Patents by Inventor Shih-Wei Lee
Shih-Wei Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240126002Abstract: A backlight module includes a light source, a first prism sheet disposed on the light source, and a light type adjustment sheet disposed on a side of the first prism sheet away from the light source and including a base and multiple light type adjustment structures. The multiple light type adjustment structures are disposed on the first surface of the base. Each light type adjustment structure has a first structure surface and a second structure surface connected to each other. The first structure surface of each light type adjustment structure and the first surface of the base form a first base angle therebetween, and the second structure surface of each light type adjustment structure and the first surface of the base form a second base angle therebetween. The angle of the first base angle is different from the angle of the second base angle.Type: ApplicationFiled: October 2, 2023Publication date: April 18, 2024Applicant: Coretronic CorporationInventors: Chih-Jen Tsang, Chung-Wei Huang, Shih-Yen Cheng, Jung-Wei Chang, Han-Yuan Liu, Chun-Wei Lee
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Patent number: 11946569Abstract: An actuating and sensing module is disclosed and includes a bottom plate, a gas pressure sensor, a thin gas transportation device and a cover plate. The bottom plate includes a pressure relief orifice, a discharging orifice and a communication orifice. The gas pressure sensor is disposed on the bottom plate and seals the communication orifice. The thin gas transportation device is disposed on the bottom plate and seals the pressure relief orifice and the discharging orifice. The cover plate is disposed on the bottom plate and covers the gas pressure sensor and the thin gas-transportation device. The cover plate includes an intake orifice. The thin gas transportation device is driven to inhale gas through the intake orifice, the gas is then discharged through the discharging orifice by the thin gas transportation device, and a pressure change of the gas is sensed by the gas pressure sensor.Type: GrantFiled: April 19, 2021Date of Patent: April 2, 2024Assignee: MICROJET TECHNOLOGY CO., LTD.Inventors: Hao-Jan Mou, Shih-Chang Chen, Jia-Yu Liao, Hung-Hsin Liao, Chung-Wei Kao, Chi-Feng Huang, Yung-Lung Han, Chang-Yen Tsai, Wei-Ming Lee
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Publication number: 20240106114Abstract: A radio device includes a first antenna array and an actuator. The first antenna array is configured to transmit a radiation beam to a remote device. The actuator is configured to change an orientation of the first antenna array, whereby a beam direction of the radiation beam is changed according to a change of the orientation of the first antenna array. The beam direction of the radiation beam is adjusted according to a beam steering mechanism performed by the first antenna array.Type: ApplicationFiled: September 26, 2022Publication date: March 28, 2024Inventors: Shih-Wei HSIEH, Wei-Hsuan CHANG, Chih-Wei LEE, Shyh-Tirng FANG
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Patent number: 11933809Abstract: The present application discloses an inertial sensor comprising a proof mass, an anchor, a flexible member and several sensing electrodes. The anchor is positioned on one side of the sensing, mass block in a first axis. The flexible member is connected to the anchor point and extends along the first axis towards the proof mass to connect the proof mass, in which the several sensing electrodes are provided. In this way, the present application can effectively solve the problems of high difficulty in the production and assembly of inertial sensors and poor product reliability thereof.Type: GrantFiled: April 6, 2022Date of Patent: March 19, 2024Assignee: SENSORTEK TECHNOLOGY CORP.Inventors: Shih-Wei Lee, Chia-Hao Lin, Shih-Hsiung Tseng, Kuan-Ju Tseng, Chao-Shiun Wang
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Publication number: 20240088019Abstract: A connecting structure includes a first dielectric layer, a first connecting via in the first dielectric layer, a second connecting via in the first dielectric layer, and an isolation between the first connecting via and the second connecting via. The isolation separates the first and second connecting vias from each other. The first connecting via, the isolation and the second connecting via are line symmetrical about a central line perpendicular to a top surface of the first dielectric layer.Type: ApplicationFiled: January 11, 2023Publication date: March 14, 2024Inventors: CHIA CHEN LEE, CHIA-TIEN WU, SHIH-WEI PENG, KUAN YU CHEN
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Publication number: 20240017987Abstract: The present application discloses an anchor structure for application to a microelectromechanical system device comprising a cap layer, a device layer and a substrate layer. Such an anchor structure enhances the stress tolerance of the microelectromechanical system device. The anchor structure comprises a first anchor portion, a second anchor portion and a flexible member located in the device layer. The first anchor portion and the second anchor portion are connected to two sides of the flexible member, respectively. The first anchor is secured to the cap layer by a first bonding portion, and the second anchor is secured to the substrate layer by a second bonding portion.Type: ApplicationFiled: April 3, 2023Publication date: January 18, 2024Inventors: Shih-Wei Lee, Kuan-Ju Tseng, Chao-Shiun Wang
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Patent number: 11614327Abstract: The present invention provides a gyroscope structure. A frame disposed on a substrate, and a flexible element is correspondingly disposed a first, second, and third plate. The first plate has a second flexibility. The second plate is connected to the second plate, the second plate is connected to the third plate with a fourth flexible element, the second plate is provided with a first through-hole, and a rotating plate is pivotally connected in the first through-hole. The rotating plate is connected to a supporting column of the substrate by a fifth flexible part, and then a sensing element is provided on the substrate corresponding to the first, second, and third plates to sense the movement and movement of the plates. Rotating, in one embodiment, the first and third plates are provided with through-holes, and corresponding sensing elements and driving elements are provided.Type: GrantFiled: July 23, 2021Date of Patent: March 28, 2023Assignee: Sensortek Technology Corp.Inventors: Shih-Hsiung Tseng, Shih-Wei Lee, Chao-Shiun Wang
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Publication number: 20230055638Abstract: The present application discloses an inertial sensor comprising a proof mass, an anchor, a flexible member and several sensing electrodes. The anchor is positioned on one side of the sensing, mass block in a first axis. The flexible member is connected to the anchor point and extends along the first axis towards the proof mass to connect the proof mass, in which the several sensing electrodes are provided. In this way, the present application can effectively solve the problems of high difficulty in the production and assembly of inertial sensors and poor product reliability thereof.Type: ApplicationFiled: April 6, 2022Publication date: February 23, 2023Inventors: SHIH-WEI LEE, CHIA-HAO LIN, SHIH-HSIUNG TSENG, KUAN-JU TSENG, CHAO-SHIUN WANG
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Publication number: 20220348717Abstract: A polyimide is provided, which contains at least one repeating unit selected from a group consisting of the following general formulas, M, N, and O: X is a residue derived from TCA represented by formula I. Y1 is a residue derived from a diamine with a cardo structure. Y2 is a residue derived from a diamine with the structure of a benzene ring, biphenyl, phenylbenzimidazole or phenylbenzoxazole. Y3 is a residue derived from a diamine with an ether or an ester group.Type: ApplicationFiled: August 3, 2021Publication date: November 3, 2022Inventors: Chuan-Jen FU, Shih-Wei LEE, Hsiao-Chu LIN, Shu-Mei YANG, Shih-Hung HUANG, Tzu-Yuan SHIH
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Publication number: 20220026210Abstract: The present invention provides a gyroscope structure. A frame disposed on a substrate, and a flexible element is correspondingly disposed a first, second, and third plate. The first plate has a second flexibility. The second plate is connected to the second plate, the second plate is connected to the third plate with a fourth flexible element, the second plate is provided with a first through-hole, and a rotating plate is pivotally connected in the first through-hole. The rotating plate is connected to a supporting column of the substrate by a fifth flexible part, and then a sensing element is provided on the substrate corresponding to the first, second, and third plates to sense the movement and movement of the plates. Rotating, in one embodiment, the first and third plates are provided with through-holes, and corresponding sensing elements and driving elements are provided.Type: ApplicationFiled: July 23, 2021Publication date: January 27, 2022Inventors: SHIH-HSIUNG TSENG, SHIH-WEI LEE, CHAO-SHIUN WANG
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Patent number: 11193770Abstract: The invention related to a microelectromechanical systems gyroscope, which comprises a plurality of sensing modules sensing angular velocities on tri-axes, a plurality of outer frames set at outside of the sensing modules, and a plurality of driving shafts set between the frames respectively. The driving shafts are connected with two adjacent frames by first and second flexible connecting elements, respectively, and the frames are connected with the sensing modules by a plurality of transporting units. Thus, tri-axes sensing is provided.Type: GrantFiled: September 10, 2020Date of Patent: December 7, 2021Assignee: Sensortek Technology Corp.Inventors: Shih-Wei Lee, Chao-Shiun Wang
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Patent number: 10961119Abstract: A MEMS device comprising a substrate comprising a die and a plurality of side-walls disposed upon the MEMS die, a proof-mass coupled to the substrate, the proof-mass is configured to be displaced within a first plane that is parallel to the die, wherein the proof-mass is configured to contact at least a sidewall, wherein the proof-mass is configured to adhere to the side-wall as a result of stiction forces, a driving circuit configured to provide a driving voltage in response to a driving signal indicating that the proof-mass is adhered to the side-wall, and an actuator coupled to the driving circuit disposed upon the side-wall, wherein the actuator is configured to receive a driving voltage and to provide an actuator force to the proof mass within the first plane in a direction away from the side-wall in response to the driving voltage, wherein the actuator force exceeds the stiction forces.Type: GrantFiled: January 23, 2018Date of Patent: March 30, 2021Assignee: mCube, Inc.Inventors: Shih-Wei Lee, Wen-Chih Chen
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Publication number: 20210088335Abstract: The invention related to a microelectromechanical systems gyroscope, which comprises a plurality of sensing modules sensing angular velocities on tri-axes, a plurality of outer frames set at outside of the sensing modules, and a plurality of driving shafts set between the frames respectively. The driving shafts are connected with two adjacent frames by first and second flexible connecting elements, respectively, and the frames are connected with the sensing modules by a plurality of transporting units. Thus, tri-axes sensing is provided.Type: ApplicationFiled: September 10, 2020Publication date: March 25, 2021Inventors: SHIH-WEI LEE, CHAO-SHIUN WANG
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Publication number: 20200223177Abstract: An antimicrobial structure and a method for manufacturing the same are provided. The antimicrobial structure includes a plurality of antimicrobial layers and at least one mid layer. The antimicrobial layers are stacked together. Each of the antimicrobial layers is formed by an antimicrobial metal coated polymer fiber or antimicrobial metal fiber. The at least one mid layer is disposed between the antimicrobial layers.Type: ApplicationFiled: May 31, 2019Publication date: July 16, 2020Inventors: CHIA-HUNG CHANG, Shih-Wei Lee, HAN-CHOU LIAO
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Publication number: 20200221608Abstract: A heat-dissipating structure includes a plurality of heat-dissipating layers and at least one heat-buffering layer. The heat-dissipating layers are stacked together. Each of the heat-dissipating layers is formed by a thermally conductive metal coated polymer fiber or thermally conductive metal fiber. The at least one heat-buffering layer is disposed between the heat-dissipating layers.Type: ApplicationFiled: May 31, 2019Publication date: July 9, 2020Inventors: CHIA-HUNG CHANG, SHIH-WEI LEE, HAN-CHOU LIAO
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Publication number: 20200061712Abstract: A method for manufacturing a titanium based product includes the following steps. The first step is providing a titanium hydride ingot. The next step is pre-sintering the titanium hydride ingot to dehydrogenate the titanium hydride ingot according to a first temperature control mode, so as to form a titanium ingot. The next step is machining the titanium ingot to form a titanium semi-product having a desired shape. The last step is post-sintering the titanium semi-product according to a second temperature control mode that is different from the first temperature control mode, so as to form the titanium based product.Type: ApplicationFiled: December 13, 2018Publication date: February 27, 2020Inventors: CHIA-HUNG CHANG, HAN-CHOU LIAO, Shih-Wei Lee
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Publication number: 20160183519Abstract: The instant disclosure is related to a sapphire, including a surface and a silver-containing antibiotic source, wherein the silver-containing antibiotic source forms an antibiotic film covering the surface. The instant disclosure also relates to a sapphire, including a surface, an oxide layer extending from the surface to inside of the surface, and a silver-containing antibiotic source, wherein the silver-containing antibiotic source is distributed in the oxide layer, so as to turn the oxide layer into an antibiotic layer and turn the surface into an antibiotic surface. Therefore, the sapphire can have an antibiotic to reduce bacteria proliferation issues.Type: ApplicationFiled: March 30, 2015Publication date: June 30, 2016Inventors: SHENG-YI LEE, CHENG-FENG HUANG, FENG-JU LAI, SHIH-WEI LEE
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Patent number: 9150615Abstract: The invention provides a process for the preparation of leuprolide or its pharmaceutical acceptable salts by a combination of solid phase synthesis and post assembly solution phase amidation. The invention also relates to applying a non-protected leuprolide precursor to prepare leuprolide or its pharmaceutically acceptable salts.Type: GrantFiled: December 18, 2013Date of Patent: October 6, 2015Assignee: ScinoPharm Taiwan, Ltd.Inventors: Tsung Yu Hsiao, Shih Wei Lee
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Publication number: 20150166602Abstract: The invention provides a process for the preparation of leuprolide or its pharmaceutical acceptable salts by a combination of solid phase synthesis and post assembly solution phase amidation. The invention also relates to applying a non-protected leuprolide precursor to prepare leuprolide or its pharmaceutically acceptable salts.Type: ApplicationFiled: December 18, 2013Publication date: June 18, 2015Applicant: ScinoPharm Taiwan, Ltd.Inventors: Tsung Yu Hsiao, Shih Wei Lee
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Patent number: D813812Type: GrantFiled: November 12, 2015Date of Patent: March 27, 2018Assignee: CATCHER TECHNOLOGY CO., LTD.Inventors: Chihhsing Lin, Chun Wei Lee, Shih-Bin Chiu, Hsu Yuan Lee, Shih-Wei Lee