Abstract: An improved structure of heterojunction field effect transistor (HFET) and a fabrication method thereof are disclosed. The improved HFET structure comprises sequentially a substrate, a channel layer, a spacing layer, a carrier supply layer, a Schottky layer, a Schottky capping layer formed by a higher energy gap material, a tunneling layer formed by a lower energy gap material, a first etching stop layer, and a first n type doped layer.

Abstract: An improved structure of heterojunction field effect transistor (HFET) and a fabrication method thereof are disclosed. The improved HFET structure comprises sequentially a substrate, a channel layer, a spacing layer, a carrier supply layer, a Schottky layer, a Schottky capping layer formed by a higher energy gap material, a tunneling layer formed by a lower energy gap material, a first etching stop layer, and a first n type doped layer.

Abstract: A cantilever type probe head, the head at least includes a probe having an introducing portion for contacting a pad of a member to be probed, the introducing portion is a conical column with its end face having a tapered portion and an extended rectangular portion, the tapered portion and the extended rectangular portion are provided in a coplanar position at the end face on the introducing portion.

Abstract: A coaxial-cable probe structure comprises a coaxial cable and a probing element. The coaxial cable is formed by filling and fixing an inner conductor into an outer conductor via a dielectric material. The dielectric material of the coaxial cable and the outer conductor are provided with a cutting surface. The inner conductor protrudes from the cutting surface and forms a terminal end. The coaxial cable is provided with a cutting part and the cutting part is provided with an oblique surface relative to the coaxial cable so as to have the inner conductor, the dielectric material, and the outer conductor exposed from the oblique surface. The oblique surface extends to the terminal end of the inner conductor. The probing element includes a first, a second, and a third probe and each probe has a front and a rear interface. The front interface of the second probe is connected with part of the inner conductor exposed from the oblique surface.

Abstract: A cantilever type probe head, the head at least includes a probe having an introducing portion for contacting a pad of a member to be probed, the introducing portion is a conical column with its end face having a tapered portion and an extended rectangular portion, the tapered portion and the extended rectangular portion are provided in a coplanar position at the end face on the introducing portion.

Abstract: A full periphery multi-gate transistor with ohmic strip is disclosed. The multi-gate transistor comprises a substrate, a multi-layer structure, a source finger, a drain finger, and a gate. The gate is formed between the source finger and the drain finger, and then a conduction channel is formed between the source finger and the drain finger. The gate also meanderingly wraps around an end of the source finger and an end of the drain finger. Therefore, the end of the source finger and the end of the drain finger are parts of the conduction channel and both provide channel conductance. In addition, an ohmic strip is formed between two gate lines of the gate.

Abstract: A method to produce a product includes the steps of: providing a mold including an upper mold (40) and a lower mold (30), the upper mold defining a plurality of through holes (43); providing a metal piece (10), a hot melt adhesive, and a nonmetal cover layer (50) between the upper and lower molds, the hot melt adhesive arranged between the hot melt adhesive and the cover layer; closing the mold; heating the mold to melt the hot melt adhesive; conducting high-pressure gas into the mold via the through holes to press the cover layer toward the metal piece; opening the mold to pick up an intermediary product having the metal piece and the cover layer attached thereto by means of the adhesive; and applying a sealing layer (60) which joins corresponding free edges of the metal piece and the cover layer to the intermediary product through injection molding technology.

Abstract: A method to produce a product includes the steps of: providing a mold including an upper mold (40) and a lower mold (30), the upper mold defining a plurality of through holes; providing a workpiece (10), a hot melt adhesive (25), and a cover layer (50) between the upper and lower molds, the hot melt adhesive arranged between the workpiece and the cover layer; providing a heater (20) to melt the hot melt adhesive; closing the mold; conducting high-pressure gas into the mold via the through holes to press the cover layer toward the workpiece; and opening the mold to pick up the product having the workpiece and the cover layer attached thereto by means of the adhesive.

Abstract: A method to produce a product includes the steps of: providing a mold including an upper mold (40) and a lower mold (30), the upper mold defining a plurality of through holes (43); providing a metal piece (10), a hot melt adhesive, and a nonmetal cover layer (50) between the upper and lower molds, the hot melt adhesive arranged between the hot melt adhesive and the cover layer; closing the mold; heating the mold to melt the hot melt adhesive; conducting high-pressure gas into the mold via the through holes to press the cover layer toward the metal piece; opening the mold to pick up an intermediary product having the metal piece and the cover layer attached thereto by means of the adhesive; and applying a sealing layer (60) which joins corresponding free edges of the metal piece and the cover layer to the intermediary product through injection molding technology.

Abstract: A method to produce a product includes the steps of: providing a mold including an upper mold (40) and a lower mold (30), the upper mold defining a plurality of through holes; providing a workpiece (10), a hot melt adhesive (25), and a cover layer (50) between the upper and lower molds, the hot melt adhesive arranged between the workpiece and the cover layer; providing a heater (20) to melt the hot melt adhesive; closing the mold; conducting high-pressure gas into the mold via the through holes to press the cover layer toward the workpiece; and opening the mold to pick up the product having the workpiece and the cover layer attached thereto by means of the adhesive.

Abstract: A method to produce a product includes the steps of: providing a mold including an upper mold (40) and a lower mold (30), the upper mold defining a plurality of through holes (43); providing a metal piece (10), a hot melt adhesive, and a nonmetal cover layer (50) between the upper and lower molds, the hot melt adhesive arranged between the hot melt adhesive and the cover layer; closing the mold; heating the mold to melt the hot melt adhesive; conducting high-pressure gas into the mold via the through holes to press the cover layer toward the metal piece; and opening the mold to pick up the product having the metal piece and the cover layer attached thereto by means of the adhesive.