Abstract: A sensor having a separate antenna includes a shell, a circuit board, a nameplate, an antenna, and a connecting unit. The shell includes a substrate and a tubular wall. The tubular wall is mounted on a first surface of the substrate to form a containing space. The circuit board is mounted in the containing space. The nameplate is mounted on a second surface of the substrate which is opposite the first surface. The antenna is mounted on the nameplate and is separate from the circuit board. The connecting unit is electrically connected between the antenna and the circuit board, and is mounted through the substrate. The antenna may be mounted outside of the containing space. When the sensor is mounted on a ceiling, the ceiling may not block wireless signals, and quality of wireless communication of the antenna may be improved.

Abstract: A sensor having a separate antenna includes a shell, a circuit board, a nameplate, an antenna, and a connecting unit. The shell includes a substrate and a tubular wall. The tubular wall is mounted on a first surface of the substrate to form a containing space. The circuit board is mounted in the containing space. The nameplate is mounted on a second surface of the substrate which is opposite the first surface. The antenna is mounted on the nameplate and is separate from the circuit board. The connecting unit is electrically connected between the antenna and the circuit board, and is mounted through the substrate. The antenna may be mounted outside of the containing space. When the sensor is mounted on a ceiling, the ceiling may not block wireless signals, and quality of wireless communication of the antenna may be improved.

Abstract: An occupancy sensor for an LED module has an occupancy sensing module, a main control module and a current control module. The occupancy sensing module has capability of sensing occupancy status of a specific area. The main control module has capability of processing the signal from the occupancy sensing module and controlling. The current control module connects to the main control module and includes a current regulator, a power switch, a current sensor and a current controller. The current control module adjusts the duty cycle of the power switch based on the detected current through the LED module, thereby stabilizing the current output for the LED module.

Abstract: An occupancy sensor for an LED module has an occupancy sensing module, a main control module and a current control module. The occupancy sensing module has capability of sensing occupancy status of a specific area. The main control module has capability of processing the signal from the occupancy sensing module and controlling. The current control module connects to the main control module and includes a current regulator, a power switch, a current sensor and a current controller. The current control module adjusts the duty cycle of the power switch based on the detected current through the LED module, thereby stabilizing the current output for the LED module.

Abstract: A pin for a semiconductor device is disclosed. A connection head includes a plurality of curved protruded ribs and a plurality of recessed grooves. The curved protruded ribs and recessed grooves are alternately arranged. The curved protruded ribs radially extend from the center of the connection head. A pin stem is connected to the connection head.

Abstract: A pin for a semiconductor device is disclosed. A connection head includes a plurality of curved protruded ribs and a plurality of recessed grooves. The curved protruded ribs and recessed grooves are alternately arranged. The curved protruded ribs radially extend from the center of the connection head. A pin stem is connected to the connection head.

Abstract: A solder pad structure includes a first metal layer disposed on an insulation layer, wherein the first metal layer is electrically connected with an underlying interconnection circuit layer through a conductive through hole disposed in the insulation layer. A solder resist layer having an opening exposing a central portion of the first metal layer is disposed on the insulating layer. A pillar-shaped second metal layer is disposed within the opening directly on the first metal layer. A solder ball filled into the opening is in contact with the pillar-shaped second metal layer.

Abstract: An embedded chip package includes a substrate having a dielectric interposer, a first metal foil on a first surface and a second metal foil on a second surface of the substrate, wherein the substrate has a cavity recessed into the first surface; a metal heatsink embedded within the cavity; a semiconductor die mounted on a flat bottom of the metal heatsink; a dielectric layer covering the first surface of the substrate; at least one built-up circuit trace layer on the dielectric layer; a solder resist layer on the built-up circuit trace layer and on the dielectric layer; a heat-dissipating metal layer on the second metal foil; and heat-dissipating plugs connecting the flat bottom of the metal heatsink and the heat-dissipating metal layer.

Abstract: A solder pad structure includes a first metal layer disposed on an insulation layer, wherein the first metal layer is electrically connected with an underlying interconnection circuit layer through a conductive through hole disposed in the insulation layer. A solder resist layer having an opening exposing a central portion of the first metal layer is disposed on the insulating layer. A pillar-shaped second metal layer is disposed within the opening directly on the first metal layer. A solder ball filled into the opening is in contact with the pillar-shaped second metal layer.