Abstract: An advanced reverse treated electrodeposited copper foil and a copper clad laminate using the same are provided. The advanced reverse treated electrodeposited copper foil has an uneven micro-roughened surface. The micro-roughened surface has a plurality of copper crystals, a plurality of copper whiskers and a plurality of copper crystal groups, which are in a non-uniform distribution to form a non-uniformly distributed horizontal or vertical stripe pattern.

Abstract: An advanced electrodeposited copper foil having island-shaped microstructures and a copper clad laminate using the same are provided. The advanced electrodeposited copper foil includes a micro-roughened surface. The micro-roughened surface has a plurality of copper crystals, a plurality of copper whiskers and a plurality of copper crystal groups which are in a non-uniform distribution and form into island-shaped patterns.

Abstract: An advanced electrodeposited copper foil and a copper clad laminate using the same are provided. The advanced electrodeposited copper foil has an uneven micro-roughened surface. As observed by a scanning electron microscope operated with a +35 degree tilt and under 1,000× magnification, the uneven micro-roughened surface has a plurality of production direction stripes formed by copper crystals.

Abstract: Provided is a micro-roughened electrodeposited copper foil, which comprises a micro-rough surface and multiple copper nodules. The micro-roughened electrodeposited copper foil has an Rlr value of 1.05 to 1.60, or an Sdr of 0.01 to 0.08. With the surface characteristics, the electron path distance can be shortened, such that the micro-roughened electrodeposited copper foil can reduce the insertion loss of the copper clad laminate at high frequencies and have the desired peel strength.

Abstract: An advanced electrodeposited copper foil and a copper clad laminate using the same are provided. The advanced electrodeposited copper foil has an uneven micro-roughened surface. As observed by a scanning electron microscope operated with a +35 degree tilt and under 1,000× magnification, the uneven micro-roughened surface has a plurality of production direction stripes formed by copper crystals.

Abstract: Provided is a micro-roughened electrodeposited copper foil, which comprises a micro-rough surface and multiple copper nodules. The micro-rough surface includes multiple copper nodule-free areas and copper nodule-arranged areas. The micro-rough surface of 120 ?m2 has at least five copper nodule-free areas of 62500 nm2 or more. Each copper nodule-arranged area has a length of 300 nm to 2500 nm and includes three to fifty copper nodules with a mean width of 10 nm to 300 nm. Besides, the micro-roughened electrodeposited copper foil has an Rlr value of 1.05 to 1.60, or an Sdr of 0.01 to 0.08. With the surface profile and/or characteristics, the electron path distance can be shortened, such that the micro-roughened electrodeposited copper foil can reduce the insertion loss of the copper clad laminate at high frequencies and have the desired peel strength.

Abstract: An advanced electrodeposited copper foil having long and island-shaped microstructures and a copper clad laminate using the same are provided. The advanced electrodeposited copper foil includes a micro-roughened surface. The micro-roughened surface has a plurality of copper crystals, a plurality of copper whiskers and a plurality of copper crystal groups which are in a non-uniform distribution and form into a long and island-shaped pattern.

Abstract: An advanced reverse treated electrodeposited copper foil and a copper clad laminate using the same are provided. The advanced reverse treated electrodeposited copper foil has an uneven micro-roughened surface. The micro-roughened surface has a plurality of copper crystals, a plurality of copper whiskers and a plurality of copper crystal groups, which are in a non-uniform distribution to form a non-uniformly distributed horizontal or vertical stripe pattern.