Patents by Inventor Shih-Pang Wen

Shih-Pang Wen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Diamond substrate and method for fabricating the same
    Patent number: 7510906
    Abstract: A diamond substrate and a method for fabricating the same are provided wherein a SiC layer is formed on a lower surface of a diamond layer for preventing the diamond layer from being deformed after the process of forming the diamond substrate, and then a semiconductor layer is formed on the diamond layer or directly formed on the surface of the SiC layer. Thereby, the lattice mismatch between the diamond film layer and the semiconductor layer is mitigated by the SiC layer, and the crystalline quality of the semiconductor layer is improved, the fabricating process of the diamond substrate is simplified, and the performance and stability are enhanced.
    Type: Grant
    Filed: April 26, 2006
    Date of Patent: March 31, 2009
    Assignee: Kinik Company
    Inventors: Hsiao-Kuo Chang, Jen-Sheuan Huang, Chih-Peng Chen, Na-Ling Chen, Shih-Pang Wen
  • DIAMOND SUBSTRATE AND METHOD FOR FABRICATING THE SAME
    Publication number: 20060243982
    Abstract: A diamond substrate and a method for fabricating the same are provided wherein a SiC layer is formed on a lower surface of a diamond layer for preventing the diamond layer from being deformed after the process of forming the diamond substrate, and then a semiconductor layer is formed on the diamond layer or directly formed on the surface of the SiC layer. Thereby, the lattice mismatch between the diamond film layer and the semiconductor layer is mitigated by the SiC layer, and the crystalline quality of the semiconductor layer is improved, the fabricating process of the diamond substrate is simplified, and the performance and stability are enhanced.
    Type: Application
    Filed: April 26, 2006
    Publication date: November 2, 2006
    Applicant: KINIK COMPANY
    Inventors: Hsiao-Kuo CHANG, Jen-Sheuan HUANG, Chih-Peng CHEN, Na-Ling CHEN, Shih-Pang WEN