Abstract: A semiconductor structure and a method for manufacturing the same are provided. The semiconductor structure includes a substrate, a die and a medium. The substrate has an upper substrate surface. The substrate has a trench extended downward from the upper substrate surface. The trench has a side trench surface. The die is in the trench. The die has a lower die surface and a side die surface. The lower die surface is below the upper substrate surface. A part of the trench between the side trench surface and the side die surface is filled with the medium.

Abstract: A sensing device including a base, a pillar, an arm, a sensing element and a driving module is provided. The base has a supporting surface suitable for supporting the object. The pillar is disposed on the supporting surface. The arm has two ends and a pivot portion between the two ends. The pivot position is pivoted to the pillar along an axis substantially parallel to the supporting surface. The sensing element is disposed on the arm and located between an end and the pivot portion. The sensing element is located between the base and the object. The driving module is disposed between the arm and the base. The driving module drives the arm to pivot relatively to the pillar along the axis, and the sensing element moves toward or away from the object as the arm is pivoted.

Abstract: A sensing device including a base, a pillar, an arm, a sensing element and a driving module is provided. The base has a supporting surface suitable for supporting the object. The pillar is disposed on the supporting surface. The arm has two ends and a pivot portion between the two ends. The pivot position is pivoted to the pillar along an axis substantially parallel to the supporting surface. The sensing element is disposed on the arm and located between an end and the pivot portion. The sensing element is located between the base and the object. The driving module is disposed between the arm and the base. The driving module drives the arm to pivot relatively to the pillar along the axis, and the sensing element moves toward or away from the object as the arm is pivoted.

Abstract: A test device for a frequency modulated continuous wave (FMCW) radar is provided. The test device has a central control unit for monitoring the FMCW radar. When the FMCW radar transmits a frequency modulated continuous signal to search for a target, the central control unit of the test device in present invention will simulate the motion of the target according to a plurality of setting parameters and generate an echo signal to the FMCW radar. The present invention also includes a first digital signal synthesizer and a transmitting unit. The first digital signal synthesizer is coupled to the central control unit for generating and transmitting an intermediate-frequency signal to the transmitting unit according to the settings in the central control unit and a reference clock. The transmitting unit generates the echo signal according to the intermediate-frequency signal.

Abstract: A test device for a frequency modulated continuous wave (FMCW) radar is provided. The test device has a central control unit for monitoring the FMCW radar. When the FMCW radar transmits a frequency modulated continuous signal to search for a target, the central control unit of the test device in present invention will simulate the motion of the target according to a plurality of setting parameters and generate an echo signal to the FMCW radar. The present invention also includes a first digital signal synthesizer and a transmitting unit. The first digital signal synthesizer is coupled to the central control unit for generating and transmitting an intermediate-frequency signal to the transmitting unit according to the settings in the central control unit and a reference clock. The transmitting unit generates the echo signal according to the intermediate-frequency signal.

Abstract: This invention relates to a frequency modulation of continuous wave (“FMCW”) radar altimeter capable of controlled linear sweep modes. The FMCW radar altimeter is characterized by the following functions: (1) adopts sweep up frequency and sweep down frequency to solve problems of distance and doppler signal mixture; (2) injects a random generated variable time delay in between sweep intervals to overcome interferences among different altimeters; and (3) switches different sweep frequency bands in accordance with different altitudes.

Abstract: An information recording medium including a substrate, an intermediate conductive layer, and a high molecular weight layer. When the high molecular weight layer is heated to close to its glass (transition) temperature by applying an AC field in order to induce thermal motion in molecular electric coupling poles present in the high molecular weight layer, the coupling poles are polarized by an external electric field applied between a microscopic probe tip and the intermediate conductive layer, the polarization becoming fixed when the temperature of the layer drops.

Abstract: An intelligent optical disk drive control method for rapidly and accurately controlling the movement of an optical pick-up head of an optical disk drive, including the steps of: (a) defining a movement mode for the optical pick-up head; (b) providing a reference message according to the movement mode defined by step (a); (c) moving the optical pick-up head according to the reference message provided by step (b), and providing a feedback message subject to the actual movement of the optical pick-up head when the optical pick-up head is moved; and (d) comparing the feedback message with the reference message, then using a fuzzy control and a proportional integration control to adjust the movement mode of the optical pick-up head subject to the comparison result, so as to let the actual movement mode of the optical pick-up head follow the predetermined movement mode.

Abstract: The present invention discloses a capacitive-type auto-sensing micro-probe used in high-sensitivity sensor elements. The micro-probe is constructed by semiconductor process technology using solid forming methods to comprise the elements of a probe, a probe cantilever, capacitors, an interface circuit and a signal processing circuit etc. and is fabricated in a micro chip so as to reduce the volume of the system, shorten the distance of signal transmission, and elevate signal sensitivity. By employing capacitive-type sensing principles, the micro-probe establishes capacitive plates on the top of the micro-probe to position at the corresponding capacitive plates located beneath an sensing substrate, and as the probe approaches the sample, the interaction of the sample reacts to the probe to generate deformation signals which, in sequence, are converted into capacitive variation signals. The signals are amplified to derive the surface characteristics of the sample.

Abstract: An electric current compensation circuit for use with a multiple-phase burshless motor to reduce ripples in the output torque is disclosed. It contains a plurality of electric current compensation loops each for a respective phase winding and each of the electric compensation loops contains: (a) a first input for receiving a line current from the driver; (b) a second input for receiving the compensation current from the motor sensor; (c) a forward rectifying circuit for forwardly rectifying the line current and the compensation current; (d) a reverse rectifying circuit for reversely rectifying the line current and the compensation current; and (e) a summation circuit for summing the forwardly rectified compensation current and the reversely rectified compensation current and outputting a synthetic current to a phase winding of the motor.