Patents by Inventor Shih-Wei Ku

Shih-Wei Ku has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Ambient light sensor
    Patent number: 11946802
    Abstract: An ambient light sensor includes a substrate, a metasurface disposed on the substrate, and an aperture layer disposed on the substrate. The metasurface includes a plurality of nanostructures and a filling layer laterally surrounding the plurality of nanostructures. The aperture layer laterally separates the metasurface into a plurality of sub-meta groups.
    Type: Grant
    Filed: March 29, 2023
    Date of Patent: April 2, 2024
    Assignee: VISERA TECHNOLOGIES COMPANY LIMITED
    Inventors: Shih-Liang Ku, Zi-Han Liao, Chun-Wei Huang
  • Dewing sensor
    Publication number: 20060213264
    Abstract: A dewing sensor and a method for making the dewing sensor. The dewing sensor includes a substrate having at least two electrodes, at least two comb electrodes, and a detecting layer, wherein the comb electrodes contact the two electrodes on the substrate, and the detecting layer includes a derivative of cellulose formed on the comb electrodes.
    Type: Application
    Filed: August 2, 2005
    Publication date: September 28, 2006
    Applicant: Forward Electronics Co., Ltd.
    Inventors: Shih-Wei Ku, Ching-Hao Chung