Abstract: A method of making a combination of a flexible printed circuit board (FPCB) and a rigid printed circuit board (RPCB), comprising steps of providing a RPCB; providing a FPCB having a panel and a hole formed through the FPCB; forming a solder layer located at the hole and between the RPCB and the FPCB; heating through the hole to melt the solder layer; and removing the heat source to solidify the solder layer to obtain a combination of the FPCB and the RPCB. Based on the steps above, there is no need to use any additional connection piece and fixture of the same and the manufacture cost is lowered. In addition, as a result that the solder layer is very thin, the combination made by the method accommodates less space and has extensive applicability.