Abstract: A semiconductor device includes a first stack structure, a second stack structure, and a third stack structure. Each of the stack structure includes semiconductor layers vertically spaced from one another. The first, second, and third stack structures all extend along a first lateral direction. The second stack structure is disposed between the first and third stack structures. The semiconductor device includes a first gate structure that extends along a second lateral direction and wraps around each of the semiconductor layers. The semiconductor layers of the first stack structure are coupled with respective source/drain structures. The semiconductor layers of the second stack structure are coupled with respective source/drain structures. The semiconductor layers of the third stack structure are coupled with a dielectric passivation layer.

Abstract: The present disclosure provides an image sensing module including a main board and an image sensor. The main board has a first surface and a second surface opposite to each other. The image sensor is disposed on the first surface of the main board and includes a plurality of isolation structures and a photoelectric conversion element between the plurality of isolation structures. A first angle is provided between a light incident surface of the photoelectric conversion element and the first surface of the main board, and a second angle is provided between a light beam incident to the light incident surface of the photoelectric conversion element and a normal vector of the light incident surface. The second angle is about equal to the Brewster angle at the interface of the light beam incident to the light incident surface.

Abstract: A method includes etching a semiconductor substrate to form a trench, with the semiconductor substrate having a sidewall facing the trench, and depositing a first semiconductor layer extending into the trench. The first semiconductor layer includes a first bottom portion at a bottom of the trench, and a first sidewall portion on the sidewall of the semiconductor substrate. The first sidewall portion is removed to reveal the sidewall of the semiconductor substrate. The method further includes depositing a second semiconductor layer extending into the trench, with the second semiconductor layer having a second bottom portion over the first bottom portion, and a second sidewall portion contacting the sidewall of the semiconductor substrate. The second sidewall portion is removed to reveal the sidewall of the semiconductor substrate.

Abstract: A method includes receiving a device design layout and a scribe line design layout surrounding the device design layout. The device design layout and the scribe line design layout are rotated in different directions. An optical proximity correction (OPC) process is performed on the rotated device design layout and the rotated scribe line design layout. A reticle includes the device design layout and the scribe line design layout is formed after performing the OPC process.

Abstract: A semiconductor structure includes a first tier, a redistribution circuit structure, and a second tier. The first tier includes at least one first die. The redistribution circuit structure is disposed on the first tier and electrically coupled to the at least one first die, where the redistribution circuit structure has a multi-layer structure and includes a vertical connection structure continuously extending from a first side of the redistribution circuit structure to a second side of the redistribution circuit structure, and the first side is opposite to the second side along a stacking direction of the first tier and the redistribution circuit structure. The second tier includes a plurality of second dies, and is disposed on and electrically coupled to the redistribution circuit structure.

Abstract: In an embodiment, a chemical mechanical planarization (CMP) system includes: a monolithic platen within a platen housing, wherein the monolithic platen is formed of a single piece of material, wherein the monolithic platen includes: a first portion within a first opening, and a second portion within a second opening, wherein the first portion has a different diameter than the second portion; and a polishing fluid delivery module above the monolithic platen, wherein the polishing fluid delivery module is configured to deliver slurry to the monolithic platen during performance of CMP.

Abstract: A method of fabricating a semiconductor device is disclosed. The method includes forming semiconductor fins on a substrate. A first dummy gate is formed over the semiconductor fins. A recess is formed in the first dummy gate, and the recess is disposed between the semiconductor fins. A dummy fin material is formed in the recess. A portion of the dummy fin material is removed to expose an upper surface of the first dummy gate and to form a dummy fin. A second dummy gate is formed on the exposed upper surface of the first dummy gate.

Abstract: A rechargeable and waterproofing USB luminous ring that is cuttable and extendable includes a tube, an LED seat, a hard shell having a USB receptacle, and plural LEDs. Inside the tube is a string of LEDs connecting to an electric wire. The LED seat, protected by the hard shell, is sheathed by two ends of the tube and is a circuit board. The circuit connecting to the circuit board outside the LEDs is a parallel circuit, two ends of the hard shell include respectively two waterproofing ribs, an end of the hard shell is a switching button and a USB socket, and the other end of the hard shell contains two shields.

Abstract: A three-dimensional display system including a display and a pair of three-dimensional glasses having a light sensor is provided. The display includes a backlight driving module and a backlight module, wherein the backlight driving module modulates an original synchronization signal to generate a modulated backlight driving signal for driving the backlight module to generate a backlight. The display alternatively generates a left eye image and a right eye image according to a three-dimensional image signal. The three-dimensional glasses then determines whether the image output from the display is the let-eye image or the right-eye image based on the variation in brightness of the backlight generated by the backlight module of the display.

Abstract: A light ring includes an LED seat having a protection cover and a circuit board which has multiple batteries and LEDs. The circuit board is protected in the protection cover. A transparent tube has an inner diameter which is larger than that of the protection cover. Conductive gel is filled in the transparent tube. The LED seat is inserted into the transparent tube and two ends of the transparent tube are seamlessly sealed so that the LED seat, the protection cover and the circuit board are received in the transparent tube. The LED seat is sealed in the transparent tube so that the light ring is water proof. The LED seat is protected by the transparent tube and the protection cover. The two ends of the transparent tube can be easily opened.

Abstract: A stereogram apparatus comprises a digital imaging unit, a display unit, an input unit, a control unit and a printing unit. The digital imaging unit has a plurality of lens and the digital imaging unit is functioned to take a plurality of images into a plurality of graphic files. The input unit has a plurality of function keys. The display unit shows an operation screen and an image taken by the digital imaging unit. The control unit reads the plurality of graphic files and has a built-in software executing a processing to form a combinative graphic file with stereogram effect from the plurality of graphic files. The combinative graphic file is printed to form a composite plate for stereogram. The composite plate for stereogram is attached to a grating member with a predetermined angle to form an express photo with stereogram effect.