Patents by Inventor Shih-Nan Hsieh

Shih-Nan Hsieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10736221
    Abstract: A circuit board assembly inspection method includes the following steps: measuring a geometrical characteristic value of a solder layer before soldering an electronic component to a circuit board and comparing the geometric characteristic value with a predetermined value and defining the grad of the solder layer according to a comparing result of the comparing step and performing a defective product process to the circuit board having an extremely bad solder layer, measuring a quality characteristic value of a solder joint layer after soldering the electronic component to the circuit board and comparing the quality characteristic value with a predetermined quality parameter value and then defining the grade of the solder joint layer according to a comparing result of the comparing step, manually inspecting the circuit board assembly having both an medium-grade solder layer a the poor solder joint layer.
    Type: Grant
    Filed: April 23, 2018
    Date of Patent: August 4, 2020
    Assignee: UNIVERSAL GLOBAL TECHNOLOGY (KUNSHAN) CO., LTD
    Inventors: Yi-Ming Chang, Shih-Nan Hsieh
  • Publication number: 20190254173
    Abstract: A circuit board assembly inspection method includes the following steps: measuring a geometrical characteristic value of a solder layer before soldering an electronic component to a circuit board and comparing the geometric characteristic value with a predetermined value and defining the grad of the solder layer according to a comparing result of the comparing step and performing a defective product process to the circuit board having an extremely bad solder layer, measuring a quality characteristic value of a solder joint layer after soldering the electronic component to the circuit board and comparing the quality characteristic value with a predetermined quality parameter value and then defining the grade of the solder joint layer according to a comparing result of the comparing step, manually inspecting the circuit board assembly having both an medium-grade solder layer a the poor solder joint layer.
    Type: Application
    Filed: April 23, 2018
    Publication date: August 15, 2019
    Inventors: Yi-Ming CHANG, Shih-Nan HSIEH
  • Patent number: 7221280
    Abstract: A urinous wet alarm to detect a soaked diaper and generate an audio alarm to alert replacement includes a shell to house a test IC. The test IC connects to a lithium battery, a thin alarm speaker and one end of a sensing unit which is a pliable, elongate, narrow and thin plate and has a detection circuit consisting of two conductive wires of opposite polarity extended from the shell. The sensing unit may be inserted into a test insertion hole formed on a diaper during production. Urine soaked the fluid absorption layer of the diaper makes the conductive wires conductive, and the test IC determines the urine overflow condition to activate the thin alarm speaker to generate an audio alarm.
    Type: Grant
    Filed: June 8, 2004
    Date of Patent: May 22, 2007
    Assignee: Lightak Electronics Corp.
    Inventor: Shih-Nan Hsieh