Patents by Inventor Shih-Tai Hung

Shih-Tai Hung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11975421
    Abstract: The present disclosure provides a chemical mechanical polishing system having a unitary platen. The platen includes one or more recesses within the platen to house various components for the polishing/planarization process. In one embodiment, the platen includes a first recess and a second recess. The first recess is located under the second recess. An end point detector is placed in the first recess and a detector cover may be placed in the second recess. A sealing mean is provided in a space between the end point detector and the detector cover to prevent any external or foreign materials from coming in contact with the end point detector. A fastener used for fastening the detector cover to the platen also provides addition protection to prevent foreign materials from coming in contact with components received in the recesses.
    Type: Grant
    Filed: January 3, 2023
    Date of Patent: May 7, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Tsung-Lung Lai, Cheng-Ping Chen, Shih-Chung Chen, Sheng-Tai Peng, Rong-Long Hung
  • Patent number: 11953956
    Abstract: A replaceable frame assembly is disclosed, which comprises: a base plate, a first fixing unit, a second fixing unit, a front panel, at least one first electrical connection interface, a second electrical connection interface, a third electrical connection interface, and a fixation plate. The replaceable frame assembly is adopted for accommodating an expansion card module, and can be disposed in a case of an electronic device. After being disposed in the case, an electrical connection end of the first electrical connection interface is embedded into an electrical slot that is disposed on a main board, such that the expansion card module communicates with the main board through the second electrical connection interface, the third electrical connection interface, the first electrical connection interface, and the electrical slot, thereby making the expansion card module become a functional electronic module of the electronic device.
    Type: Grant
    Filed: April 27, 2022
    Date of Patent: April 9, 2024
    Assignee: LANNER ELECTRONICS INC.
    Inventor: Shih-Tai Hung
  • Publication number: 20230099973
    Abstract: A replaceable frame assembly is disclosed, which comprises: a base plate, a first fixing unit, a second fixing unit, a front panel, at least one first electrical connection interface, a second electrical connection interface, a third electrical connection interface, and a fixation plate. The replaceable frame assembly is adopted for accommodating an expansion card module, and can be disposed in a case of an electronic device. After being disposed in the case, an electrical connection end of the first electrical connection interface is embedded into an electrical slot that is disposed on a main board, such that the expansion card module communicates with the main board through the second electrical connection interface, the third electrical connection interface, the first electrical connection interface, and the electrical slot, thereby making the expansion card module become a functional electronic module of the electronic device.
    Type: Application
    Filed: April 27, 2022
    Publication date: March 30, 2023
    Applicant: LANNER ELECTRONICS INC.
    Inventor: Shih-Tai Hung
  • Patent number: 11604496
    Abstract: A mobile communication device is disclosed, and is modularized to include an electronic device for performing mobile communication and a frame assembly. The frame assembly comprises a circuit board having an electrical connection interface and a frame having a recess for receiving the electronic device. In addition, a first electrical connector is disposed on a side wall of the recess, and the electronic device has a second electrical connector connected to the first electrical connector, such that the electronic device coupled to the circuit board via the forgoing two electrical connectors. By inserting the mobile communication device into an accommodation space in a casing of a host electronic device, the electrical connection interface is inserted into an electrical slot that is arranged in a printed circuit board in the casing, thereby achieving a function expansion of mobile communication for the host electronic device.
    Type: Grant
    Filed: August 27, 2021
    Date of Patent: March 14, 2023
    Assignee: LANNER ELECTRONICS INC.
    Inventors: Shih-Tai Hung, Hsiang-Chun Tseng
  • Publication number: 20220283613
    Abstract: A mobile communication device is disclosed, and is modularized to include an electronic device for performing mobile communication and a frame assembly. The frame assembly comprises a circuit board having an electrical connection interface and a frame having a recess for receiving the electronic device. In addition, a first electrical connector is disposed on a side wall of the recess, and the electronic device has a second electrical connector connected to the first electrical connector, such that the electronic device coupled to the circuit board via the forgoing two electrical connectors. By inserting the mobile communication device into an accommodation space in a casing of a host electronic device, the electrical connection interface is inserted into an electrical slot that is arranged in a printed circuit board in the casing, thereby achieving a function expansion of mobile communication for the host electronic device.
    Type: Application
    Filed: August 27, 2021
    Publication date: September 8, 2022
    Applicant: LANNER ELECTRONICS INC.
    Inventor: Shih-Tai Hung