Patents by Inventor Shih-Wei Yang
Shih-Wei Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12119427Abstract: The light emitting device includes a growth substrate, a light-emitting semiconductor structure, conductive pillars, an insulating layer, and first and second electrodes. The light-emitting semiconductor structure includes a first-type semiconductor layer, a light-emitting layer and a second-type semiconductor layer disposed on the growth substrate from top to bottom. The conductive pillars are disposed in the light-emitting semiconductor structure. The conductive pillars penetrates is in contact with the second-type semiconductor layer and electrically connected to the substrate. A first portion of the insulating layer is disposed between the first-type semiconductor layer and the substrate, and a second portion of the insulating layer electrically insulates the first-type semiconductor layer and the light emitting-layer from the conductive pillars. The first electrode is electrically connected to the first-type semiconductor layer and electrically insulated from the conductive pillars.Type: GrantFiled: June 16, 2023Date of Patent: October 15, 2024Assignee: Lextar Electronics CorporationInventors: Jih-Kang Chen, Shih-Wei Yang, Tsai-Chen Sung
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Patent number: 12113152Abstract: The light emitting device includes a substrate, a light-emitting semiconductor structure, conductive pillars, an insulating layer, and first and second electrodes. The light-emitting semiconductor structure includes a first-type semiconductor layer, a light-emitting layer and a second-type semiconductor layer disposed on the substrate from bottom to top. The conductive pillars are disposed in the light-emitting semiconductor structure. The conductive pillars penetrates is in contact with the second-type semiconductor layer and electrically connected to the substrate. A first portion of the insulating layer is disposed between the first-type semiconductor layer and the substrate, and a second portion of the insulating layer electrically insulates the first-type semiconductor layer and the light emitting-layer from the conductive pillars. The first electrode is electrically connected to the first-type semiconductor layer and electrically insulated from the conductive pillars.Type: GrantFiled: May 2, 2021Date of Patent: October 8, 2024Assignee: Lextar Electronics CorporationInventors: Jih-Kang Chen, Shih-Wei Yang, Tsai-Chen Sung
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Patent number: 11811001Abstract: The forming method of a flip-chip light emitting diode structure includes the following steps. A first substrate including a first semiconductor layer, an active layer on the first semiconductor layer and a second semiconductor layer on the active layer is provided. A first current blocking layer is formed on the second semiconductor layer, in which the first current blocking layer has a plurality of interspaces. A reflective layer covering the interspaces is formed, in which the reflective layer has a plurality of recesses, and each of the recesses is corresponding to each of the interspaces. A second current blocking layer filling into the recesses is formed.Type: GrantFiled: October 31, 2022Date of Patent: November 7, 2023Assignee: Lextar Electronics CorporationInventors: Jih-Kang Chen, Shih-Wei Yang
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Publication number: 20230335680Abstract: The light emitting device includes a growth substrate, a light-emitting semiconductor structure, conductive pillars, an insulating layer, and first and second electrodes. The light-emitting semiconductor structure includes a first-type semiconductor layer, a light-emitting layer and a second-type semiconductor layer disposed on the growth substrate from top to bottom. The conductive pillars are disposed in the light-emitting semiconductor structure. The conductive pillars penetrates is in contact with the second-type semiconductor layer and electrically connected to the substrate. A first portion of the insulating layer is disposed between the first-type semiconductor layer and the substrate, and a second portion of the insulating layer electrically insulates the first-type semiconductor layer and the light emitting-layer from the conductive pillars. The first electrode is electrically connected to the first-type semiconductor layer and electrically insulated from the conductive pillars.Type: ApplicationFiled: June 16, 2023Publication date: October 19, 2023Inventors: Jih-Kang CHEN, Shih-Wei YANG, Tsai-Chen SUNG
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Patent number: 11755094Abstract: A system for controlling an information handling system is disclosed that includes a central processing unit, a memory device, a power supply and a memory speed controller configured to determine one or more system parameters of the central processing unit, the memory device and the power supply, to store a boot setting as a function of the one or more system parameters and to cause a system reboot after storing the boot setting.Type: GrantFiled: April 28, 2022Date of Patent: September 12, 2023Assignee: DELL PRODUCTS L.P.Inventors: Chunge-Wei Wang, Chihchung Lin, Tse-An- Chu, Shih-Wei Yang, Yi Ling Tsai
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Patent number: 11625075Abstract: An electronic device includes a first body, a pivot assembly and a second body. The first body includes a first side and a second side, and the second side includes a groove. The pivot assembly includes a container, a first gear, a second gear and a third gear. The container includes an accommodating space and a side wall. The first gear is disposed in the accommodating space and connected to the groove. The second gear is disposed in the accommodating space, pivotally disposed at the side wall and engaged with the first gear. The third gear is disposed in the accommodating space, pivotally disposed at the side wall and engaged with the second gear. The second body is pivotally disposed at the container and connected to the third gear.Type: GrantFiled: October 14, 2021Date of Patent: April 11, 2023Assignee: ASUSTEK COMPUTER INC.Inventors: Chin-Chung Lai, Yung-Hsiang Chen, Shih-Wei Yang
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Publication number: 20230078065Abstract: The forming method of a flip-chip light emitting diode structure includes the following steps. A first substrate including a first semiconductor layer, an active layer on the first semiconductor layer and a second semiconductor layer on the active layer is provided. A first current blocking layer is formed on the second semiconductor layer, in which the first current blocking layer has a plurality of interspaces. A reflective layer covering the interspaces is formed, in which the reflective layer has a plurality of recesses, and each of the recesses is corresponding to each of the interspaces. A second current blocking layer filling into the recesses is formed.Type: ApplicationFiled: October 31, 2022Publication date: March 16, 2023Inventors: Jih-Kang CHEN, Shih-Wei YANG
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Patent number: 11592912Abstract: Clickpad structures may be attached to surfaces of an information handling system using material stacks comprising an elastic material, such as a sponge, which can preload a force on the clickpad surface. The preloaded force reduces a gap between the clickpad switch and contact point, which reduces instability, rattling, and other negative experiences with the clickpad surface experienced by a user. According to an embodiment, an input device for an information handling system includes a clickpad surface having a first side configured to receive user input and a second side opposite the first side; a first coupling stack comprising a first elastic material with a first thickness; and a second coupling stack comprising a second elastic material with a second thickness, wherein each of the coupling stacks is attached to the clickpad surface and a surface of the information handling system by adhesives.Type: GrantFiled: December 1, 2021Date of Patent: February 28, 2023Assignee: Dell Products L.P.Inventors: Jing-Tang Wu, Shih-Wei Yang, Chia-Chi Ho, Ya-Chen Tsai
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Patent number: 11515447Abstract: The flip-chip light emitting diode structure includes a substrate, a first patterned current blocking layer, a second patterned current blocking layer, a first semiconductor layer, an active layer and a second semiconductor layer. The first patterned current blocking layer is disposed on the substrate. The second patterned current blocking layer is disposed on the first patterned current blocking layer, in which the first patterned current blocking layer and the second patterned current blocking layer are located on different planes, and patterns of the first patterned current blocking layer and patterns of the second current blocking layer are substantially complementary. The first semiconductor layer is disposed on the second patterned current blocking layer. The active layer is disposed on the first semiconductor layer. The second semiconductor layer is disposed on the active layer, in which electrical properties of the second semiconductor layer and the first semiconductor layer are different.Type: GrantFiled: September 21, 2020Date of Patent: November 29, 2022Assignee: Lextar Electronics CorporationInventors: Jih-Kang Chen, Shih-Wei Yang
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Publication number: 20220253123Abstract: A system for controlling an information handling system is disclosed that includes a central processing unit, a memory device, a power supply and a memory speed controller configured to determine one or more system parameters of the central processing unit, the memory device and the power supply, to store a boot setting as a function of the one or more system parameters and to cause a system reboot after storing the boot setting.Type: ApplicationFiled: April 28, 2022Publication date: August 11, 2022Applicant: DELL PRODUCTS L.P.Inventors: Chunge-Wei Wang, Chihchung Lin, Tse-An- Chu, Shih-Wei Yang, Yi Ling Tsai
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Patent number: 11320885Abstract: A system for controlling an information handling system is disclosed that includes a central processing unit, a memory device, a power supply and a memory speed controller configured to determine one or more system parameters of the central processing unit, the memory device and the power supply, to store a boot setting as a function of the one or more system parameters and to cause a system reboot after storing the boot setting.Type: GrantFiled: May 26, 2020Date of Patent: May 3, 2022Assignee: DELL PRODUCTS L.P.Inventors: Chunge-Wei Wang, Chihchung Lin, Tse-An- Chu, Shih-Wei Yang, Yi Ling Tsai
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Publication number: 20220121247Abstract: An electronic device includes a first body, a pivot assembly and a second body. The first body includes a first side and a second side, and the second side includes a groove. The pivot assembly includes a container, a first gear, a second gear and a third gear. The container includes an accommodating space and a side wall. The first gear is disposed in the accommodating space and connected to the groove. The second gear is disposed in the accommodating space, pivotally disposed at the side wall and engaged with the first gear. The third gear is disposed in the accommodating space, pivotally disposed at the side wall and engaged with the second gear. The second body is pivotally disposed at the container and connected to the third gear.Type: ApplicationFiled: October 14, 2021Publication date: April 21, 2022Inventors: Chin-Chung Lai, Yung-Hsiang Chen, Shih-Wei Yang
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Publication number: 20220013692Abstract: The light emitting device includes a substrate, a light-emitting semiconductor structure, conductive pillars, an insulating layer, and first and second electrodes. The light-emitting semiconductor structure includes a first-type semiconductor layer, a light-emitting layer and a second-type semiconductor layer disposed on the substrate from bottom to top. The conductive pillars are disposed in the light-emitting semiconductor structure. The conductive pillars penetrates is in contact with the second-type semiconductor layer and electrically connected to the substrate. A first portion of the insulating layer is disposed between the first-type semiconductor layer and the substrate, and a second portion of the insulating layer electrically insulates the first-type semiconductor layer and the light emitting-layer from the conductive pillars. The first electrode is electrically connected to the first-type semiconductor layer and electrically insulated from the conductive pillars.Type: ApplicationFiled: May 2, 2021Publication date: January 13, 2022Inventors: Jih-Kang CHEN, Shih-Wei YANG, Tsai-Chen SUNG
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Publication number: 20210373642Abstract: A system for controlling an information handling system is disclosed that includes a central processing unit, a memory device, a power supply and a memory speed controller configured to determine one or more system parameters of the central processing unit, the memory device and the power supply, to store a boot setting as a function of the one or more system parameters and to cause a system reboot after storing the boot setting.Type: ApplicationFiled: May 26, 2020Publication date: December 2, 2021Applicant: DELL PRODUCTS L.P.Inventors: Chunge-Wei Wang, Chihchung Lin, Tse-An- Chu, Shih-Wei Yang, Yi Ling Tsai
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Publication number: 20210288213Abstract: The flip-chip light emitting diode structure includes a substrate, a first patterned current blocking layer, a second patterned current blocking layer, a first semiconductor layer, an active layer and a second semiconductor layer. The first patterned current blocking layer is disposed on the substrate. The second patterned current blocking layer is disposed on the first patterned current blocking layer, in which the first patterned current blocking layer and the second patterned current blocking layer are located on different planes, and patterns of the first patterned current blocking layer and patterns of the second current blocking layer are substantially complementary. The first semiconductor layer is disposed on the second patterned current blocking layer. The active layer is disposed on the first semiconductor layer. The second semiconductor layer is disposed on the active layer, in which electrical properties of the second semiconductor layer and the first semiconductor layer are different.Type: ApplicationFiled: September 21, 2020Publication date: September 16, 2021Inventors: Jih-Kang CHEN, Shih-Wei YANG
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Patent number: 9990739Abstract: A method and device for fisheye camera automatic calibration is disclosed. A first straight line and a second straight line are respectively moved to generate a first fisheye line and a second fisheye line being straight lines. At least two symmetric points are generated on the second straight line based on an intersection of the first straight line and the second straight line as a symmetric central point, so as to correspondingly generate at least two fisheye symmetric points. The second straight line rotates until a distance between the first fisheye line and each of two fisheye symmetric points is equal. Then, central intersection coordinates, fisheye symmetric coordinates, a fisheye symmetric distance are retrieved and used to calculate fisheye parameters.Type: GrantFiled: August 10, 2017Date of Patent: June 5, 2018Assignee: NATIONAL CHIAO TUNG UNIVERSITYInventors: Jen-Hui Chuang, Tien-Lung Chang, Mu-Tien Lu, Yi-Yu Hsieh, Shih-Wei Yang
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Patent number: 9274638Abstract: A touch panel includes a substrate, a light-shielding layer, a patterned transparent layer, a reflecting layer, at least one first sensing series, and at least one second sensing series. The substrate has a touch sensing region and a peripheral region. The light-shielding layer is disposed in the periphery region. The light-shielding layer has a patterned opening and a sidewall adjacent to the patterned opening. The patterned opening is configured to provide a mark identifiable by human eyes. The patterned transparent layer is disposed in the peripheral region, and the patterned transparent layer covers a portion of the patterned opening. The patterned transparent layer has an inclined sidewall positioned in the patterned opening. The reflecting layer covers the inclined sidewall and the patterned opening. The first sensing series and the second sensing series are arranged in the touch sensing region to detect a position of a touch point.Type: GrantFiled: May 7, 2014Date of Patent: March 1, 2016Assignee: AU OPTRONICS CORPORATIONInventors: Shih-Wei Yang, An-Cheng Chen, Shih-Po Chou
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Patent number: 8987624Abstract: An information handling system can include a base, a printed circuit board including a capacitive switch, and a cover. The printed circuit board can be attached to the base, and the cover can lie adjacent to the printed circuit board. The capacitive switch can be configured to change state when an object is close to the cover. The cover can be configured such that it can be detached from the remainder of the information handling system while the printed circuit board remains attached to the base. The configuration of the printed circuit board and cover can be particularly useful when maintaining a keyboard or a touch pad or when replacing the cover.Type: GrantFiled: May 4, 2012Date of Patent: March 24, 2015Assignee: Dell Products, LPInventors: Gurmeet Singh Bhutani, Shih-Wei Yang, Kuo-Hsiang Huang
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Publication number: 20150029691Abstract: A device housing includes a housing body, a support plate, a buffer frame, and a display module. The housing body defines a receiving opening and forms an inner peripheral wall. The housing body is formed around a peripheral wall of the support plate for covering one side of the receiving opening. The buffer frame is formed around the inner peripheral wall of the housing body. The display module is received in the receiving opening and is supported by the support plate. The buffer frame abuts against four sides of the display module.Type: ApplicationFiled: October 30, 2013Publication date: January 29, 2015Applicant: FIH (HONG KONG) LIMITEDInventor: SHIH-WEI YANG
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Publication number: 20150023757Abstract: A method for fixing at least one nut in a housing is provided. The nut includes a latching portion, and the housing defines a connecting hole. The method includes providing a pressing block, placing the nut into the connecting hole of the housing, engaging the pressing block with the nut, heating the pressing block and transmitting heat energy to the nut, rotating the nut into the connecting hole, and melting a portion of an inner wall of the connecting hole to solidify molten material in the latching portion, thereby fixing the nut in the housing.Type: ApplicationFiled: November 1, 2013Publication date: January 22, 2015Applicant: FIH (HONG KONG) LIMITEDInventors: CHIH-WEI CHANG, SHIH-WEI YANG