Abstract: A stacked integrated circuit (IC) device and a method are disclosed. The stacked IC device includes a first semiconductor element. The first substrate includes a dielectric block in the first substrate; and a plurality of first conductive features formed in first inter-metal dielectric layers over the first substrate. The stacked IC device also includes a second semiconductor element bonded on the first semiconductor element. The second semiconductor element includes a second substrate and a plurality of second conductive features formed in second inter-metal dielectric layers over the second substrate. The stacked IC device also includes a conductive deep-interconnection-plug coupled between the first conductive features and the second conductive features. The conductive deep-interconnection-plug is isolated by dielectric block, the first inter-metal-dielectric layers and the second inter-metal-dielectric layers.

Abstract: An apparatus for use in reversing front seat of a multi-seat stroller comprises a seat, two parallel arms, two joint members, two connection members, and a backrest. The seat is mounted on a predetermined position of two parallel branch tubes located at lower side of the framework of the stroller. The two parallel arms are pivotally mounted on two parallel branch tubes at the position corresponding to the center of the seat. Two joint members are separately and pivotally mounted on the free ends of two parallel arms. Two connection members are pivotally mounted under the two joint members so that two joint members can be detachably fastened to the two parallel branch tubes. The backrest is pivotally mounted at lower ends of both sides thereof to the two joint members in such a manner that the pivotal angle of the backrest and the seat can be adjusted.