Abstract: The instant disclosure provides a speaker which includes a support structure, a diaphragm, and a coil. The upper frame of the support structure has an opening formed thereon. The diaphragm is disposed on the upper frame of the support structure and located at the peripheral portions of the opening The diaphragm has a substrate layer and a magnetic layer formed thereon. The coil is disposed on the lower frame of the support structure and opposite to the diaphragm. The coil drives the diaphragm to vibrate for sound generation by electromagnetic induction when an electrical current is introduced through the coil.

Abstract: Disclosed herein are an anti-biofilm composition and a method to inhibit or prevent cell adhesion and/or biofilm formation by a microorganism, in which use of 1,2,3,4,6-penta-O-galloyl-D-glucopyranose (PGG) is involved therein.

Abstract: Disclosed herein are an anti-biofilm composition and a method to inhibit or prevent cell adhesion and/or biofilm formation by a microorganism, in which use of 1,2,3,4,6-penta-O-galloyl-D-glucopyranose (PGG) is involved therein.

Abstract: The invention provides a housing for an electrical card, which is an RSMMC memory card. The housing includes a metal cover and a frame integrally formed at a periphery of the metal cover by way of injection molding. A long frame is formed with a long slot for accommodating a control chip. The long slot has a length ranging from 7 to 9 mm to accommodate various types of control chips. The structure intensity of the long slot can be increased by forming through hole slots to be pressed by push needles at the bottom of the long slot when the frame is injected to cover a metal sheet. Then, the substrate formed with the IC is closed and fixed from the other surface. Thus, it is possible to effectively increase the structure intensity of the long slot to improve the function thereof.

Abstract: The invention provides a housing for an electrical card, which is an RSMMC memory card. The housing includes a metal cover and a frame integrally formed at a periphery of the metal cover by way of injection molding. A long frame is formed with a long slot for accommodating a control chip. The long slot has a length ranging from 7 to 9 mm to accommodate various types of control chips. The structure intensity of the long slot can be increased by forming through hole slots to be pressed by push needles at the bottom of the long slot when the frame is injected to cover a metal sheet. Then, the substrate formed with the IC is closed and fixed from the other surface. Thus, it is possible to effectively increase the structure intensity of the long slot to improve the function thereof.

Abstract: A micro SD adapter structure includes a casing having an insert slot, a hollow portion at the casing, an embedding groove at the hollow portion, a plurality of sunken grooves corresponding to the hollow portion, a connecting base proximate to each sunken groove; a transmitting interface at the hollow portion and having a plurality of contact portions, a terminal module at the embedding groove and having a fixing base, a plurality of terminals on the fixing base, and an end of each terminal electrically coupled to each contact portion on a surface of the connecting interface and another end corresponding to the plurality of sunken grooves; and a latch unit on the connecting base. The micro SD card can be secured into the insert slot to achieve a better electric transmitting effect and swap the micro SD card immediately when the micro SD card is inserted into the insert slot.

Abstract: The present invention provides an improved packaging structure of a memory card, such as mini SD memory card. The packaging structure comprises a substrate having a plurality of integrated circuit devices and passive devices located therein, and a metal cover having an insulating layer formed on a top portion of the metal cover. A plurality of protruding plates bending downward are formed around a circumferential area of the metal cover, and a roll-shaped fixing part is formed at a bottom portion of a particular protruding plate. The roll-shaped fixing part and the protruding plates are utilized to engage the frame with the metal cover to form a sealed structure so that the frame covers all the protruding plates and the roller-shaped fixing part of the metal cover. The integrated circuit devices and the passive devices are located within the space of the frame to form a mini SD memory card package.

Abstract: A micro SD adapter structure includes a casing having an insert slot, a hollow portion at the casing, an embedding groove at the hollow portion, a plurality of sunken grooves corresponding to the hollow portion, a connecting base proximate to each sunken groove; a transmitting interface at the hollow portion and having a plurality of contact portions, a terminal module at the embedding groove and having a fixing base, a plurality of terminals on the fixing base, and an end of each terminal electrically coupled to each contact portion on a surface of the connecting interface and another end corresponding to the plurality of sunken grooves; and a latch unit on the connecting base. The micro SD card can be secured into the insert slot to achieve a better electric transmitting effect and swap the micro SD card immediately when the micro SD card is inserted into the insert slot.

Abstract: A micro SD adapter structure includes a casing having an insert slot which is a hollow structure in the shape of a mini SD card, a hollow portion at the casing, a plurality of fixing grooves on the casing and corresponding to the hollow portion, a plurality of sunken grooves on the hollow portion, a connecting base proximate to each sunken groove; a transmitting unit having a conducting interface on the hollow portion and the conducting interface is electrically coupled to a plurality of terminals which are installed in the fixing groove of the casing and corresponding to a plurality of sunken grooves; and a latch unit disposed on the connecting base. The micro SD card can be secured into the insert slot to achieve a better electric transmitting effect and swap the micro SD card immediately when the micro SD card is inserted into the insert slot.

Abstract: A MICRO SD card includes a casing composed of a base and a top cover, an insertion slot is defined in an end of the casing and a plurality of first recesses are defined in an inner surface of the base. A recessed area is defined in the inner surface of the base so as to receive a circuit board therein. The top cover has a plurality of ridges extending from an underside thereof and each ridge has a second recess defined therein. A plurality of terminals each have a projection which is engaged with one of the second recesses. A first leg and a second leg respectively extend from two ends of each of the projections. The first leg extends into the insertion slot and the second leg has a protrusion which is compressed onto the circuit board by the ridge corresponding thereto.

Abstract: The present invention provides an improved packaging structure of a memory card, such as mini SD memory card. The packaging structure comprises a substrate having a plurality of integrated circuit devices and passive devices located therein, and a metal cover having an insulating layer formed on a top portion of the metal cover. A plurality of protruding plates bending downward are formed around a circumferential area of the metal cover, and a roll-shaped fixing part is formed at a bottom portion of a particular protruding plate. The roll-shaped fixing part and the protruding plates are utilized to engage the frame with the metal cover to form a sealed structure so that the frame covers all the protruding plates and the roller-shaped fixing part of the metal cover. The integrated circuit devices and the passive devices are located within the space of the frame to form a mini SD memory card package.

Abstract: The present invention provides a packaging structure of a RSMMC memory card. The packaging structure comprises a substrate having a plurality of integrated circuit (IC) devices and passive devices located therein. A frame engaging with the substrate is surrounded with the IC devices and the passive devices. A metal cover having an insulating layer is engaged with the frame to form a thin layer of structure. A plurality of fixed plates bending downward are formed around a circumferential area of the metal cover, and a protruding plate and fixing slots are formed on one end of the pre-selected fixed plates bending outward. The frame and the metal cover are integrated together to form a sealed structure. The integrated circuit devices and the passive devices are located within the space of the frame to form a RSMMC memory card package.

Abstract: A strain of Erwinia herbicola identified as EHO-10 has been found to have a broad spectrum of inhibitory activity against pathogenic bacteria. Pathogenic bacteria inhibited by EHO-10 includes those from the following genera: Agrobacterium, Corynebacterium, Erwinia, Pseudomonas, and Xanthomonas. EHO-10 has inhibitory activity against Erwinia amylovora, a bacteria pathogen causing fire blight disease of pear and other trees.