Patents by Inventor Shih Sian Wang

Shih Sian Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Image sensor device and methods of forming the same
    Patent number: 12261188
    Abstract: A device is disclosed. The device includes a plurality of pixels disposed over a first surface of a semiconductor layer. The device includes a device layer disposed over the first surface. The device includes metallization layers disposed over the device layer. One of the metallization layers, closer to the first surface than any of other ones of the metallization layers, includes at least one conductive structure. The device includes an oxide layer disposed over a second surface of the semiconductor layer, the second surface being opposite to the first surface, the oxide layer also lining a recess that extends through the semiconductor layer. The device includes a spacer layer disposed between inner sidewalls of the recess and the oxide layer. The device includes a pad structure extending through the oxide layer and the device layer to be in physical contact with the at least one conductive structure.
    Type: Grant
    Filed: April 17, 2023
    Date of Patent: March 25, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Keng-Ying Liao, Yu-Chu Lin, Chih Wei Sung, Shih Sian Wang, Chi-Chung Jen, Yu-chien Ku, Yen-Jou Wu, Huai-jen Tung, Po-Zen Chen
  • IMAGE SENSOR DEVICE AND METHODS OF FORMING THE SAME
    Publication number: 20230253433
    Abstract: A device is disclosed. The device includes a plurality of pixels disposed over a first surface of a semiconductor layer. The device includes a device layer disposed over the first surface. The device includes metallization layers disposed over the device layer. One of the metallization layers, closer to the first surface than any of other ones of the metallization layers, includes at least one conductive structure. The device includes an oxide layer disposed over a second surface of the semiconductor layer, the second surface being opposite to the first surface, the oxide layer also lining a recess that extends through the semiconductor layer. The device includes a spacer layer disposed between inner sidewalls of the recess and the oxide layer. The device includes a pad structure extending through the oxide layer and the device layer to be in physical contact with the at least one conductive structure.
    Type: Application
    Filed: April 17, 2023
    Publication date: August 10, 2023
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Keng-Ying Liao, Yu-Chu Lin, Chih Wei Sung, Shih Sian Wang, Chi-Chung Jen, Yu-chien Ku, Yen-Jou Wu, Huai-jen Tung, Po-Zen Chen