Abstract: A method of forming a semiconductor structure is provided, and includes trimming a first substrate to form a recess on a sidewall of the first substrate. A conductive structure is formed in the first substrate. The method includes bonding the first substrate to a carrier. The method includes thinning down the first substrate. The method also includes forming a dielectric material in the recess and over a top surface of the thinned first substrate. The method further includes performing a planarization process to remove the dielectric material and expose the conductive structure over the top surface. In addition, the method includes removing the carrier from the first substrate.

Abstract: Provided are structures and methods for forming structures with sloping surfaces of a desired profile. An exemplary method includes performing a first etch process to differentially etch a gate material to a recessed surface, wherein the recessed surface includes a first horn at a first edge, a second horn at a second edge, and a valley located between the first horn and the second horn; depositing an etch-retarding layer over the recessed surface, wherein the etch-retarding layer has a central region over the valley and has edge regions over the horns, and wherein the central region of the etch-retarding layer is thicker than the edge regions of the etch-retarding layer; and performing a second etch process to recess the horns to establish the gate material with a desired profile.

Abstract: A semiconductor device includes a substrate; a first thermoelectric conduction leg, disposed on the substrate, and doped with a first type of dopant; a second thermoelectric conduction leg, disposed on the substrate, and doped with a second type of dopant, wherein the first and second thermoelectric conduction legs are spatially spaced from each other but disposed along a common row on the substrate; and a first intermediate thermoelectric conduction structure, disposed on a first end of the second thermoelectric conduction leg, and doped with the first type of dopant.

Abstract: A semiconductor device includes a substrate; a first thermoelectric conduction leg, disposed on the substrate, and doped with a first type of dopant; a second thermoelectric conduction leg, disposed on the substrate, and doped with a second type of dopant, wherein the first and second thermoelectric conduction legs are spatially spaced from each other but disposed along a common row on the substrate; and a first intermediate thermoelectric conduction structure, disposed on a first end of the second thermoelectric conduction leg, and doped with the first type of dopant.

Abstract: A semiconductor device and method of making same are disclosed. In some embodiments, a method includes: forming a first thermoelectric conduction leg on a substrate; forming a second thermoelectric conduction leg on the substrate to be aligned with the first thermoelectric conduction leg along a same row; forming at least one intermediate thermoelectric conduction structure on an end of the second thermoelectric conduction leg; forming a contact structure to couple the first and second thermoelectric conduction legs via the at least one intermediate thermoelectric conduction structure; and recessing the substrate to form at least one trench substantially adjacent to a respective side edge of either the first thermoelectric conduction leg or the second thermoelectric conduction leg.

Abstract: A semiconductor device and method of making same are disclosed. In some embodiments, a method includes: forming a first thermoelectric conduction leg on a substrate; forming a second thermoelectric conduction leg on the substrate to be aligned with the first thermoelectric conduction leg along a same row; forming at least one intermediate thermoelectric conduction structure on an end of the second thermoelectric conduction leg; forming a contact structure to couple the first and second thermoelectric conduction legs via the at least one intermediate thermoelectric conduction structure; and recessing the substrate to form at least one trench substantially adjacent to a respective side edge of either the first thermoelectric conduction leg or the second thermoelectric conduction leg.

Abstract: A semiconductor device includes a substrate; a first thermoelectric conduction leg, disposed on the substrate, and doped with a first type of dopant; a second thermoelectric conduction leg, disposed on the substrate, and doped with a second type of dopant, wherein the first and second thermoelectric conduction legs are spatially spaced from each other but disposed along a common row on the substrate; and a first intermediate thermoelectric conduction structure, disposed on a first end of the second thermoelectric conduction leg, and doped with the first type of dopant.

Abstract: Disclosed is a boot system and boot method for an intelligent robot. The boot system includes the intelligent robot and a mobile device. The intelligent robot includes an activating module, a wireless communication module and an image capturing device. The central processing unit is electrically connected to the activating module, the wireless communication module and the image capturing module. The mobile device includes an input interface, a first memory and a display. The input interface includes a username frame and a password frame. The username frame is configured to receive a username. The password frame is configured to receive a password. When the username and the password received by the input interface is compliant with the username and the password of the mobile device, the display indicates a verification code. The verification code includes a login username and a login password for establishing wireless network communication.

Abstract: Disclosed is a boot system and boot method for an intelligent robot. The intelligent robot includes a central processing unit, an activating module, a memory and a wireless communication module. The central processing unit is electrically connected to the activating module, the memory and the wireless communication module. When the username and password stored in the memory is not compliant with the username and password of a wireless network, the intelligent robot enters a hotspot mode as a hotspot. A mobile device connects to the intelligent robot through the hotspot. The wireless communication module receives a login username and a login password from the mobile device. The intelligent robot connects to the wireless network for establishing the wireless network connection by the login username and the login password for entering a login mode.

Abstract: Disclosed is a boot system and boot method for an intelligent robot. The intelligent robot includes a central processing unit, an activating module, a memory and a wireless communication module. The central processing unit is electrically connected to the activating module, the memory and the wireless communication module. When the username and password stored in the memory is not compliant with the username and password of a wireless network, the intelligent robot enters a hotspot mode as a hotspot. A mobile device connects to the intelligent robot through the hotspot. The wireless communication module receives a login username and a login password from the mobile device. The intelligent robot connects to the wireless network for establishing the wireless network connection by the login username and the login password for entering a login mode.

Abstract: Disclosed is a boot system and boot method for an intelligent robot. The boot system includes the intelligent robot and a mobile device. The intelligent robot includes an activating module, a wireless communication module and an image capturing device. The central processing unit is electrically connected to the activating module, the wireless communication module and the image capturing module. The mobile device includes an input interface, a first memory and a display. The input interface includes a username frame and a password frame. The username frame is configured to receive a username. The password frame is configured to receive a password. When the username and the password received by the input interface is compliant with the username and the password of the mobile device, the display indicates a verification code. The verification code includes a login username and a login password for establishing wireless network communication.

Abstract: A semiconductor device includes a substrate; a first thermoelectric conduction leg, disposed on the substrate, and doped with a first type of dopant; a second thermoelectric conduction leg, disposed on the substrate, and doped with a second type of dopant, wherein the first and second thermoelectric conduction legs are spatially spaced from each other but disposed along a common row on the substrate; and a first intermediate thermoelectric conduction structure, disposed on a first end of the second thermoelectric conduction leg, and doped with the first type of dopant.

Abstract: A method for assembling a touch control display apparatus includes: mounting a frame member to an assembly surface of a touch control panel; fixing a display panel to one of the frame member and the assembly surface of the touch control panel such that a display surface of the display panel faces the touch control panel; mounting at least one electronic component on a section of the frame member that is not covered by the display panel; and coupling a bottom case to the frame member for enclosing the display panel and the at least one electronic component.

Abstract: A method for assembling a touch control display apparatus includes: mounting a frame member to an assembly surface of a touch control panel; fixing a display panel to one of the frame member and the assembly surface of the touch control panel such that a display surface of the display panel faces the touch control panel; mounting at least one electronic component on a section of the frame member that is not covered by the display panel; and coupling a bottom case to the frame member for enclosing the display panel and the at least one electronic component.

Abstract: A structure of a gallium nitride light emitting diode has a transparent conductive window layer including a diffusion barrier layer, an ohmic contact layer, and a window layer. By using the added domain contact layer, the diffusion barrier layer and the P-type semiconductor layer of the light emitting diode are put into ohmic contact. And then, the rising of the contact resistivity is barred by applying the diffusion barrier layer to block the diffusion of the window layer from the contact with the domain contact layer so as to lower down the operating voltage and advance the transparency.

Abstract: A structure and manufacturing of a gallium nitride light emitting diode discloses a transparent conductive window layer comprising a diffusion barrier layer, an ohmic contact layer, and a window layer. By using the added domain contact layer, the diffusion barrier layer and the P-type semiconductor layer of the light emitting diode are put into ohimc contact. And then, the rising of the contact resistivity is barred by applying the diffusion barrier layer to block the diffusion of the window layer from the contact with the domain contact layer so as to lower down the operating voltage and advance the transparency.

Abstract: A tape withdrawal and positioning system is provided for withdrawing tape from its initial position within a tape cassette and positioning it in proximity to or in contact with a tape recording and/or reproducing apparatus. The tape withdrawal and positioning system comprises a pair of lever arms having tape guide posts adjustable between an initial position wherein the tape guide posts are positioned behind an access portion of the tape within the tape cassette and an operating position whereon the lever arms are extended and the tape guide posts are positioned in proximity to the recording and/or reproducing apparatus. In the operating position, and tape is in contact with a portion of the recording and/or reproducing apparatus.