Abstract: The present invention is a lighting device with color temperature control function, including two modulated power input ends, a rectifier that rectifies the modulated power and outputs a rectified modulated power, a first LED module and a second LED module that have different color temperatures, and a dimming control unit. The modulated power includes multiple cycles of a sinewave, and each cycle of the sinewave has a firing angle. The dimming control unit reads a lighting modulation command code that is carried in the modulated power according to the firing angle of each cycle, and controls the luminous intensity of the first and second LED modules respectively to perform a designated combination of color temperature of lighting effect.

Abstract: The present disclosure provides a light-emitting device having an ambient light sensing function, including a light-emitting module, a rectification module, a switch module, a control module, and an ambient light sensing module. The light-emitting module includes a circuit substrate and a plurality of light-emitting elements. The rectification module is electrically connected to the light-emitting module. The switch module includes a semiconductor switch element electrically connected to the light-emitting module. The control module is electrically connected to the rectification module and the switch module. The ambient light sensing module is electrically connected to the control module for receiving an ambient light source.

Abstract: The present disclosure provides a light-emitting device having an ambient light sensing function, including a light-emitting module, a rectification module, a switch module, a control module, and an ambient light sensing module. The light-emitting module includes a circuit substrate and a plurality of light-emitting elements. The rectification module is electrically connected to the light-emitting module. The switch module includes a semiconductor switch element electrically connected to the light-emitting module. The control module is electrically connected to the rectification module and the switch module. The ambient light sensing module is electrically connected to the control module for receiving an ambient light source.

Abstract: The instant disclosure provides an illumination device and a light-emitting module thereof. The light-emitting module includes a cover structure, a light-emitting structure and an assembled type capacitor assembly. The cover structure has a through opening. The light-emitting structure includes a circuit substrate disposed under the cover structure and a plurality of light-emitting elements disposed on the circuit substrate and exposed from the through opening. The assembled type capacitor assembly includes at least one assembled type capacitor electrically connected the circuit substrate through an assembled type electrical connection assembly, and the at least one assembled type capacitor is separated from the circuit substrate.

Abstract: A light-mixing multichip package structure includes a circuit substrate, a first light-emitting module, a first package body, a second light-emitting module and a second package body. The first light-emitting module includes a plurality of first light-emitting elements disposed on the circuit substrate and electrically connected to the circuit substrate. The first package body is disposed on the circuit substrate to enclose the first light-emitting elements. The second light-emitting module includes a plurality of second light-emitting elements disposed on the circuit substrate and electrically connected to the circuit substrate, and the first light-emitting module and the first package body are surrounded by the second light-emitting elements. The second package body is disposed on the circuit substrate to enclose the first light-emitting module, the second light-emitting module and the first package body.

Abstract: The instant disclosure provides an illumination device and a light-emitting module thereof. The light-emitting module includes a cover structure, a light-emitting structure and an assembled type capacitor assembly. The cover structure has a through opening. The light-emitting structure includes a circuit substrate disposed under the cover structure and a plurality of light-emitting elements disposed on the circuit substrate and exposed from the through opening. The assembled type capacitor assembly includes at least one assembled type capacitor electrically connected the circuit substrate through an assembled type electrical connection assembly, and the at least one assembled type capacitor is separated from the circuit substrate.

Abstract: A light-mixing multichip package structure includes a circuit substrate, a first light-emitting module, a first package body, a second light-emitting module and a second package body. The first light-emitting module includes a plurality of first light-emitting elements disposed on the circuit substrate and electrically connected to the circuit substrate. The first package body is disposed on the circuit substrate to enclose the first light-emitting elements. The second light-emitting module includes a plurality of second light-emitting elements disposed on the circuit substrate and electrically connected to the circuit substrate, and the first light-emitting module and the first package body are surrounded by the second light-emitting elements. The second package body is disposed on the circuit substrate to enclose the first light-emitting module, the second light-emitting module and the first package body.

Abstract: An illumination device including a voltage transformer module, a switching unit, a control module, a sensor module, a first illumination module and a second illumination module. The switching unit is coupled to the rectifier module and the voltage transformer module. The control module is coupled to the switching unit and the voltage transformer module. The sensor module is electrically connected to the control module. The sensor module senses an invading object within an induction area. The first illumination module is electrically connected to the switching unit. The second illumination module is electrically connected to the sensor module. The sensor module supplies electricity to the second illumination module to emit light. The sensor module outputs a sensing signal to the control module when the sensor module senses the invading object. The control module controls the switching unit to be turned on so that the first illumination module emits light.

Abstract: Disclosed is an AC light emitting device. The AC light emitting device is electrically connected to an AC power, and the AC power is rectified by a rectification module and inputs an input voltage. The AC light emitting device comprises a buck module, a switching unit, a control module and an AC lighting emitting module. The buck module is electrically connected to the rectification module. The switching unit is electrically connected to the rectification module and the buck module. The control module is electrically connected to the switching unit and the buck module. The AC lighting emitting module is electrically connected to the switching unit. The control module outputs a pulse waveform signal to the switching unit according to the input voltage and a dimming signal, and the switching unit turns on or off the AC lighting emitting module according to the pulse waveform signal.

Abstract: A multichip package structure includes a metal substrate, a circuit substrate and a light-emitting module. The metal substrate has a first mirror plane area and a second mirror plane area. The circuit substrate is disposed on the metal substrate. The circuit substrate includes a plurality of first conductive pads, a plurality of second conductive pads, a first passing opening for exposing the first mirror plane area, and a second passing opening for exposing the second mirror plane area. The light-emitting module includes a plurality of light-emitting units disposed on the first mirror plane area. Each light-emitting unit includes a plurality of LED chips disposed on the first mirror plane area. The LED chips of each light-emitting unit are electrically connected between the first conductive pad and the second conductive pad in series. Thus, the heat-dissipating efficiency and the light-emitting effect of the multichip package structure can be increased.

Abstract: A multichip package structure includes a metal substrate, a circuit substrate and a light-emitting module. The metal substrate has a first mirror plane area and a second mirror plane area. The circuit substrate is disposed on the metal substrate. The circuit substrate includes a plurality of first conductive pads, a plurality of second conductive pads, a first passing opening for exposing the first mirror plane area, and a second passing opening for exposing the second mirror plane area. The light-emitting module includes a plurality of light-emitting units disposed on the first mirror plane area. Each light-emitting unit includes a plurality of LED chips disposed on the first mirror plane area. The LED chips of each light-emitting unit are electrically connected between the first conductive pad and the second conductive pad in series. Thus, the heat-dissipating efficiency and the light-emitting effect of the multichip package structure can be increased.

Abstract: A lamp module includes a cover structure, a circuit board structure and a multichip package structure, and the circuit board structure and the multichip package structure are sequentially assembled on the bottom side of the cover structure. The cover structure includes a cover body, a plurality of positioning elements disposed on the bottom side of the cover body, and a plurality of retaining elements disposed on the bottom side of the cover body. The cover body has a through opening and a surrounding light-reflecting surface formed on the inner surface of the through opening. The circuit board structure is disposed on the bottom side of the cover body and includes a plurality of conductive pins disposed on the bottom side of the circuit board structure. The multichip package structure is disposed on the bottom side of the cover body and electrically connected to the circuit board structure.

Abstract: A light-mixing multichip package structure includes a substrate unit, a light-emitting unit, a package unit, and a frame unit. The substrate unit includes a substrate body. The light-emitting unit includes a plurality of first and second light-emitting groups. The first and the second light-emitting groups are disposed on the substrate body and electrically connected to the substrate body in series. Each first light-emitting group includes a plurality of first parallel connection units electrically connected in parallel, and each first parallel connection unit includes at least one blue LED chip, and each second light-emitting group includes at least one red LED chip. The package unit includes a phosphor resin body disposed on the substrate body to cover the first and the second light-emitting groups. The frame unit includes a surrounding light-reflecting frame surrounding the first and the second light-emitting groups and the phosphor resin body.

Abstract: An illumination device for enhancing plant growth includes a substrate unit, a light-emitting unit, a current-limiting unit, and a control unit. The substrate unit includes a substrate body. The light-emitting unit, the current-limiting unit, and the control unit are disposed on the substrate body. The light-emitting unit includes a first light-emitting module, a second light-emitting module, and a third light-emitting module. The current-limiting unit includes a first current-limiting chip electrically connected to the first light-emitting module, a second current-limiting chip electrically connected to the second light-emitting module, and a third current-limiting chip electrically connected to the third light-emitting module.

Abstract: An illuminating apparatus is disclosed. The illuminating apparatus includes a detecting unit, an illuminating unit, and a control unit. The illuminating unit includes multiple illuminating sets and a switching unit for adjusting a connection relationship among the illuminating sets. The detecting unit is for detecting an inputted power supply received by the illuminating unit while the control unit is coupled to the detecting unit and the switching unit. The control unit based on a detected inputted power supply controls the switching unit according to a predetermined setting parameter, so as to ensure a conducting voltage of the illuminating unit to vary according to a variation in the inputted power supply.

Abstract: An illuminating apparatus adapted to receive an input power which is a pulse DC includes a lighting unit, a detecting unit and a controlling unit. The lighting unit includes a plurality of lighting sets and a switching unit. The switching unit may be used to cause the lighting sets interconnected in a serial fashion and/or in a parallel manner. The detecting unit detects a state of the input power. The control unit couples the detecting unit and the lighting unit, and controls the switching unit according to the detecting unit detecting the state of the input power. As such, the turn-on voltages of the lighting unit may adjust at different stages of the input power.

Abstract: An energy-saving illumination apparatus adapted to receive an input power includes a light unit, a detection unit, a dimming unit, and a control unit. The light unit has a plurality of light sets and a switch unit connecting the light sets in parallel and/or serial connections. The detection unit is for detecting the status of the input power. The dimming unit is for controlling the current of the light unit. The control unit is for controlling the switch unit according to the detection result of the detection unit and making the turn-on voltage of the light unit be changed along with the input power. The control unit controls duty cycle of pulse width modulation (PWM) signal and transmits the PWM signal to the dimming unit. The dimming unit adjusts the current which conducts and makes the light unit emit light to be changes along with the duty cycle.

Abstract: A light-mixing multichip package structure includes a substrate unit, a light-emitting unit, a package unit, and a frame unit. The substrate unit includes a substrate body. The light-emitting unit includes a plurality of first and second light-emitting groups. The first and the second light-emitting groups are disposed on the substrate body and electrically connected to the substrate body in series. Each first light-emitting group includes a plurality of first parallel connection units electrically connected in parallel, and each first parallel connection unit includes at least one blue LED chip, and each second light-emitting group includes at least one red LED chip. The package unit includes a phosphor resin body disposed on the substrate body to cover the first and the second light-emitting groups. The frame unit includes a surrounding light-reflecting frame surrounding the first and the second light-emitting groups and the phosphor resin body.

Abstract: An illuminating apparatus is disclosed. The illuminating apparatus includes a detecting unit, an illuminating unit, and a control unit. The illuminating unit includes multiple illuminating sets and a switching unit for adjusting a connection relationship among the illuminating sets to ensure a conducting voltage of the illuminating set to swing between a minimum conducting voltage and a maximum conducting voltage. The detecting unit is for detecting an inputted power source received by the illuminating unit. The control unit based on a detected inputted power source controls an operation of the switching unit for extending a conducting time in a single period of the inputted power source.

Abstract: A lamp module includes a cover structure, a circuit board structure and a multichip package structure, and the circuit board structure and the multichip package structure are sequentially assembled on the bottom side of the cover structure. The cover structure includes a cover body, a plurality of positioning elements disposed on the bottom side of the cover body, and a plurality of retaining elements disposed on the bottom side of the cover body. The cover body has a through opening and a surrounding light-reflecting surface formed on the inner surface of the through opening. The circuit board structure is disposed on the bottom side of the cover body and includes a plurality of conductive pins disposed on the bottom side of the circuit board structure. The multichip package structure is disposed on the bottom side of the cover body and electrically connected to the circuit board structure.