Abstract: A camera module includes a first circuit board, a holder, a lens module, an image sensor chip, a filter, and a second circuit board. The holder includes a sleeve and a base connected to an end of the sleeve. The lens module is received in the sleeve. The holder is mounted on the first circuit board. The base defines a first receiving portion. The image sensor chip is electrically fixed to the first circuit board and received in the first receiving portion. The filter is received in the first receiving portion corresponding to the image sensor chip. The second circuit board is electrically connected to the first circuit board. The second circuit board is received in the first receiving portion and fixed to the base.

Abstract: A camera module includes a first circuit board, a holder, a lens module, an image sensor chip, a filter, and a second circuit board. The holder includes a sleeve and a base connected to an end of the sleeve. The lens module is received in the sleeve. The holder is mounted on the first circuit board. The base defines a receiving portion. The image sensor chip is electrically fixed to the first circuit board and received in the receiving portion. The filter is received in the first receiving portion corresponding to the image sensor chip. The second circuit board is electrically connected to the first circuit board. The second circuit board is received in the first receiving portion and fixed to the first circuit board. Incident light passes through the lens module and the filter in that order, and finally projects on the image sensor chip.

Abstract: An exemplary imaging module package includes a lens module and an imaging sensor module. The lens module includes a housing having a hollow top portion and a hollow bottom portion coaxially aligned with the hollow top portion. The imaging sensor module is received in the hollow bottom portion. The imaging sensor module includes an imaging sensor connected to the substrate and secured to the bottom portion, a substrate spaced from the bottom portion and defining at least one recess therein, and a plurality of passive components received in the at least one recess and wholly disposed below the imaging sensor.

Abstract: A combination includes a first chip package unit and a second chip package unit on which the first chip package unit is placed. Each of the first and second chip package units includes a substrate having a first surface, a second surface, a chip package electrically connected to the first surface, and a plurality of bonding pads formed on the first and second surfaces. The bonding pads on the first surface of the first chip package unit are respectively electrically connected with the bonding pads on the surface of the second chip package unit. The chip packages electrically connected to the first surfaces are enclosed by the substrates, and the bonding pads on the second surfaces are configured as interface terminals of the combination.

Abstract: A semiconductor unit includes an interface plate, a supporting plate integrally formed with the interface plate, two chip packages positioned at opposite sides of the supporting plate, and leading traces running in the interface plate and the supporting plate, connected with the chip packages respectively.

Abstract: A combination includes a first chip package unit and a second chip package unit on which the first chip package unit is placed. Each of the first and second chip package units includes a substrate having a first surface, a second surface, a chip package electrically connected to the first surface, and a plurality of bonding pads formed on the first and second surfaces. The bonding pads on the first surface of the first chip package unit are respectively electrically connected with the bonding pads on the surface of the second chip package unit. The chip packages electrically connected to the first surfaces are enclosed by the substrates, and the bonding pads on the second surfaces are configured as interface terminals of the combination.

Abstract: An imaging module package includes a substrate, an imaging sensor chip, a functional unit, a housing, and a lens module positioned in the housing. The substrate defines an upper chamber extending through a top surface thereof, and a lower chamber extending through a bottom surface thereof. The imaging sensor chip is positioned in the upper chamber and is electrically connected to the substrate. The functional unit is positioned in the lower chamber and is electrically connected to the substrate. The housing is mounted on the top surface of the substrate and is disposed above the imaging sensor chip.

Abstract: An exemplary camera module includes a substrate, a printed circuit board, an imaging sensor chip, and a lens module. The substrate defines a top surface and a recessed portion in the top surface. The printed circuit board defines a bottom surface soldered to the top surface of the substrate. The imaging sensor chip is received in the recessed portion of the substrate. The lens module is positioned above the imaging sensor chip, with an optical center thereof aligned with that of the imaging sensor chip.

Abstract: An exemplary imaging module package includes a housing, an imaging sensor module, and a lens module. The housing includes a first chamber and a second chamber coaxially aligned with the first chamber. The imaging sensor module is positioned within the first chamber and includes a substrate, an imaging sensor, a plurality of passive components and a plurality of soldering pads. The soldering pads connect the imaging sensor to the substrate. The passive components are mounted to the substrate and wholly disposed below the imaging sensor. The lens module is positioned within the second chamber of the housing.

Abstract: An exemplary imaging module package includes a lens module and an imaging sensor module. The lens module includes a housing having a hollow top portion and a hollow bottom portion coaxially aligned with the hollow top portion. The imaging sensor module is received in the hollow bottom portion. The imaging sensor module includes an imaging sensor connected to the substrate and secured to the bottom portion, a substrate spaced from the bottom portion and defining at least one recess therein, and a plurality of passive components received in the at least one recess and wholly disposed below the imaging sensor.

Abstract: An exemplary camera module includes a lens holder, a lens module, an image sensor chip, at least three apart bonding pads, and a light transmittance element. The lens module is received in the lens holder. The lens module includes a barrel and at least one lens received in the barrel. The image sensor chip includes a photosensitive area configured for receiving light transmitted through the lens module. The image sensor chip is attached to an end of the lens holder facing away from the lens module. The bonding pads are arranged on the image sensor chip around the photosensitive area. The light transmittance element is fixed on the image sensor chip via the at least three bonding pads. The present invention also relates to a method for manufacturing the camera module.

Abstract: A camera module includes an image sensor, a lens module and a holder. The holder defines a cavity, the cavity including a first receiving portion, with the lens module received therein, and a second receiving portion. The side surface of the image sensor tightly contacts the inner surface of the holder surrounding the second receiving portion. In the camera module, an optical center of the image sensor can keep accurately aligning with an optical center of the lens module. Accordingly, the camera module can keep good quality for imaging. A method for making the camera module is also provided.

Abstract: A focusing and defocusing mechanism incorporated in a digital camera lens for simplifying the lens structure. The mechanism includes an outer lens barrel, a cam barrel having a slot of multiple slopes for adapting to the outer lens barrel, a guide pin affixed onto the outer wall of the outer lens barrel for rotating into the slot of the multiple slopes, and controlling elements affixed to the guide pin for controlling the distance and movement of the guide pin on the slot of multiple slopes.

Abstract: An optical scanning apparatus including a first optical unit and a second optical unit used to illuminate a document and direct the reflected light via a lens unit to the light sensing device; a movement mechanism used to move the first and second optical units in such a way that the optical path from the light source to the lens unit is always a fixed length. The movement mechanism includes a first driving unit having a first driving wheel, a first passive wheel, and a first transmission member coupling the first driving and passive wheels and affixed to the first optical unit; a second driving unit having a second driving wheel, a second passive wheel, and a second transmission member coupling the second driving and passive wheels and affixed to the second optical unit; and a driving motor. The diameter of the first driving wheel is of a predetermined multiple of that of the second driving wheel such that the optical path from the light source to the lens unit is always a fixed length.