Abstract: An information handling system may include a main chassis and a motherboard-less expansion chassis. The main chassis may include a host system motherboard and a first host interconnect card. The motherboard-less expansion chassis may include a second host interconnect card communicatively coupled to the first interconnect card via an external cable having one or more in-band signal channels and one or more sideband signal channels, a first information handling resource configured to communicate data with the host system motherboard via the one or more in-band signal channels, and a second information handling resource configured to communicate control signals with the host system motherboard via the one or more sideband signal channels.

Abstract: An information handling system may include a main chassis and a motherboard-less expansion chassis. The main chassis may include a host system motherboard and a first host interconnect card. The motherboard-less expansion chassis may include a second host interconnect card communicatively coupled to the first interconnect card via an external cable having one or more in-band signal channels and one or more sideband signal channels, a first information handling resource configured to communicate data with the host system motherboard via the one or more in-band signal channels, and a second information handling resource configured to communicate control signals with the host system motherboard via the one or more sideband signal channels.

Abstract: A method and apparatus for measuring the temperature of a computer system provides a first temperature sensor, positioned around or on a CPU, for sensing the temperature of the CPU or around the CPU. A first A/D converter is used to convert the temperature sensed by the first temperature sensor into a first temperature value. At least one second temperature sensor, positioned inside the housing, senses the temperature around the housing. At least one second A/D converter converts the temperature sensed by die second temperature sensor into a second temperature value. The first temperature value and second temperature value are input to a control circuit, and a suitable value to output a control signal for controlling the speed of the fan is chosen so as to precede the heat dissipating of the computer system.

Abstract: The present invention provides a framework configuration of a computer host, framework configuration of a computer host, which comprises: a mainframe, having a bottom plate on it's bottom portion; a motherboard, positioned above the bottom plate of the mainframe, having at least a CPU slot and a power input outlet thereon; a storage device holder, stacked over a space that is above the motherboard for positioning a storage device; and a cover, for covering over the mainframe.

Abstract: The present invention provides a method for measuring the temperature of a computer system, which comprising the steps of: providing a first temperature sensor, positioned around or on a CPU, for sensing the temperature of the CPU or around the CPU; using a first A/D converter to convert the temperature sensed by the first temperature sensor into a first temperature value; providing at least one second temperature sensor, positioned certain position inside the housing, for sensing the temperature around the housing; using at least one second A/D converter to convert the temperature sensed by the second temperature sensor into a second temperature value; and inputting the first temperature value and second temperature value to a control circuit, and choosing a suitable value to output a control signal for controlling the speed of the fan according to the first temperature value and second temperature value so as to precede the heat dissipating of the computer system.

Abstract: The present invention discloses a heat dispersing device of a chassis, comprising a bottom hole at the chassis of a casing and a board hole disposed at a position corresponding to a circuit board inside the casing, wherein the bottom hole and board hole are disposed at an end away from a ventilation hole such that the cool air can have a better traveling path for lowering the temperature of a heat producing component.