Abstract: A semiconductor device includes a first stack structure, a second stack structure, and a third stack structure. Each of the stack structure includes semiconductor layers vertically spaced from one another. The first, second, and third stack structures all extend along a first lateral direction. The second stack structure is disposed between the first and third stack structures. The semiconductor device includes a first gate structure that extends along a second lateral direction and wraps around each of the semiconductor layers. The semiconductor layers of the first stack structure are coupled with respective source/drain structures. The semiconductor layers of the second stack structure are coupled with respective source/drain structures. The semiconductor layers of the third stack structure are coupled with a dielectric passivation layer.

Abstract: A memory device and a management method thereof are provided. The memory device includes a controller and at least one memory channel. The memory channel includes at least one memory chip. The at least one memory chip is commonly coupled to the controller through an interrupt signal wire. The at least one memory chip generates at least one local interrupt signal and performs a logic operation on the at least one local interrupt signal to generate a common interrupt signal. The interrupt signal wire is configured to transmit the common interrupt signal to the controller.

Abstract: A method includes etching a semiconductor substrate to form a trench, with the semiconductor substrate having a sidewall facing the trench, and depositing a first semiconductor layer extending into the trench. The first semiconductor layer includes a first bottom portion at a bottom of the trench, and a first sidewall portion on the sidewall of the semiconductor substrate. The first sidewall portion is removed to reveal the sidewall of the semiconductor substrate. The method further includes depositing a second semiconductor layer extending into the trench, with the second semiconductor layer having a second bottom portion over the first bottom portion, and a second sidewall portion contacting the sidewall of the semiconductor substrate. The second sidewall portion is removed to reveal the sidewall of the semiconductor substrate.

Abstract: A semiconductor device includes a plurality of channel layers vertically separated from one another. The semiconductor device also includes an active gate structure comprising a lower portion and an upper portion. The lower portion wraps around each of the plurality of channel layers. The semiconductor device further includes a gate spacer extending along a sidewall of the upper portion of the active gate structure. The gate spacer has a bottom surface. Moreover, a dummy gate dielectric layer is disposed between the gate spacer and a topmost channel layer of plurality of channel layers. The dummy gate dielectric layer is in contact with a top surface of the topmost channel layer, the bottom surface of the gate spacer, and the sidewall of the gate structure.

Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.

Abstract: A semiconductor structure includes a first tier, a redistribution circuit structure, and a second tier. The first tier includes at least one first die. The redistribution circuit structure is disposed on the first tier and electrically coupled to the at least one first die, where the redistribution circuit structure has a multi-layer structure and includes a vertical connection structure continuously extending from a first side of the redistribution circuit structure to a second side of the redistribution circuit structure, and the first side is opposite to the second side along a stacking direction of the first tier and the redistribution circuit structure. The second tier includes a plurality of second dies, and is disposed on and electrically coupled to the redistribution circuit structure.

Abstract: A method of fabricating a semiconductor device is disclosed. The method includes forming semiconductor fins on a substrate. A first dummy gate is formed over the semiconductor fins. A recess is formed in the first dummy gate, and the recess is disposed between the semiconductor fins. A dummy fin material is formed in the recess. A portion of the dummy fin material is removed to expose an upper surface of the first dummy gate and to form a dummy fin. A second dummy gate is formed on the exposed upper surface of the first dummy gate.

Abstract: Applications of butylidenephthalide (BP), comprising the use of BP in providing a kit for promoting differentiation of stem cells into brown adipose cells, and the use of BP in preparing a medicament, wherein the medicament is used for inhibiting the accumulation of white adipose cells, promoting the conversion of white adipose cells into brown adipose cells, inhibiting weight gain and/or reducing the content of triglycerides, glucose, and total cholesterol in blood.

Abstract: A package structure and a formation method are provided. The method includes disposing a first chip structure and a second chip structure over a carrier substrate. The method also includes forming an interconnection structure directly over and contacting the first chip structure and the second chip structure. The interconnection structure has multiple dielectric layers and multiple conductive features. One of the conductive features extends across a first edge of the first chip structure and a second edge of the second chip structure and is electrically connecting the first chip structure and the second chip structure. The method further includes directly bonding a third chip structure to the interconnection structure through dielectric-to-dielectric bonding and metal-to-metal bonding.

Abstract: An artificial intervertebral disc is configured to be inserted between adjacent human vertebrae. The artificial intervertebral disc includes a first connection block, a joint block and a second connection block. The joint block has a convex surface and a rear surface. The rear surface of the joint block is stacked on the first connection block. The second connection block is slidably stacked on the convex surface of the joint block, such that the second connection block is movable relative to the first connection block. In addition, the convex surface is a curved surface, and the convex surface is arranged off-axis with respect to the rear surface.

Abstract: An artificial intervertebral disc is configured to be inserted between adjacent human vertebrae. The artificial intervertebral disc includes a first connection block, a joint block and a second connection block. The joint block has a convex surface and a rear surface. The rear surface of the joint block is stacked on the first connection block. The second connection block is slidably stacked on the convex surface of the joint block, such that the second connection block is movable relative to the first connection block. In addition, the convex surface is a curved surface, and the convex surface is arranged off-axis with respect to the rear surface.

Abstract: This disclosure relates to a display device which includes a light transmissible layer and a second material. The light transmissible layer includes a first material, wherein the first material generates a first color transformation from a first color to a second color after being exposed under a light of the first wavelength range. The second material is either included in the light transmissible layer or has a projective area overlapped with the light transmissible layer. The second material generates a second color transformation from the second color to the first color after being exposed under a light of the first wavelength range.

Abstract: A low-profile offset-type spinal fusion device includes a first screw, a connection base, a nut and a compression part. The first screw has an external thread and a flange. The connection base includes a penetration part and a connection part disposed no higher than the penetration part, and can sleeve the first screw through a first hole of the penetration part to contact the flange with opposite ends of the first screw protruding out of the first hole. The nut, used to engage the first screw, has a bottom surface to contact against the penetration part. When the first screw is installed by penetrating the first hole, the nut and the flange are located to opposite ends of the first hole. The compression part is to screw into a cavity of the connection part for depressing a connecting bar tightly in the cavity.

Abstract: A bone screw includes an external screw thread, an internal supporter structure and a porous layer. The internal supporter structure is inside the external screw thread. The internal supporter structure includes a screw thread supporter or a polygonal wall supporter. The porous layer is on a surface of the internal supporter structure. Therefore, the bone screw has an increased strength and also provides postoperative healing effect.

Abstract: A low-profile offset-type spinal fusion device includes a first screw, a connection base, a nut and a compression part. The first screw has an external thread and a flange. The connection base includes a penetration part and a connection part disposed no higher than the penetration part, and can sleeve the first screw through a first hole of the penetration part to contact the flange with opposite ends of the first screw protruding out of the first hole. The nut, used to engage the first screw, has a bottom surface to contact against the penetration part. When the first screw is installed by penetrating the first hole, the nut and the flange are located to opposite ends of the first hole. The compression part is to screw into a cavity of the connection part for depressing a connecting bar tightly in the cavity.

Abstract: One embodiment of the disclosure relates to a flexible bone fixation device including two first fixation parts and a first flexible spanning part, connected between the two first fixation parts. The first flexible spanning part has a plurality of first cuts spaced apart by one another.

Abstract: A bone implant includes at least one spiral and at least one pillar. The spiral surrounds an accommodating space. The pillar is disposed in the accommodating space and connected to the spiral. The pillar has at least one notch.

Abstract: The disclosure provides a use of hydrogel composition for alleviating degenerative joint and tendon tear. The hydrogel composition includes 100 parts by weight of therapeutic agent and 120-380 parts by weight of biodegradable copolymer, wherein the therapeutic agent comprises platelet-rich plasma (PRP), doxorubicin, transforming growth factor, bovine serum albumin, or a combination thereof. The biodegradable copolymer has a structure of Formula (I) or Formula (II): wherein A is a hydrophilic polyethylene glycol polymer; B is a hydrophobic polyester polymer; BOX is a bifunctional group monomer of 2, 2?-bis(2-oxazoline) used for coupling the blocks A-B or B-A-B; and n is 0 or an integer greater than 0.

Abstract: This disclosure relates to a display device which includes a light transmissible layer and a second material. The light transmissible layer includes a first material, wherein the first material generates a first color transformation from a first color to a second color after being exposed under a light of the first wavelength range. The second material is either included in the light transmissible layer or has a projective area overlapped with the light transmissible layer. The second material generates a second color transformation from the second color to the first color after being exposed under a light of the first wavelength range.

Abstract: A bone implant includes at least one spiral and at least one pillar. The spiral surrounds an accommodating space. The pillar is disposed in the accommodating space and connected to the spiral. The pillar has at least one notch.