Patents by Inventor Shih-Kun Chen

Shih-Kun Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7271102
    Abstract: A method of etching a silicon layer to avoid non-uniformity. First, a patterned silicon layer is provided. Next, an etching buffer layer is conformally formed on the surface and the top layer of the patterned silicon layer. Finally, the etching buffer layer and the patterned silicon layer are etched until the thickness of the patterned silicon layer is reduced. The conformal oxide layer provides etching resistance as an etching buffer layer, such that the etching rate is uniform on the whole subject matter, thereby, reducing the thickness of the patterned silicon layer uniformly after etching.
    Type: Grant
    Filed: June 20, 2003
    Date of Patent: September 18, 2007
    Assignee: AU Optronics Corporation
    Inventors: Chien-Chou Hou, Ching-Te Huang, Li-Wei Hwang, Shih-Kun Chen
  • Publication number: 20070151427
    Abstract: A hand tool includes a retractable handle which includes a stationary section and a movable section movably mounted to the stationary section. The stationary section has an elongate slot and a plurality of dimples are defined in an inside of the elongate slot. The movable section has a connection end and a through hole. A bead is movably engaged with the through hole and can be engaged with one of the dimples. A collar is rotatably mounted to the connection end and a concavity is defined in an inner periphery of the collar. When the bead is received in the concavity and one of the dimples, the movable section is able to be moved relative to the stationary section to adjust the length of the handle. The movable section is secured when rotating the collar to press the bead by the inner periphery of the collar.
    Type: Application
    Filed: December 29, 2005
    Publication date: July 5, 2007
    Inventors: Shih-Kun Chen, Jen-Kai Li
  • Publication number: 20060065078
    Abstract: A ratchet tool includes an engaging member rotatably received in a hole in the head of the tool and a ratchet mechanism is received in a recess in the head. A lip extends inward from the inner periphery of the hole and the engaging member has a neck extending from one of two sides thereof. A C-shaped clip is connected to the neck. The neck includes an annular recessed plane and a second groove. A spring member is engaged with the annular recessed plane surface and has wave-shaped side profile which includes peak portions in opposite directions. The peak portions are respectively in contact with the lip and an inside of the recessed plane surface. The neck of the engaging member is pushed out from the hole when the spring member is compressed by pushing the engaging member.
    Type: Application
    Filed: September 28, 2004
    Publication date: March 30, 2006
    Inventors: Shih-Kun Chen, Fu-Tsai Lee
  • Publication number: 20050257649
    Abstract: A ratchet wrench having a switch structure that is stable to apply and easy to manufacture. It comprises a socket box, the ratchet receptacle and the switch receptacle formed within the box end of the handle of the wrench, respectively for housing a tool socket, a ratchet piece and a switch member. The switch structure thereby formed is used to restrict the rotational direction of a tool socket locked in the socket box. The switch member comprises an upright column, which is sandwiched between the bottom surface of the box end and a retaining plate, and a switch handle for driving the rotation of the upright column. The coupled motion of the switch handle and the upright column is stable and the parts are easy to make.
    Type: Application
    Filed: May 24, 2004
    Publication date: November 24, 2005
    Inventor: Shih-Kun Chen
  • Publication number: 20040106286
    Abstract: A method of etching a silicon layer to avoid non-uniformity. First, a patterned silicon layer is provided. Next, an etching buffer layer is conformally formed on the surface and the top layer of the patterned silicon layer. Finally, the etching buffer layer and the patterned silicon layer are etched until the thickness of the patterned silicon layer is reduced. The conformal oxide layer provides etching resistance as an etching buffer layer, such that the etching rate is uniform on the whole subject matter, thereby, reducing the thickness of the patterned silicon layer uniformly after etching.
    Type: Application
    Filed: June 20, 2003
    Publication date: June 3, 2004
    Applicant: AU Optronics Corp.
    Inventors: Chien-Chou Hou, Ching-Te Huang, Li-Wei Hwang, Shih-Kun Chen
  • Patent number: D515373
    Type: Grant
    Filed: July 15, 2004
    Date of Patent: February 21, 2006
    Inventor: Shih-Kun Chen