Patents by Inventor Shih-Li Chen

Shih-Li Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190204255
    Abstract: A method and a device for detection of metal and non-metal particle concentration of an electrical discharge machining liquid are disclosed. The method comprises steps of: (A) filling a tank with the electrical discharge machining liquid, wherein the tank comprises a tank wall, a first conductor, and a second conductor; (B) measuring a voltage between the first conductor and the second conductor by an electronic device, wherein the electronic device electrically connects to the first conductor and the second conductor, and the electronic device comprises a capacitance detection circuit; and (C) calculating a particle concentration or an equivalent dielectric constant of the electrical discharge machining liquid on the basis of the measured voltage.
    Type: Application
    Filed: February 13, 2018
    Publication date: July 4, 2019
    Inventors: Shih-Jui CHEN, Dong-Lin CHUANG, Biing-Hwa YAN, Yean-Ren HWANG, Yi-Li CHEN
  • Publication number: 20190176194
    Abstract: The present application discloses a microtome. The microtome includes: a blade cutting a soft material in a first direction, the first direction being a feeding direction of the soft material; a blade holder holding the blade; an actuator providing a vibration in a second direction along a cutting edge of the blade; and a frequency-tunable resonator driven by the actuator into vibration and fixedly connected to the blade holder to transfer the vibration to the blade holder and the blade, the resonator having a tunable resonant frequency in the second direction.
    Type: Application
    Filed: December 11, 2017
    Publication date: June 13, 2019
    Inventors: Shih-Chi CHEN, Ji WANG, Chenglin LI
  • Patent number: 7985626
    Abstract: A manufacturing method of placing dice for a wafer level package comprises placing a plurality of dice on an elastic material, which is formed on a first base, and the elastic material of the present invention has viscosity in a first condition to adhere the plurality of dice; forming an adhesive material on a second base; adhering the plurality of dice on the adhesive material of the second base; and stripping the plurality of dice from the elastic material in a second condition.
    Type: Grant
    Filed: June 20, 2005
    Date of Patent: July 26, 2011
    Assignee: Advanced Chip Engineering Technology Inc.
    Inventors: Wen-Kun Yang, Wen-Pin Yang, Shih-li Chen
  • Patent number: 7667318
    Abstract: To pick and place standard dies on a new base for obtaining an appropriate and wider distance between dies than the original distance of dies on a wafer. The package structure has a larger size of balls array than the size of the die by fan out type package. Moreover, the die may be packaged with passive components or other dies with a side by side structure or a stacking structure.
    Type: Grant
    Filed: October 22, 2008
    Date of Patent: February 23, 2010
    Assignee: Advanced Chip Engineering Technology Inc.
    Inventors: Wen-Kun Yang, Wen-Pin Yang, Shih-Li Chen
  • Patent number: 7557437
    Abstract: To pick and place standard dice on a new base for obtaining an appropriate and wider distance between dice than the original distance of dice on a wafer. The package structure has a larger size of balls array than the size of the die by fan out type package. Moreover, the die may be packaged with passive components or other dice with a side by side structure or a stacking structure.
    Type: Grant
    Filed: November 28, 2007
    Date of Patent: July 7, 2009
    Assignee: Advanced Chip Engineering Technology Inc.
    Inventors: Wen-Kun Yang, Wen-Pin Yang, Shih-Li Chen
  • Publication number: 20090051025
    Abstract: To pick and place standard dies on a new base for obtaining an appropriate and wider distance between dies than the original distance of dies on a wafer. The package structure has a larger size of balls array than the size of the die by fan out type package. Moreover, the die may be packaged with passive components or other dies with a side by side structure or a stacking structure.
    Type: Application
    Filed: October 22, 2008
    Publication date: February 26, 2009
    Inventors: Wen-Kun Yang, Wen-Pin Yang, Shih-Li Chen
  • Patent number: 7459781
    Abstract: To pick and place standard dies on a new base for obtaining an appropriate and wider distance between dies than the original distance of dies on a wafer. The package structure has a larger size of balls array than the size of the die by fan out type package. Moreover, the die may be packaged with passive components or other dies with a side by side structure or a stacking structure.
    Type: Grant
    Filed: December 3, 2003
    Date of Patent: December 2, 2008
    Inventors: Wen-Kun Yang, Wen-Pin Yang, Shih-Li Chen
  • Publication number: 20080105967
    Abstract: To pick and place standard dice on a new base for obtaining an appropriate and wider distance between dice than the original distance of dice on a wafer. The package structure has a larger size of balls array than the size of the die by fan out type package. Moreover, the die may be packaged with passive components or other dice with a side by side structure or a stacking structure.
    Type: Application
    Filed: November 28, 2007
    Publication date: May 8, 2008
    Inventors: Wen-Kun Yang, Wen-Pin Yang, Shih-Li Chen
  • Patent number: 7262081
    Abstract: To pick and place standard dies on a new base for obtaining an appropriate and wider distance between dies than the original distance of dies on a wafer. The package structure has a larger size of balls array than the size of the die by fan out type package. Moreover, the die may be packaged with passive components or other dies with a side by side structure or a stacking structure.
    Type: Grant
    Filed: June 30, 2005
    Date of Patent: August 28, 2007
    Inventors: Wen-Kun Yang, Wen-Pin Yang, Shih-Li Chen
  • Patent number: 7224061
    Abstract: A package structure including a device, an interconnecting element, a pad and a protecting element is provided. The device connects with a first end of the interconnecting element through the pad. The protecting element covers the pad and the first end of the interconnecting element.
    Type: Grant
    Filed: August 16, 2004
    Date of Patent: May 29, 2007
    Assignee: Advanced Chip Engineering Technology Inc.
    Inventors: Wen-Kun Yang, Shih-Li Chen, Wen-Bin Sun, Ming-Hui Lin, Chao-Nan Chou, Chih-Wei Lin
  • Patent number: 7196408
    Abstract: To pick and place standard dies on a new base for obtaining an appropriate and wider distance between dies than the original distance of dies on a wafer. The package structure has a larger size of balls array than the size of the die by fan out type package. Moreover, the die may be packaged with passive components or other dies with a side by side structure or a stacking structure.
    Type: Grant
    Filed: December 12, 2005
    Date of Patent: March 27, 2007
    Inventors: Wen-Kun Yang, Wen-Pin Yang, Shih-Li Chen
  • Publication number: 20070059866
    Abstract: To pick and place standard dies on a new base for obtaining an appropriate and wider distance between dies than the original distance of dies on a wafer. The package structure has a larger size of balls array than the size of the die by fan out type package. Moreover, the die may be packaged with passive components or other dies with a side by side structure or a stacking structure.
    Type: Application
    Filed: November 13, 2006
    Publication date: March 15, 2007
    Applicant: ADVANCED CHIP ENGINEERING TECHNOLOGY INC.
    Inventors: Wen-Kun Yang, Wen-Pin Yang, Shih-Li Chen
  • Publication number: 20060091514
    Abstract: To pick and place standard dies on a new base for obtaining an appropriate and wider distance between dies than the original distance of dies on a wafer. The package structure has a larger size of balls array than the size of the die by fan out type package. Moreover, the die may be packaged with passive components or other dies with a side by side structure or a stacking structure.
    Type: Application
    Filed: December 12, 2005
    Publication date: May 4, 2006
    Inventors: Wen-Kun Yang, Wen-Pin Yang, Shih-Li Chen
  • Publication number: 20060033196
    Abstract: A package structure including a device, an interconnecting element, a pad and a protecting element is provided. The device connects with a first end of the interconnecting element through the pad. The protecting element covers the pad and the first end of the interconnecting element.
    Type: Application
    Filed: August 16, 2004
    Publication date: February 16, 2006
    Inventors: Wen-Kun Yang, Shih-Li Chen, Wen-Bin Sun, Ming-Hui Lin, Chao-Nan Chou, Chih-Wei Lin
  • Publication number: 20050247398
    Abstract: A tool of wafer level package comprises a first base, an elastic material and a second base. The elastic material is coated on the first base, and the elastic material has viscosity in common state to adhere a plurality of dies. The second base is coated by adhesive material to adhere the dies. The plurality of dies are departed from the elastic material by a special environment after adhering.
    Type: Application
    Filed: June 20, 2005
    Publication date: November 10, 2005
    Applicant: Advanced Chip Engineering Technology Inc.
    Inventors: Wen Yang, Wen Yang, Shih-li Chen
  • Publication number: 20050249945
    Abstract: A tool of wafer level package comprises a first base, an elastic material and a second base. The elastic material is coated on the first base, and the elastic material has viscosity in common state to adhere a plurality of dies. The second base is coated by adhesive material to adhere the dies. The plurality of dies are departed from the elastic material by a special environment after adhering.
    Type: Application
    Filed: May 10, 2004
    Publication date: November 10, 2005
    Inventors: Wen Kun Yang, Wen Ping Yang, Shih Li Chen
  • Publication number: 20050236696
    Abstract: To pick and place standard dies on a new base for obtaining an appropriate and wider distance between dies than the original distance of dies on a wafer. The package structure has a larger size of balls array than the size of the die by fan out type package. Moreover, the die may be packaged with passive components or other dies with a side by side structure or a stacking structure .
    Type: Application
    Filed: June 30, 2005
    Publication date: October 27, 2005
    Inventors: Wen-Kun Yang, Wen-Pin Yang, Shih-Li Chen
  • Publication number: 20050124093
    Abstract: To pick and place standard dies on a new base for obtaining an appropriate and wider distance between dies than the original distance of dies on a wafer. The package structure has a larger size of balls array than the size of the die by fan out type package. Moreover, the die may be packaged with passive components or other dies with a side by side structure or a stacking structure.
    Type: Application
    Filed: December 3, 2003
    Publication date: June 9, 2005
    Inventors: Wen-Kun Yang, Wen-Pin Yang, Shih-Li Chen
  • Patent number: 6236567
    Abstract: An electronic device package with enhanced heat dissipation effect comprises a lead frame and an outer frame with electrically insulating surface. The outer frame encloses the electronic device with a predetermined gap therebetween. The lead frame has a plurality of inner leads extending to the upper surface of the electronic device and a plurality of outer leads enclosing the outer surface of the outer frame. Each inner lead and each outer lead are linked by a slanting portion. The plurality of outer leads includes at least one ground outer lead with larger cross section area than other outer leads. Therefore, the heat generated by the electronic device can be conducted outside through the ground outer lead when the ground outer lead is connected to other device.
    Type: Grant
    Filed: December 3, 1999
    Date of Patent: May 22, 2001
    Assignee: Caesar Technology Inc.
    Inventor: Shih-Li Chen
  • Patent number: 6096250
    Abstract: A process for releasing a runner or gate from an electronic device on a laminate plate after molding process is included. The area of the laminate plate designed to be covered with molding compound is cleaned in advance by appropriate physical and chemical process to enhance the adhesion property, and the area to be covered by the runner or gate is protected from the cleaning process to maintain the original property of low adhesion to the laminate plate. The runner or gate can be easily released from the laminate plate without damage to the molding compound after the molding process, and the yield of the electronic device is increased.
    Type: Grant
    Filed: March 6, 1998
    Date of Patent: August 1, 2000
    Assignee: Caesar International, Inc.
    Inventor: Shih-Li Chen