Patents by Inventor Shih-Ping Lin
Shih-Ping Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240206193Abstract: A package structure and a formation method are provided. The method includes bonding a first memory-containing chip structure to a second memory-containing chip structure through dielectric-to-dielectric bonding and metal-to-metal bonding. The method also includes bonding a logic control chip structure to the second memory-containing chip structure through dielectric-to-dielectric bonding and metal-to-metal bonding. The logic control chip structure is formed using a more advanced technology node than the second memory-containing chip structure.Type: ApplicationFiled: January 9, 2023Publication date: June 20, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chuei-Tang WANG, Tso-Jung CHANG, Wen-Shiang LIAO, Jeng-Shien HSIEH, Chih-Peng LIN, Shih-Ping LIN, Chieh-Yen CHEN, Chen-Hua YU
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Publication number: 20240203918Abstract: A chip stack structure is provided. The chip stack structure includes a first chip including a first substrate and a first interconnect structure over the first substrate. The chip stack structure includes a second chip over and bonded to the first chip. The second chip has a second interconnect structure and a second substrate over the second interconnect structure. The chip stack structure includes an insulating layer over the second interconnect structure and surrounding the second substrate. The chip stack structure includes a conductive plug penetrating through the insulating layer to the second interconnect structure.Type: ApplicationFiled: January 6, 2023Publication date: June 20, 2024Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Chuei-Tang WANG, Tso-Jung CHANG, Shih-Ping LIN, Jeng-Shien HSIEH, Chih-Peng LIN, Chieh-Yen CHEN, Chen-Hua YU
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Publication number: 20240079392Abstract: A semiconductor structure includes a first tier, a redistribution circuit structure, and a second tier. The first tier includes at least one first die. The redistribution circuit structure is disposed on the first tier and electrically coupled to the at least one first die, where the redistribution circuit structure has a multi-layer structure and includes a vertical connection structure continuously extending from a first side of the redistribution circuit structure to a second side of the redistribution circuit structure, and the first side is opposite to the second side along a stacking direction of the first tier and the redistribution circuit structure. The second tier includes a plurality of second dies, and is disposed on and electrically coupled to the redistribution circuit structure.Type: ApplicationFiled: January 10, 2023Publication date: March 7, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chuei-Tang WANG, Tso-Jung Chang, Jeng-Shien Hsieh, Shih-Ping Lin, Chih-Peng Lin, Chieh-Yen Chen, Chen-Hua Yu
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Publication number: 20240047365Abstract: A package structure and a formation method are provided. The method includes disposing a first chip structure and a second chip structure over a carrier substrate. The method also includes forming an interconnection structure directly over and contacting the first chip structure and the second chip structure. The interconnection structure has multiple dielectric layers and multiple conductive features. One of the conductive features extends across a first edge of the first chip structure and a second edge of the second chip structure and is electrically connecting the first chip structure and the second chip structure. The method further includes directly bonding a third chip structure to the interconnection structure through dielectric-to-dielectric bonding and metal-to-metal bonding.Type: ApplicationFiled: January 5, 2023Publication date: February 8, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chuei-Tang WANG, Tso-Jung CHANG, Jeng-Shien HSIEH, Shih-Ping LIN, Chieh-Yen CHEN, Chen-Hua YU
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Patent number: 11801146Abstract: An artificial intervertebral disc is configured to be inserted between adjacent human vertebrae. The artificial intervertebral disc includes a first connection block, a joint block and a second connection block. The joint block has a convex surface and a rear surface. The rear surface of the joint block is stacked on the first connection block. The second connection block is slidably stacked on the convex surface of the joint block, such that the second connection block is movable relative to the first connection block. In addition, the convex surface is a curved surface, and the convex surface is arranged off-axis with respect to the rear surface.Type: GrantFiled: December 14, 2021Date of Patent: October 31, 2023Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Fang-Chieh Chang, Pei-I Tsai, Shih-Ping Lin, Ming-Jun Li, Chih-Chieh Huang, Hsin-Hsin Shen, Meng-Huang Wu
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Publication number: 20230172720Abstract: An artificial intervertebral disc is configured to be inserted between adjacent human vertebrae. The artificial intervertebral disc includes a first connection block, a joint block and a second connection block. The joint block has a convex surface and a rear surface. The rear surface of the joint block is stacked on the first connection block. The second connection block is slidably stacked on the convex surface of the joint block, such that the second connection block is movable relative to the first connection block. In addition, the convex surface is a curved surface, and the convex surface is arranged off-axis with respect to the rear surface.Type: ApplicationFiled: December 14, 2021Publication date: June 8, 2023Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Fang-Chieh CHANG, Pei-I TSAI, Shih-Ping LIN, Ming-Jun LI, Chih-Chieh HUANG, Hsin-Hsin SHEN, Meng-Huang WU
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Patent number: 11619845Abstract: This disclosure relates to a display device which includes a light transmissible layer and a second material. The light transmissible layer includes a first material, wherein the first material generates a first color transformation from a first color to a second color after being exposed under a light of the first wavelength range. The second material is either included in the light transmissible layer or has a projective area overlapped with the light transmissible layer. The second material generates a second color transformation from the second color to the first color after being exposed under a light of the first wavelength range.Type: GrantFiled: July 17, 2020Date of Patent: April 4, 2023Assignee: AU OPTRONICS CORPORATIONInventor: Shih-Ping Lin
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Patent number: 11596450Abstract: A low-profile offset-type spinal fusion device includes a first screw, a connection base, a nut and a compression part. The first screw has an external thread and a flange. The connection base includes a penetration part and a connection part disposed no higher than the penetration part, and can sleeve the first screw through a first hole of the penetration part to contact the flange with opposite ends of the first screw protruding out of the first hole. The nut, used to engage the first screw, has a bottom surface to contact against the penetration part. When the first screw is installed by penetrating the first hole, the nut and the flange are located to opposite ends of the first hole. The compression part is to screw into a cavity of the connection part for depressing a connecting bar tightly in the cavity.Type: GrantFiled: August 31, 2021Date of Patent: March 7, 2023Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Hsin-Hsin Shen, Pei-I Tsai, Chih-Chieh Huang, Kuo-Yi Yang, Yi-Hung Wen, Wei-Lun Fan, Fang-Jie Jang, Shih-Ping Lin
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Publication number: 20220175432Abstract: A bone screw includes an external screw thread, an internal supporter structure and a porous layer. The internal supporter structure is inside the external screw thread. The internal supporter structure includes a screw thread supporter or a polygonal wall supporter. The porous layer is on a surface of the internal supporter structure. Therefore, the bone screw has an increased strength and also provides postoperative healing effect.Type: ApplicationFiled: December 4, 2020Publication date: June 9, 2022Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Hsin-Hsin SHEN, Pei-I TSAI, Kuo-Yi YANG, Fang-Jie JANG, An-Li CHEN, Shih-Ping LIN, Chih-Chieh HUANG, Yi-Hung WEN, Wei-Lun FAN, Shin-I HUANG
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Publication number: 20220175423Abstract: A low-profile offset-type spinal fusion device includes a first screw, a connection base, a nut and a compression part. The first screw has an external thread and a flange. The connection base includes a penetration part and a connection part disposed no higher than the penetration part, and can sleeve the first screw through a first hole of the penetration part to contact the flange with opposite ends of the first screw protruding out of the first hole. The nut, used to engage the first screw, has a bottom surface to contact against the penetration part. When the first screw is installed by penetrating the first hole, the nut and the flange are located to opposite ends of the first hole. The compression part is to screw into a cavity of the connection part for depressing a connecting bar tightly in the cavity.Type: ApplicationFiled: August 31, 2021Publication date: June 9, 2022Inventors: HSIN-HSIN SHEN, PEI-I TSAI, CHIH-CHIEH HUANG, KUO-YI YANG, YI-HUNG WEN, WEI-LUN FAN, FANG-JIE JANG, SHIH-PING LIN
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Publication number: 20220079639Abstract: One embodiment of the disclosure relates to a flexible bone fixation device including two first fixation parts and a first flexible spanning part, connected between the two first fixation parts. The first flexible spanning part has a plurality of first cuts spaced apart by one another.Type: ApplicationFiled: December 4, 2020Publication date: March 17, 2022Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Fang-Jie JANG, Pei-I TSAI, An-Li CHEN, Wei-Lun FAN, Shih-Ping LIN, Yi-Hung WEN, De-Yau LIN, Shun-Mao YANG, Ying-Hao SU, Huan-Jang KO
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Patent number: 11141262Abstract: A bone implant includes at least one spiral and at least one pillar. The spiral surrounds an accommodating space. The pillar is disposed in the accommodating space and connected to the spiral. The pillar has at least one notch.Type: GrantFiled: December 21, 2018Date of Patent: October 12, 2021Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Pei-I Tsai, Hsin-Hsin Shen, Kuo-Yi Yang, Chih-Chieh Huang, Shih-Ping Lin, De-Yau Lin
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Publication number: 20210085606Abstract: The disclosure provides a use of hydrogel composition for alleviating degenerative joint and tendon tear. The hydrogel composition includes 100 parts by weight of therapeutic agent and 120-380 parts by weight of biodegradable copolymer, wherein the therapeutic agent comprises platelet-rich plasma (PRP), doxorubicin, transforming growth factor, bovine serum albumin, or a combination thereof. The biodegradable copolymer has a structure of Formula (I) or Formula (II): wherein A is a hydrophilic polyethylene glycol polymer; B is a hydrophobic polyester polymer; BOX is a bifunctional group monomer of 2, 2?-bis(2-oxazoline) used for coupling the blocks A-B or B-A-B; and n is 0 or an integer greater than 0.Type: ApplicationFiled: December 7, 2020Publication date: March 25, 2021Applicant: Industrial Technology Research InstituteInventors: Hsin-Hsin SHEN, Wen-Shiang CHEN, Chueh-Hung WU, Ming-Kuan SUN, Yu-Chi WANG, Sen-Lu CHEN, Wei-Lin YU, Lih-Tao HSU, Shih-Ping LIN
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Publication number: 20210088847Abstract: This disclosure relates to a display device which includes a light transmissible layer and a second material. The light transmissible layer includes a first material, wherein the first material generates a first color transformation from a first color to a second color after being exposed under a light of the first wavelength range. The second material is either included in the light transmissible layer or has a projective area overlapped with the light transmissible layer. The second material generates a second color transformation from the second color to the first color after being exposed under a light of the first wavelength range.Type: ApplicationFiled: July 17, 2020Publication date: March 25, 2021Inventor: Shih-Ping LIN
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Publication number: 20200197155Abstract: A bone implant includes at least one spiral and at least one pillar. The spiral surrounds an accommodating space. The pillar is disposed in the accommodating space and connected to the spiral. The pillar has at least one notch.Type: ApplicationFiled: December 21, 2018Publication date: June 25, 2020Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Pei-I TSAI, Hsin-Hsin SHEN, Kuo-Yi YANG, Chih-Chieh HUANG, Shih-Ping LIN, De-Yau LIN
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Patent number: 10491006Abstract: A hand-held apparatus and a method for power charging management thereof are provided. The method for power charging management includes: providing a power charging voltage and a power charging current to perform a power charging process to the hand-held apparatus, and simultaneously detecting a surface temperature of the hand-held apparatus during the power charging process; activating a power charging management mechanism when the surface temperature is higher than a reference temperature, and simultaneously reducing a voltage value of the power charging voltage; and generating a comparing result by comparing the surface temperature with a plurality of threshold temperatures after the power charging management mechanism is activated, and adjusting a current value of the power charging current based on the comparing result. The reference temperature is lower than the plurality of threshold temperatures and values of the plurality of threshold temperatures are not the same.Type: GrantFiled: October 17, 2017Date of Patent: November 26, 2019Assignee: HTC CorporationInventors: Chuan-Li Wu, Chia-Ming Chang, Shih-Ping Lin
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Publication number: 20190201061Abstract: An expandable orthopedic implant includes a casing pipe, a shaft, a first expandable element and a first link lever. The casing pipe has a first opening, a second opening and an axis passing through the first and second opening. The casing pipe sheathes one end of the shaft, and the other end of the shaft has a top portion disposed out of the first opening. The first expandable element has a first terminal pivoted on the casing pipe and a second terminal. The first link lever has a proximal end pivoted to the top portion and a distal end pivoted to the second terminal. When the top portion is driven moving away from the first opening along an extending direction of the axis, the first link-lever can be pushed by the shaft to enact the second terminal moving away from the axis along a direction perpendicular to the axis.Type: ApplicationFiled: December 28, 2017Publication date: July 4, 2019Applicants: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE, National Taiwan University HospitalInventors: Pei-I TSAI, Hsin-Hsin SHEN, Kuo-Yi YANG, Shih-Ping LIN, Jui-Sheng SUN, Chih-Yu CHEN, Yu-Tsung CHIU, Chun-Ti CHEN, De-Yau LIN, An-Li CHEN
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Publication number: 20190192437Abstract: The disclosure provides a powder form and a hydrogel composition for alleviating degenerative joint and tendon tear. The powder form consists essentially of a 120-380 parts by weight biodegradable copolymer; 15-75 parts by weight urea; and 100 parts by weight platelet-rich plasma; wherein the biodegradable copolymer has a structure of formula (I) or formula (II): wherein A comprises a hydrophilic polyethylene glycol polymer; B comprises a hydrophobic polyester polymer; BOX is bifunctional group monomer of 2, 2?-bis(2-oxazoline) used for coupling the blocks AB or BAB; and n is an integer greater than or equal to 0.Type: ApplicationFiled: December 27, 2017Publication date: June 27, 2019Applicant: Industrial Technology Research InstituteInventors: Hsin-Hsin SHEN, Wen-Shiang CHEN, Chueh-Hung WU, Ming-Kuan SUN, Yu-Chi WANG, Sen-Lu CHEN, Wei-Lin YU, Lih-Tao HSU, Shih-Ping LIN
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Publication number: 20190115764Abstract: A hand-held apparatus and a method for power charging management thereof are provided. The method for power charging management includes: providing a power charging voltage and a power charging current to perform a power charging process to the hand-held apparatus, and simultaneously detecting a surface temperature of the hand-held apparatus during the power charging process; activating a power charging management mechanism when the surface temperature is higher than a reference temperature, and simultaneously reducing a voltage value of the power charging voltage; and generating a comparing result by comparing the surface temperature with a plurality of threshold temperatures after the power charging management mechanism is activated, and adjusting a current value of the power charging current based on the comparing result. The reference temperature is lower than the plurality of threshold temperatures and values of the plurality of threshold temperatures are not the same.Type: ApplicationFiled: October 17, 2017Publication date: April 18, 2019Applicant: HTC CorporationInventors: Chuan-Li Wu, Chia-Ming Chang, Shih-Ping Lin
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Patent number: 10122193Abstract: A portable device is provided. The portable device includes a battery unit, a charger circuit, a detecting unit and a processing unit. The charger circuit provides a charging current to charge the battery unit according to an input power and adjusts the charging current to a charging value according to a first control signal. The detecting unit detects and obtains an instantaneous operating current, an instantaneous charging current and a system temperature in the portable device. The processing unit provides the first control signal according to the instantaneous operating current, the instantaneous charging current and the system temperature.Type: GrantFiled: May 23, 2014Date of Patent: November 6, 2018Assignee: HTC CORPORATIONInventor: Shih-Ping Lin