Patents by Inventor Shih-Ping Chou
Shih-Ping Chou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240145155Abstract: Provided is a core structure of an inductor element. The manufacturing method thereof is to embed a magnetic conductor including at least one magnetic conductive layer in a core body and to from a plurality of apertures for passing coils around the magnetic conductor in the core body. Accordingly, the magnetic conductor is designed in the core body by using the integrated circuit carrier board manufacturing process, such that the overall size and thickness of the inductor element can be greatly reduced, thereby facilitating product miniaturization using the inductor element.Type: ApplicationFiled: October 31, 2023Publication date: May 2, 2024Applicant: PHOENIX PIONEER TECHNOLOGY CO., LTD.Inventors: Pao-Hung CHOU, Che-Wei HSU, Shih-Ping HSU
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Publication number: 20240136728Abstract: An antenna module is provided, in which an antenna supporting substrate having a step-shaped hollow cavity is disposed on a circuit structure having an antenna part, so that the antenna part is exposed from the step-shaped hollow cavity, and an antenna structure is arranged on the steps of the step-shaped hollow cavity to cover the antenna part and is electromagnetically coupled with the antenna part, and there is no barrier but an air medium between the antenna structure and the antenna part.Type: ApplicationFiled: September 4, 2023Publication date: April 25, 2024Applicant: PHOENIX PIONEER TECHNOLOGY CO., LTD.Inventors: Pao-Hung CHOU, Shih-Ping HSU
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Patent number: 8816707Abstract: A misalignment detection device comprising a first substrate, at least one integrated circuit, a second substrate, a third substrate, and at least one detection unit. The at least one integrated is disposed on the first substrate in a first pressing region. The third substrate is disposed on the first substrate in a second pressing region and on the second substrate on the second substrate in a third pressing region. The at least one detection unit outputs a fault signal in response to a positioning shift occurring in at least one of the first, second, and third pressing regions.Type: GrantFiled: March 18, 2013Date of Patent: August 26, 2014Assignee: Au Optronics Corp.Inventors: Chun-Yu Lee, Shih-Ping Chou, Chien-Liang Chen, Wen-Hung Lai
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Patent number: 8426987Abstract: A misalignment detection device comprising a substrate, at least one integrated circuit (IC), and at least one detection unit is disclosed. The substrate comprises a first positioning pad and a second positioning pad adjacent to the first positioning pad. The integrated circuit is disposed on the substrate and comprises a first positioning bump and a second positioning bump adjacent to the first positioning bump. The first and second positioning bumps substantially correspond to the first and second positioning pads, respectively. The at least one detection unit is electrically coupled to the substrate, wherein the detection unit outputs a fault signal in response to a positioning shift occurring between the first and second positioning pads and the first and second positioning bumps.Type: GrantFiled: February 5, 2010Date of Patent: April 23, 2013Assignee: Au Optronics Corp.Inventors: Chun-Yu Lee, Shih-Ping Chou, Chien-Liang Chen, Wen-Hung Lai
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Patent number: 8395050Abstract: A flexible printed circuit and a display module comprising the flexible printed circuit are disclosed. The display module comprises a display panel, a printed circuit board, and a flexible printed circuit. The flexible printed circuit electrically connects the display panel and the printed circuit board, and further comprises a flexible substrate and a cover lay. The flexible substrate has an upper surface and two opposite end portions. The cover lay is disposed on the upper surface of the flexible substrate and extends along a lengthwise direction of the flexible substrate. The cover lay further has two opposite sides each also extending along the lengthwise direction of the flexible substrate. Each of the sides has at least a partially continuous contour which is formed with a discontinuous status on at least one of the end portions.Type: GrantFiled: November 1, 2010Date of Patent: March 12, 2013Assignee: AU Optronics Corp.Inventors: Chien-Liang Chen, Chun-Yu Lee, Shih-Ping Chou
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Patent number: 8247989Abstract: A lamp detection driving system is disclosed for performing adaptive lamp driving and related detection operations based on a recipe. The system includes a micro-controller, a driver, a defect detection module and a feedback circuit. The micro-controller provides a modulation signal and a plurality of reference signals based on the recipe. The driver generates at least one driving signal for driving at least one lamp based on the modulation signal. The feedback circuit generates a plurality of feedback signals based on lamp currents or lamp voltages. The defect detection module generates a plurality of detection signals based on the reference signals and the feedback signals. Furthermore, disclosed is a lamp detection driving method including downloading the recipe, generating at least one driving signal for driving at least one lamp based on the recipe, and providing at least one reference signal for performing defect detection processes based on the recipe.Type: GrantFiled: October 6, 2008Date of Patent: August 21, 2012Assignee: AU Optronics Corp.Inventors: Wei-Chung Chuang, Yung-Lung Hsuao, Shih-Ping Chou
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Publication number: 20110044014Abstract: A flexible printed circuit and a display module comprising the flexible printed circuit are disclosed. The display module comprises a display panel, a printed circuit board, and a flexible printed circuit. The flexible printed circuit electrically connects the display panel and the printed circuit board, and further comprises a flexible substrate and a cover lay. The flexible substrate has an upper surface and two opposite end portions. The cover lay is disposed on the upper surface of the flexible substrate and extends along a lengthwise direction of the flexible substrate. The cover lay further has two opposite sides each also extending along the lengthwise direction of the flexible substrate. Each of the sides has at least a partially continuous contour which is formed with a discontinuous status on at least one of the end portions.Type: ApplicationFiled: November 1, 2010Publication date: February 24, 2011Applicant: AU OPTRONICS CORP.Inventors: Chien-Liang Chen, Chun-Yu Lee, Shih-Ping Chou
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Patent number: 7847196Abstract: A flexible printed circuit and a display module comprising the flexible printed circuit are disclosed. The display module comprises a display panel, a printed circuit board, and a flexible printed circuit. The flexible printed circuit electrically connects the display panel and the printed circuit board, and further comprises a flexible substrate and a cover lay. The flexible substrate has an upper surface and two opposite end portions. The cover lay is disposed on the upper surface of the flexible substrate and extends along a lengthwise direction of the flexible substrate. The cover lay further has two opposite sides each also extending along the lengthwise direction of the flexible substrate. Each of the sides has at least a partially continuous contour which is formed with a discontinuous status on at least one of the end portions.Type: GrantFiled: May 8, 2007Date of Patent: December 7, 2010Assignee: Au Optronics Corp.Inventors: Chien-Liang Chen, Chun-Yu Lee, Shih-Ping Chou
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Publication number: 20100134124Abstract: A misalignment detection device comprising a substrate, at least one integrated circuit (IC), and at least one detection unit is disclosed. The substrate comprises a first positioning pad and a second positioning pad adjacent to the first positioning pad. The integrated circuit is disposed on the substrate and comprises a first positioning bump and a second positioning bump adjacent to the first positioning bump. The first and second positioning bumps substantially correspond to the first and second positioning pads, respectively. The at least one detection unit is electrically coupled to the substrate, wherein the detection unit outputs a fault signal in response to a positioning shift occurring between the first and second positioning pads and the first and second positioning bumps.Type: ApplicationFiled: February 5, 2010Publication date: June 3, 2010Applicant: AU Optronics Corp.Inventors: Chun-Yu Lee, Shih-Ping Chou, Chien-Liang Chen, Wen-Hung Lai
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Patent number: 7683496Abstract: A misalignment detection device comprising a substrate, at least one integrated circuit (IC), and at least one detection unit is disclosed. The substrate comprises a first positioning pad and a second positioning pad adjacent to the first positioning pad. The integrated circuit is disposed on the substrate and comprises a first positioning bump and a second positioning bump adjacent to the first positioning bump. The first and second positioning bumps substantially correspond to the first and second positioning pads, respectively. The at least one detection unit is electrically coupled to the substrate, wherein the detection unit outputs a fault signal in response to a positioning shift occurring between the first and second positioning pads and the first and second positioning bumps.Type: GrantFiled: September 26, 2006Date of Patent: March 23, 2010Assignee: AU Optronics Corp.Inventors: Chun-Yu Lee, Shih-Ping Chou, Chien-Liang Chen, Wen-Hung Lai
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Publication number: 20100013415Abstract: A lamp detection driving system is disclosed for performing adaptive lamp driving and related detection operations based on a recipe. The system includes a micro-controller, a driver, a defect detection module and a feedback circuit. The micro-controller provides a modulation signal and a plurality of reference signals based on the recipe. The driver generates at least one driving signal for driving at least one lamp based on the modulation signal. The feedback circuit generates a plurality of feedback signals based on lamp currents or lamp voltages. The defect detection module generates a plurality of detection signals based on the reference signals and the feedback signals. Furthermore, disclosed is a lamp detection driving method including downloading the recipe, generating at least one driving signal for driving at least one lamp based on the recipe, and providing at least one reference signal for performing defect detection processes based on the recipe.Type: ApplicationFiled: October 6, 2008Publication date: January 21, 2010Inventors: Wei-Chung Chuang, Yung-Lung Hsuao, Shih-Ping Chou
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Patent number: 7626240Abstract: This invention provides a circuit bonding detection device, a detection method thereof and an electro-optical apparatus incorporating the circuit bonding detection device. The circuit bonding detection device includes a substrate, a circuit module, a set of sensors, and a detection unit. A plurality of contact pads is disposed on the substrate. The circuit module includes a plurality of conductive bumps corresponding to the contact pads. The sensors are disposed on two sides of at least one of contact pads or of the corresponding conductive bumps. The detection unit is electrically coupled with the set of sensors and transmits a fault signal when at least one of the contact pads and the corresponding conductive bumps deforms and contacts the sensors.Type: GrantFiled: May 2, 2008Date of Patent: December 1, 2009Assignee: AU Optronics CorporationInventors: Ying-Hung Tsai, Shih-Ping Chou, Ching-Yu Huang
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Publication number: 20080308894Abstract: This invention provides a circuit bonding detection device, a detection method thereof and an electro-optical apparatus incorporating the circuit bonding detection device. The circuit bonding detection device includes a substrate, a circuit module, a set of sensors, and a detection unit. A plurality of contact pads is disposed on the substrate. The circuit module includes a plurality of conductive bumps corresponding to the contact pads. The sensors are disposed on two sides of at least one of contact pads or of the corresponding conductive bumps. The detection unit is electrically coupled with the set of sensors and transmits a fault signal when at least one of the contact pads and the corresponding conductive bumps deforms and contacts the sensors.Type: ApplicationFiled: May 2, 2008Publication date: December 18, 2008Applicant: AU Optronics CorporationInventors: Ying-Hung Tsai, Shih-Ping Chou, Ching-Yu Huang
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Patent number: 7390734Abstract: A thin film transistor (TFT) substrate includes a glass substrate, a thin film transistor, an electrode pad, and a conductive bump. The TFT and the electrode pad are formed on the glass substrate, and the electrode pad is used for electrically connecting with the thin film transistor. The conductive bump includes several insulating bumps and a conductive layer. The insulating bumps are formed on the electrode pad dividedly, and the conductive layer covers the top surfaces of the insulating bumps, the inward surfaces of the insulating bumps, and the electrode pad between the insulating bumps for electrically connecting with the electrode pad. The outward side surfaces of the insulating bumps are exposed out of the conductive layer.Type: GrantFiled: June 4, 2007Date of Patent: June 24, 2008Assignee: AU Optronics Corp.Inventors: Hui-Chang Chen, Chun-Yu Lee, Shih-Ping Chou
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Publication number: 20080062664Abstract: A flexible printed circuit and a display module comprising the flexible printed circuit are disclosed. The display module comprises a display panel, a printed circuit board, and a flexible printed circuit. The flexible printed circuit electrically connects the display panel and the printed circuit board, and further comprises a flexible substrate and a cover lay. The flexible substrate has an upper surface and two opposite end portions. The cover lay is disposed on the upper surface of the flexible substrate and extends along a lengthwise direction of the flexible substrate. The cover lay further has two opposite sides each also extending along the lengthwise direction of the flexible substrate. Each of the sides has at least a partially continuous contour which is formed with a discontinuous status on at least one of the end portions.Type: ApplicationFiled: May 8, 2007Publication date: March 13, 2008Applicant: AU OPTRONICS CORP.Inventors: Chien-Liang Chen, Chun-Yu Lee, Shih-Ping Chou
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Publication number: 20080006952Abstract: A misalignment detection device comprising a substrate, at least one integrated circuit (IC), and at least one detection unit is disclosed. The substrate comprises a first positioning pad and a second positioning pad adjacent to the first positioning pad. The integrated circuit is disposed on the substrate and comprises a first positioning bump and a second positioning bump adjacent to the first positioning bump. The first and second positioning bumps substantially correspond to the first and second positioning pads, respectively. The at least one detection unit is electrically coupled to the substrate, wherein the detection unit outputs a fault signal in response to a positioning shift occurring between the first and second positioning pads and the first and second positioning bumps.Type: ApplicationFiled: September 26, 2006Publication date: January 10, 2008Applicant: AU OPTRONICS CORP.Inventors: Chun-Yu Lee, Shih-Ping Chou, Chien-Liang Chen, Wen-Hung Lai
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Publication number: 20070284138Abstract: A circuit board is provided. The circuit board includes a first metal layer, at least a second metal layer and at least an insulating layer. The first metal layer has at least a solder pad. The second metal layer does not overlap with the solder pad. The insulating layer is disposed between the second metal layer and the first metal layer.Type: ApplicationFiled: November 2, 2006Publication date: December 13, 2007Applicant: AU OPTRONICS CORP.Inventors: Chien-Liang Chen, Chun-Yu Lee, Shih-Ping Chou
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Publication number: 20070231982Abstract: A thin film transistor (TFT) substrate includes a glass substrate, a thin film transistor, an electrode pad, and a conductive bump. The TFT and the electrode pad are formed on the glass substrate, and the electrode pad is used for electrically connecting with the thin film transistor. The conductive bump includes several insulating bumps and a conductive layer. The insulating bumps are formed on the electrode pad dividedly, and the conductive layer covers the top surfaces of the insulating bumps, the inward surfaces of the insulating bumps, and the electrode pad between the insulating bumps for electrically connecting with the electrode pad. The outward side surfaces of the insulating bumps are exposed out of the conductive layer.Type: ApplicationFiled: June 4, 2007Publication date: October 4, 2007Applicant: AU OPTRONICS CORP.Inventors: Hui-Chang Chen, Chun-Yu Lee, Shih-Ping Chou
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Patent number: 7245012Abstract: A thin film transistor (TFT) substrate includes a glass substrate, a thin film transistor, an electrode pad, and a conductive bump. The TFT and the electrode pad are formed on the glass substrate, and the electrode pad is used for electrically connecting with the thin film transistor. The conductive bump includes several insulating bumps and a conductive layer. The insulating bumps are formed on the electrode pad dividedly, and the conductive layer covers the top surfaces of the insulating bumps, the inward surfaces of the insulating bumps, and the electrode pad between the insulating bumps for electrically connecting with the electrode pad. The outward side surfaces of the insulating bumps are exposed out of the conductive layer.Type: GrantFiled: June 28, 2004Date of Patent: July 17, 2007Assignee: AU Optronics Corp.Inventors: Hui-Chang Chen, Chun-Yu Lee, Shih-Ping Chou
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Publication number: 20050184389Abstract: A thin film transistor (TFT) substrate includes a glass substrate, a thin film transistor, an electrode pad, and a conductive bump. The TFT and the electrode pad are formed on the glass substrate, and the electrode pad is used for electrically connecting with the thin film transistor. The conductive bump includes several insulating bumps and a conductive layer. The insulating bumps are formed on the electrode pad dividedly, and the conductive layer covers the top surfaces of the insulating bumps, the inward surfaces of the insulating bumps, and the electrode pad between the insulating bumps for electrically connecting with the electrode pad. The outward side surfaces of the insulating bumps are exposed out of the conductive layer.Type: ApplicationFiled: June 28, 2004Publication date: August 25, 2005Inventors: Hui-Chang Chen, Chun-Yu Lee, Shih-Ping Chou