 2014
    Publication date: June 18, 2015
    Inventors: Chia-Ming HSU, Ling-Hsuan LIU, Shih-Ju WANG, Lavina Che-Hsuan THONG, Han-Wen TSO, Sung-Ho HUANG, Mark Daniel Anderson
  • Publication number: 20140126955
    Abstract: A solder joint with a multilayer IMC structure is provided. The solder joint includes a Cu pad, a Sn-based solder, a first, a second, and a third IMC layer. The Cu pad is disposed opposite to the Sn-based solder. The first IMC layer is disposed between the Cu pad and the Sn-based solder. The first IMC layer is a Cu3Sn layer. The second IMC layer is disposed between the first IMC layer and the Sn-based solder. The second IMC layer is a (Cu1-x1-y1Nix1Pdy1)6Sn5 layer, wherein x1 is in the range between 0 and 0.15, and y1 is in the range between 0 and 0.02. The third IMC layer is disposed between the second IMC layer and the Sn-based solder. The third IMC layer is a (Cu1-x2-y2Nix2Pdy2)6Sn5 layer, wherein x2 is in the range between 0 and 0.4, y2 is in the range between 0 and 0.02, and x2>x1.
    Type: Application
    Filed: February 27, 2013
    Publication date: May 8, 2014
    Applicant: YUAN ZE UNIVERSITY
    Inventors: Cheng-En Ho, Shih-Ju Wang, Yu-Hui Wu
  • Patent number: D877243
    Type: Grant
    Filed: October 5, 2018
    Date of Patent: March 3, 2020
    Assignee: SCENARIO LAB CO., LTD.
    Inventors: Der-Jang Yu, Wen-Chi Lin, Shih-Ju Wang