Abstract: A panel structure including a stretchable substrate, a first flexible layer, a circuit layer, multiple light-emitting elements, a filler layer, a second flexible layer, and an element layer is disclosed. The first flexible layer includes multiple pixel islands, and the pixel islands are defined by multiple through holes. Each of the through holes passes through the first flexible layer, the filler layer, and the second flexible layer. The display structure has good continuity in structure, and optical performance of the display structure is good. A manufacturing method of a panel structure is also disclosed.

Abstract: Systems and methods of generating a security key for an integrated circuit device include generating a plurality of key bits with a physically unclonable function (PUF) device. The PUF can include a random number generator that can create random bits. The random bits may be stored in a nonvolatile memory. The number of random bits stored in the nonvolatile memory allows for a plurality of challenge and response interactions to obtain a plurality of security keys from the PUF.

Abstract: A pipe plier structure includes a first body, a second body, a pivot member, and a locking member. The first body is provided with multiple first teeth, an arc line, an axis, a first vertical line, a radius, a first angle, and a second angle. The second body is provided with multiple second teeth, multiple third teeth, a second vertical line, a first connecting line, a second connecting line, a third angle, a fourth angle, a concave face, a fifth angle, a sixth angle, a seventh angle, and an eighth angle. The pivot member is assembled with the first body and the second body. The locking member is assembled with the first body and the second body. The locking member provides an elastically restoring force to the first body and the second body after the second body is extended outward relative to the first body.

Abstract: A humanized anti-neurotensin receptor 1 (NTSR1) antibody or an antigen-binding fragment thereof. Also, a method for treating, prophylactic treating and/or preventing diseases and/or disorders caused by or related to NTSR1 activity and/or signaling, and a method or kit for detecting NTSR1 in a sample.

Abstract: A humanized anti-neurotensin receptor 1 (NTSR1) antibody or an antigen-binding fragment thereof. Also, a method for treating, prophylactic treating and/or preventing diseases and/or disorders caused by or related to NTSR1 activity and/or signaling, and a method or kit for detecting NTSR1 in a sample.

Abstract: Systems and methods of generating a security key for an integrated circuit device include generating a plurality of key bits with a physically unclonable function (PUF) device. The PUF can include a random number generator that can create random bits. The random bits may be stored in a nonvolatile memory. The number of random bits stored in the nonvolatile memory allows for a plurality of challenge and response interactions to obtain a plurality of security keys from the PUF.

Abstract: An image sensor includes a group of sensor units, a color filter layer disposed within the group of sensor units, and a dielectric structure and a metasurface disposed corresponding to the color filter layer. The metasurface includes a plurality of peripheral nanoposts located at corners of the group of sensor units from top view, respectively, a central nanopost enclosed by the plurality of peripheral nanoposts, and a filling material laterally surrounding the plurality of peripheral nanoposts and the central nanopost. The central nanopost is offset from a center point of the group of sensor units by a distance from top view.

Abstract: An ambient light sensor includes a substrate, a metasurface disposed on the substrate, and an aperture layer disposed on the substrate. The metasurface includes a plurality of nanostructures and a filling layer laterally surrounding the plurality of nanostructures. The aperture layer laterally separates the metasurface into a plurality of sub-meta groups.

Abstract: An ambient light sensor includes a substrate, a metasurface disposed on the substrate, and an aperture layer disposed on the substrate. The metasurface includes a plurality of nanostructures and a filling layer laterally surrounding the plurality of nanostructures. The aperture layer laterally separates the metasurface into a plurality of sub-meta groups.

Abstract: A manufacturing method includes the following operations. A lens layer is formed above a substrate. A patterned hard mask layer is formed on the lens layer. The lens layer is etched to transfer a pattern of the patterned hard mask layer to the lens layer such that a plurality of lenses are defined, wherein the lens are micro-lenses or meta-surface lenses. A cladding layer is formed to cover the plurality of lenses and the substrate. Portions of the cladding layer are etched to form a first inclined sidewall and a second inclined sidewall, wherein the first inclined sidewall is above the second inclined sidewall, wherein a projection of the first inclined sidewall on the substrate is spaced apart from a projection of the second inclined sidewall on the substrate.

Abstract: A co-axial structure includes a substrate, a first conductive structure, a second conductive structure, and an insulating layer. The substrate includes a first surface. The first conductive structure includes a first circuit deposited on the first surface and a first via penetrating the substrate. The second conductive structure includes a second circuit deposited on the first surface and a second via penetrating the substrate. The first via and the second via extend along a first direction. The first circuit and the second circuit extend along a second direction, and the second direction is perpendicular to the first direction. The insulating layer is located between the first via and the second via. The insulating layer includes a filler. The first conductive structure and the second conductive structure are electrically insulated. The first circuit and the second circuit are coplanar.

Abstract: A pipe plier structure includes a first body, a second body, a pivot member, and a locking member. The first body is provided with multiple first teeth, an arc line, an axis, a first vertical line, a radius, a first angle, and a second angle. The second body is provided with multiple second teeth, multiple third teeth, a second vertical line, a first connecting line, a second connecting line, a third angle, a fourth angle, a concave face, a fifth angle, a sixth angle, a seventh angle, and an eighth angle. The pivot member is assembled with the first body and the second body. The locking member is assembled with the first body and the second body. The locking member provides an elastically restoring force to the first body and the second body after the second body is extended outward relative to the first body.

Abstract: Systems and methods of generating a security key for an integrated circuit device include generating a plurality of key bits with a physically unclonable function (PUF) device. The PUF can include a random number generator that can create random bits. The random bits may be stored in a nonvolatile memory. The number of random bits stored in the nonvolatile memory allows for a plurality of challenge and response interactions to obtain a plurality of security keys from the PUF.

Abstract: Systems and methods of generating a security key for an integrated circuit device include generating a plurality of key bits with a physically unclonable function (PUF) device. The PUF can include a random number generator that can create random bits. The random bits may be stored in a nonvolatile memory. The number of random bits stored in the nonvolatile memory allows for a plurality of challenge and response interactions to obtain a plurality of security keys from the PUF.

Abstract: A co-axial structure includes a substrate, a first conductive structure, a second conductive structure, and an insulating layer. The substrate includes a first surface. The first conductive structure includes a first circuit deposited on the first surface and a first via penetrating the substrate. The second conductive structure includes a second circuit deposited on the first surface and a second via penetrating the substrate. The first via and the second via extend along a first direction. The first circuit and the second circuit extend along a second direction, and the second direction is perpendicular to the first direction. The insulating layer is located between the first via and the second via. The insulating layer includes a filler. The first conductive structure and the second conductive structure are electrically insulated. The first circuit and the second circuit are coplanar.

Abstract: An optical filter and a method for forming the same are provided. The optical filter includes a substrate and a plurality of filter stacks formed on the substrate. Each of the plurality of filter stacks includes a higher-refractive-index layer, a medium-refractive-index layer, and a lower-refractive-index layer. The higher-refractive-index layer has a first refractive index of higher than 3.5. The medium-refractive-index layer is disposed on the higher-refractive-index layer. The medium-refractive-index layer has a second refractive index higher than 2.9 and lower than the first refractive index. The lower-refractive-index layer is disposed on the medium-refractive-index layer. The lower-refractive-index layer has a third refractive index lower than the second refractive index.

Abstract: A wiring board and a method of manufacturing the same are provided. The method includes the following steps. A substrate is provided. The substrate is perforated to form at least one through hole. A first conductive layer is integrally formed on a surface of the substrate and an inner wall of the through hole. An etch stop layer is formed on a portion of the first conductive layer on the surface of the substrate and another portion of the first conductive layer on the inner wall of the through hole. A second conductive layer is integrally formed on the etch stop layer and the first conductive layer on the inner wall of the through hole. A plug-hole column is formed by filling with a plugged-hole material in the through hole. The second conductive layer is removed. The etch stop layer is then removed.

Abstract: Systems and methods of generating a security key for an integrated circuit device include generating a plurality of key bits with a physically unclonable function (PUF) device. The PUF can include a random number generator that can create random bits. The random bits may be stored in a nonvolatile memory. The number of random bits stored in the nonvolatile memory allows for a plurality of challenge and response interactions to obtain a plurality of security keys from the PUF.

Abstract: A wiring board and a method of manufacturing the same are provided. The method includes the following steps. A substrate is provided. The substrate is perforated to form at least one through hole. A first conductive layer is integrally formed on a surface of the substrate and an inner wall of the through hole. An etch stop layer is formed on a portion of the first conductive layer on the surface of the substrate and another portion of the first conductive layer on the inner wall of the through hole. A second conductive layer is integrally formed on the etch stop layer and the first conductive layer on the inner wall of the through hole. A plug-hole column is formed by filling with a plugged-hole material in the through hole. The second conductive layer is removed. The etch stop layer is then removed.

Abstract: An optical filter and a method for forming the same are provided. The optical filter includes a substrate and a plurality of filter stacks formed on the substrate. Each of the plurality of filter stacks includes a higher-refractive-index layer, a medium-refractive-index layer, and a lower-refractive-index layer. The higher-refractive-index layer has a first refractive index of higher than 3.5. The medium-refractive-index layer is disposed on the higher-refractive-index layer. The medium-refractive-index layer has a second refractive index higher than 2.9 and lower than the first refractive index. The lower-refractive-index layer is disposed on the medium-refractive-index layer. The lower-refractive-index layer has a third refractive index lower than the second refractive index.