Patents by Inventor Shih-Min Hsu

Shih-Min Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140376198
    Abstract: A panel device including a first panel, a second panel, a frame, and a binder is provided. The frame has a wrenchable structure. The first panel is between the second panel and the frame. The binder adheres the second panel to the frame. The second panel can be detached from the frame through the wrenchable structure.
    Type: Application
    Filed: November 27, 2013
    Publication date: December 25, 2014
    Applicant: Wistron Corporation
    Inventor: Shih-Min Hsu
  • Publication number: 20140069567
    Abstract: A flexible circuit with multiple independent mounting points can be mounted (soldered) to substrates by independently (and concurrently) positioning mounting points in x, y, and theta (angular rotation) with vacuum chucks. In one embodiment the vacuum chucks can be guided by computer aided vision to locate and match fiducials on the flex circuit with fiducials on the substrate. In one embodiment, hot bars can be used in a subsequent bonding operation to secure an adhesive coupling between the flexible circuits and the substrate.
    Type: Application
    Filed: September 10, 2012
    Publication date: March 13, 2014
    Applicant: Apple Inc.
    Inventors: Silvio GRESPAN, Shih-Min HSU, Heng-Hsi WU, Kuo-Hua SUNG
  • Publication number: 20140071417
    Abstract: Methods and devices for using liquid optically clear adhesives (LOCAs) are described. A method for detecting uncured LOCA between a first substrate and a second substrate is described. In addition, an improved method for curing a laminated stack up having LOCA between a first substrate and a second substrate is described. The method includes a pre-curing method involving variable exposure of the LOCA. In addition, an improved light emitting diode (LED) unit assembly for exposing a laminated stack up to ultraviolet (UV) light during a pre-curing process is described. A method for testing the LED unit assembly prior to a pre-curing process is described.
    Type: Application
    Filed: February 13, 2013
    Publication date: March 13, 2014
    Applicant: Apple Inc.
    Inventors: Silvio GRESPAN, Shih-Min HSU, Heng-Hsi WU, Kuo-Hua SUNG, Cyrus Y. LIU
  • Publication number: 20120324261
    Abstract: A USB 3.0 host with low power consumption includes a super speed circuit, a non-super speed circuit, and a control module. The super speed circuit is used for transmitting data at a first transmission speed. A default state of the super speed circuit is turning-off. The non-super speed circuit is used for transmitting data at a second transmission speed, a third transmission speed, or a fourth transmission speed. The first transmission speed is faster than the second transmission speed, the third transmission speed, and the fourth transmission speed. The control module is used for detecting whether a USB peripheral device is connected to the USB 3.0 host, and controlling turning-on and turning-off of the super speed circuit.
    Type: Application
    Filed: May 27, 2012
    Publication date: December 20, 2012
    Inventors: Chih-Hung Huang, Chien-Cheng Kuo, Shih-Min Hsu
  • Patent number: 5980266
    Abstract: A conductive strap device for establishing dual electrical paths with a person's body includes a coaxial fastener structure having a spring-loaded contact pin to provide a first electrical path and a conductive member arranged coaxially with and electrically insulated from the contact pin to provide a second electrical path.
    Type: Grant
    Filed: May 2, 1997
    Date of Patent: November 9, 1999
    Inventor: Shih-Min Hsu
  • Patent number: 5754389
    Abstract: A static electricity grounding strap for connecting a person to electrical ground comprising a clasp body having two clasping means to fasten a strap belt of conductive materials. In one embodiment of the present invention, the clasping means is made of non-conductive material. The electrical connection path is conducted via a single conductive plate from the strap belt, a fitting means and a grounding cord to ground. The conductive plate can also be divided into two conductive section separated by a non-conductive partition to provide a dual-loop grounding paths. In another embodiment, the clasping means is made of conductive materials and no additional conductive plates are needed.
    Type: Grant
    Filed: November 26, 1996
    Date of Patent: May 19, 1998
    Inventor: Shih-Min Hsu
  • Patent number: D579018
    Type: Grant
    Filed: July 25, 2007
    Date of Patent: October 21, 2008
    Assignee: Universal Scientific Industrial Co., Ltd.
    Inventors: Fei-Ming Su, Shih-Min Hsu