Patents by Inventor Shih-Ta WEN

Shih-Ta WEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230299091
    Abstract: An electronic device is provided. The electronic device includes a substrate, a plurality of first pads, a plurality of second pads, a first data line and a touch signal line. The substrate has a first bonding area and a second bonding area. The first pads are disposed in the first bonding area and arranged along a first direction. The second pads are disposed in the second bonding area and arranged along a second direction. There is an included angle between the first direction and the second direction. The first data line is disposed on the substrate and electrically connected to at least one of the first pads or the second pads. The touch signal line is disposed on the substrate and electrically connected to at least another one of the first pads or the second pads. The first data line at least partially overlaps the touch signal line.
    Type: Application
    Filed: February 3, 2023
    Publication date: September 21, 2023
    Inventors: Jia-Yan LAN, Shih-Ta WEN, Jian-Ming CHEN