Abstract: An image sensor includes a group of sensor units, a color filter layer disposed within the group of sensor units, and a dielectric structure and a metasurface disposed corresponding to the color filter layer. The metasurface includes a plurality of peripheral nanoposts located at corners of the group of sensor units from top view, respectively, a central nanopost enclosed by the plurality of peripheral nanoposts, and a filling material laterally surrounding the plurality of peripheral nanoposts and the central nanopost. The central nanopost is offset from a center point of the group of sensor units by a distance from top view.

Abstract: An ambient light sensor includes a substrate, a metasurface disposed on the substrate, and an aperture layer disposed on the substrate. The metasurface includes a plurality of nanostructures and a filling layer laterally surrounding the plurality of nanostructures. The aperture layer laterally separates the metasurface into a plurality of sub-meta groups.

Abstract: An ambient light sensor includes a substrate, a metasurface disposed on the substrate, and an aperture layer disposed on the substrate. The metasurface includes a plurality of nanostructures and a filling layer laterally surrounding the plurality of nanostructures. The aperture layer laterally separates the metasurface into a plurality of sub-meta groups.

Abstract: A manufacturing method includes the following operations. A lens layer is formed above a substrate. A patterned hard mask layer is formed on the lens layer. The lens layer is etched to transfer a pattern of the patterned hard mask layer to the lens layer such that a plurality of lenses are defined, wherein the lens are micro-lenses or meta-surface lenses. A cladding layer is formed to cover the plurality of lenses and the substrate. Portions of the cladding layer are etched to form a first inclined sidewall and a second inclined sidewall, wherein the first inclined sidewall is above the second inclined sidewall, wherein a projection of the first inclined sidewall on the substrate is spaced apart from a projection of the second inclined sidewall on the substrate.

Abstract: An optical filter and a method for forming the same are provided. The optical filter includes a substrate and a plurality of filter stacks formed on the substrate. Each of the plurality of filter stacks includes a higher-refractive-index layer, a medium-refractive-index layer, and a lower-refractive-index layer. The higher-refractive-index layer has a first refractive index of higher than 3.5. The medium-refractive-index layer is disposed on the higher-refractive-index layer. The medium-refractive-index layer has a second refractive index higher than 2.9 and lower than the first refractive index. The lower-refractive-index layer is disposed on the medium-refractive-index layer. The lower-refractive-index layer has a third refractive index lower than the second refractive index.

Abstract: An optical filter and a method for forming the same are provided. The optical filter includes a substrate and a plurality of filter stacks formed on the substrate. Each of the plurality of filter stacks includes a higher-refractive-index layer, a medium-refractive-index layer, and a lower-refractive-index layer. The higher-refractive-index layer has a first refractive index of higher than 3.5. The medium-refractive-index layer is disposed on the higher-refractive-index layer. The medium-refractive-index layer has a second refractive index higher than 2.9 and lower than the first refractive index. The lower-refractive-index layer is disposed on the medium-refractive-index layer. The lower-refractive-index layer has a third refractive index lower than the second refractive index.

Abstract: A light-emitting diode apparatus includes a light-emitting diode, a first package layer provided over the light-emitting diode, and a second package layer provided over the first package layer. The first package layer is dosed with phosphor. The second package layer is not dosed with any phosphor. The second package layer is formed with a textured light-emitting surface.

Abstract: A method is disclosed for making a thin-film structure of a light-emitting device via nanoimprint. The method includes the steps of providing a light-emitting element, providing a film on the light-emitting element via spin coating precursor on the light-emitting element, forming a pattern on the film by nanoimprint; and curing the film. Thus, the precursor is transformed to the thin-film structure.

Abstract: The invention discloses a light-emitting diode having an optical film structure thereon. The light-emitting diode includes a substrate, a light-emitting laminated structure, and an optical film structure. The light-emitting laminated structure is formed on the substrate, and the optical film structure is formed on the light-emitting laminated structure. The optical film structure is made of a dielectric material and has a light output plane, wherein the light output plane has plural roughened structures thereon.

Abstract: The present invention is a measurement method of three-dimensional profiles and a reconstruction system thereof using subpixel localization with color gratings and picture-in-picture switching on a single display, wherein the measurement method includes: 1. Preparation step; 2. Projection step; 3. Image extraction step; 4. Image fine-tuning step; 5. Image processing step; and 6. Reconstruction step. The system includes: a projection apparatus, emitting a grating towards a workpiece under measurement, and forming a grating image on the workpiece under measurement, the contrast values of the plurality of grating stripes of the grating image being identical; a central processing unit, using the grating image and picture-in-picture of a display thereof to fine tune and reconstruct three-dimensional profiles of the workpiece under measurement. Thereby, the grating stripes have equal contrast for easier identification; the display has switchable picture-in-picture; and an adjustment module can adjust the grating.

Abstract: The present invention is a measurement method of three-dimensional profiles and a reconstruction system thereof using subpixel localization with color gratings and picture-in-picture switching on a single display, wherein the measurement method includes: 1. Preparation step; 2. Projection step; 3. Image extraction step; 4. Image fine-tuning step; 5. Image processing step; and 6. Reconstruction step. The system includes: a projection apparatus, emitting a grating towards a workpiece under measurement, and forming a grating image on the workpiece under measurement, the contrast values of the plurality of grating stripes of the grating image being identical; a central processing unit, using the grating image and picture-in-picture of a display thereof to fine tune and reconstruct three-dimensional profiles of the workpiece under measurement. Thereby, the grating stripes have equal contrast for easier identification; the display has switchable picture-in-picture; and an adjustment module can adjust the grating.