Patents by Inventor Shih-Long Wei

Shih-Long Wei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120064230
    Abstract: The steps of the present invention are as follows: (a) a detachable film is formed on both sides of a substrate, respectively; (b) a number of vias running through both sides of the detachable films are formed in the substrate; (c) the vias are filled with a conductive paste; (d) the detachable films are peeled off; (e) a metallic conductive layer is deposited on both sides of the substrate, respectively; (f) a specific mold pattern is formed on the metallic conductive layers, respectively, by a photolithographic process; (g) a metallic circuit layout layer is formed on the patterns, respectively, by an electrochemical process; and (h) the mold patterns and the metallic conductive layers are removed. As such, the substrate is not contaminated by the conductive paste. Further, by using deposition, metallic conductive layers are directly adhered to the substrate and, by using photolithography, layouts with small linewidth could be formed.
    Type: Application
    Filed: September 13, 2010
    Publication date: March 15, 2012
    Inventors: Shih-Long Wei, Sheng-Li Hsiao, Chien-Hung Ho, Hsiao-Chun Liu
  • Publication number: 20120001212
    Abstract: A light-emitting diode (LED) packaging structure and a substrate for the packaging structure are provided. The light-emitting diode packaging structure includes a metal substrate having a first surface and a second surface opposite to the first surface, and the first surface has a concave portion with a sidewall and a bottom, allowing an anode film to be formed on the metal substrate; a plurality of electrically conductive pads formed on the bottom of the concave portion; an optical treatment layer formed on the sidewall of the concave portion; and an LED die mounted on the bottom of the concave portion and electrically connected to the electrically conductive pads. Desired electrical insulating property between any two adjacent electrically conductive pads can be obtained by the anode film formed on the metal substrate, while a good thermal conductivity of the metal substrate is maintained.
    Type: Application
    Filed: August 20, 2010
    Publication date: January 5, 2012
    Applicant: VIKING TECH CORPORATION
    Inventors: Shih-Long Wei, Shen-Li Hsiao, Chien-Min Shao, Chien-Hung Ho
  • Publication number: 20120000066
    Abstract: An alloy resistor and a fabrication method thereof are provided. A fabrication method of an alloy resistor includes: providing an alloy sheet having a plurality of openings spacing apart from each other and going through the alloy sheet and a plurality of alloy resistor units located between any two adjacent openings, wherein each of the alloy resistor units has an insulating cover area and a plurality of electrode ends on both sides of the insulating cover area; forming an insulating layer on a surface of the insulating cover area of the alloy resistor units by an electrodeposition coating process; cutting the alloy along a connecting portion, so as to obtain separated alloy resistor units; and forming a conductive adhesion material on the electrode ends of the alloy resistor units. An alloy resistor having an insulating layer with a smooth surface can be obtained by performing an electrodeposition coating process.
    Type: Application
    Filed: September 1, 2010
    Publication date: January 5, 2012
    Applicant: VIKING TECH CORPORATION
    Inventors: Shih-Long Wei, Shen-Li Hsiao, Chien-Min Shao, Chien-Hung Ho
  • Patent number: 7640652
    Abstract: A method of making a current sensing chip resistor is composed of a resistor manufacturing process which is constituted by a pre-process and a post-process. In addition, a thin-film process is used for the resistor manufacturing process, and the aluminum nitride substrate is used in the thin-film, in association with a technique of flip chip structure of single-side manufacturing process, enabling the resistor to be provided with performances of a high power, a high precision, a high thermal conductivity, a low temperature coefficient, a low noise, and a saving of utilization space of PCB (Printed Circuit Board).
    Type: Grant
    Filed: February 8, 2007
    Date of Patent: January 5, 2010
    Assignee: Viking Tech Corporation
    Inventors: Shen-Li Hsiao, Shih-Long Wei
  • Publication number: 20080194057
    Abstract: A method of making a current sensing chip resistor is composed of a resistor manufacturing process which is constituted by a pre-process and a post-process. In addition, a thin-film process is used for the resistor manufacturing process, and the aluminum nitride substrate is used in the thin-film, in association with a technique of flip chip structure of single-side manufacturing process, enabling the resistor to be provided with performances of a high power, a high precision, a high thermal conductivity, a low temperature coefficient, a low noise, and a saving of utilization space of PCB (Printed Circuit Board).
    Type: Application
    Filed: February 8, 2007
    Publication date: August 14, 2008
    Inventors: Shen-Li Hsiao, Shih-Long Wei
  • Patent number: 5292624
    Abstract: A multilayer interconnection system is formed on a multilayer ceramic (MLC), or glass ceramic body, by screening a blanket layer of etchable conductive paste on the body, drying and firing the resistant paste layer, and delineating the circuit pattern in the blanket layer with lithographic and etching techniques. A dielectric layer with via openings is formed over the circuit pattern, and the via openings filled. The steps are repeated until the desired circuitry is fabricated. A top circuit pattern is formed by screening an etchable conductive paste on the top surface, drying and firing the paste, and delineating the pattern using photolithographic and etching techniques.
    Type: Grant
    Filed: September 14, 1992
    Date of Patent: March 8, 1994
    Assignee: International Technology Research Institute
    Inventor: Shih-Long Wei
  • Patent number: 5250394
    Abstract: The method involves a thick film paste that is screen printed over the circuit plane of the substrate in the desired circuit pattern. The thick film paste is dried and fired. A metallorganic conductive paste is screen printed on top of the thick film circuit pattern, then it is dried and fired. If the printed circuit covers the whole substrate, the metallorganic paste is screen printed over the whole substrate. Alternatively, if the printed circuit covers portions of the substrate, the metallorganic paste is screen printed only over those portions. If the linewidth of the desired circuits is less than 4 mils, then the circuits are defined by photolithography. Alternatively, if the desired linewidth is greater than 4 mils, the screen printing technology is sufficient to define the circuits.
    Type: Grant
    Filed: January 21, 1992
    Date of Patent: October 5, 1993
    Assignee: Industrial Technology Research Institute
    Inventor: Shih-Long Wei