Abstract: There is provided a system and method of examination of a semiconductor specimen. The method includes obtaining a group of defect candidates associated with respective inspection locations represented in an inspection coordinate system; using a trained machine learning (ML) model to provide, for each defect candidate, a probability of the defect candidate being a defect of interest (DOI), and ranking the group of defect candidates to an ordered list according to respective probabilities thereof, in response to a part of the ordered list of defect candidates being reviewed by a review tool in accordance with an order thereof, receiving a predefined number of DOIs associated with respective review locations represented in a review coordinate system; and calculating an offset between the review coordinate system and the inspection coordinate system based on respective inspection and review locations associated with the predefined number of DOIs.

Abstract: A semiconductor device is provided, which includes a semiconductor epitaxial structure, a first insulating layer, a metal layer, a second insulating layer, a first electrode pad, a second electrode pad, and an intermediate structure. The semiconductor epitaxial structure includes an active region and has a first sidewall and a first upper surface. The first insulating layer covers the first sidewall and the first upper surface of the semiconductor epitaxial structure and has a second upper surface. The metal layer is located on the first insulating layer. The second insulating layer is located on the metal layer. The first electrode pad and the second electrode pad are located on the second insulating layer. The intermediate structure is located between the first insulating layer and the metal layer. The second upper surface of the first insulating layer has a portion directly contacts the metal layer.

Abstract: The light emitting device includes a growth substrate, a light-emitting semiconductor structure, conductive pillars, an insulating layer, and first and second electrodes. The light-emitting semiconductor structure includes a first-type semiconductor layer, a light-emitting layer and a second-type semiconductor layer disposed on the growth substrate from top to bottom. The conductive pillars are disposed in the light-emitting semiconductor structure. The conductive pillars penetrates is in contact with the second-type semiconductor layer and electrically connected to the substrate. A first portion of the insulating layer is disposed between the first-type semiconductor layer and the substrate, and a second portion of the insulating layer electrically insulates the first-type semiconductor layer and the light emitting-layer from the conductive pillars. The first electrode is electrically connected to the first-type semiconductor layer and electrically insulated from the conductive pillars.

Abstract: The light emitting device includes a substrate, a light-emitting semiconductor structure, conductive pillars, an insulating layer, and first and second electrodes. The light-emitting semiconductor structure includes a first-type semiconductor layer, a light-emitting layer and a second-type semiconductor layer disposed on the substrate from bottom to top. The conductive pillars are disposed in the light-emitting semiconductor structure. The conductive pillars penetrates is in contact with the second-type semiconductor layer and electrically connected to the substrate. A first portion of the insulating layer is disposed between the first-type semiconductor layer and the substrate, and a second portion of the insulating layer electrically insulates the first-type semiconductor layer and the light emitting-layer from the conductive pillars. The first electrode is electrically connected to the first-type semiconductor layer and electrically insulated from the conductive pillars.

Abstract: The forming method of a flip-chip light emitting diode structure includes the following steps. A first substrate including a first semiconductor layer, an active layer on the first semiconductor layer and a second semiconductor layer on the active layer is provided. A first current blocking layer is formed on the second semiconductor layer, in which the first current blocking layer has a plurality of interspaces. A reflective layer covering the interspaces is formed, in which the reflective layer has a plurality of recesses, and each of the recesses is corresponding to each of the interspaces. A second current blocking layer filling into the recesses is formed.

Abstract: The light emitting device includes a growth substrate, a light-emitting semiconductor structure, conductive pillars, an insulating layer, and first and second electrodes. The light-emitting semiconductor structure includes a first-type semiconductor layer, a light-emitting layer and a second-type semiconductor layer disposed on the growth substrate from top to bottom. The conductive pillars are disposed in the light-emitting semiconductor structure. The conductive pillars penetrates is in contact with the second-type semiconductor layer and electrically connected to the substrate. A first portion of the insulating layer is disposed between the first-type semiconductor layer and the substrate, and a second portion of the insulating layer electrically insulates the first-type semiconductor layer and the light emitting-layer from the conductive pillars. The first electrode is electrically connected to the first-type semiconductor layer and electrically insulated from the conductive pillars.

Abstract: A system for controlling an information handling system is disclosed that includes a central processing unit, a memory device, a power supply and a memory speed controller configured to determine one or more system parameters of the central processing unit, the memory device and the power supply, to store a boot setting as a function of the one or more system parameters and to cause a system reboot after storing the boot setting.

Abstract: An electronic device includes a first body, a pivot assembly and a second body. The first body includes a first side and a second side, and the second side includes a groove. The pivot assembly includes a container, a first gear, a second gear and a third gear. The container includes an accommodating space and a side wall. The first gear is disposed in the accommodating space and connected to the groove. The second gear is disposed in the accommodating space, pivotally disposed at the side wall and engaged with the first gear. The third gear is disposed in the accommodating space, pivotally disposed at the side wall and engaged with the second gear. The second body is pivotally disposed at the container and connected to the third gear.

Abstract: The forming method of a flip-chip light emitting diode structure includes the following steps. A first substrate including a first semiconductor layer, an active layer on the first semiconductor layer and a second semiconductor layer on the active layer is provided. A first current blocking layer is formed on the second semiconductor layer, in which the first current blocking layer has a plurality of interspaces. A reflective layer covering the interspaces is formed, in which the reflective layer has a plurality of recesses, and each of the recesses is corresponding to each of the interspaces. A second current blocking layer filling into the recesses is formed.

Abstract: Clickpad structures may be attached to surfaces of an information handling system using material stacks comprising an elastic material, such as a sponge, which can preload a force on the clickpad surface. The preloaded force reduces a gap between the clickpad switch and contact point, which reduces instability, rattling, and other negative experiences with the clickpad surface experienced by a user. According to an embodiment, an input device for an information handling system includes a clickpad surface having a first side configured to receive user input and a second side opposite the first side; a first coupling stack comprising a first elastic material with a first thickness; and a second coupling stack comprising a second elastic material with a second thickness, wherein each of the coupling stacks is attached to the clickpad surface and a surface of the information handling system by adhesives.

Abstract: The flip-chip light emitting diode structure includes a substrate, a first patterned current blocking layer, a second patterned current blocking layer, a first semiconductor layer, an active layer and a second semiconductor layer. The first patterned current blocking layer is disposed on the substrate. The second patterned current blocking layer is disposed on the first patterned current blocking layer, in which the first patterned current blocking layer and the second patterned current blocking layer are located on different planes, and patterns of the first patterned current blocking layer and patterns of the second current blocking layer are substantially complementary. The first semiconductor layer is disposed on the second patterned current blocking layer. The active layer is disposed on the first semiconductor layer. The second semiconductor layer is disposed on the active layer, in which electrical properties of the second semiconductor layer and the first semiconductor layer are different.

Abstract: A system for controlling an information handling system is disclosed that includes a central processing unit, a memory device, a power supply and a memory speed controller configured to determine one or more system parameters of the central processing unit, the memory device and the power supply, to store a boot setting as a function of the one or more system parameters and to cause a system reboot after storing the boot setting.

Abstract: A system for controlling an information handling system is disclosed that includes a central processing unit, a memory device, a power supply and a memory speed controller configured to determine one or more system parameters of the central processing unit, the memory device and the power supply, to store a boot setting as a function of the one or more system parameters and to cause a system reboot after storing the boot setting.

Abstract: An electronic device includes a first body, a pivot assembly and a second body. The first body includes a first side and a second side, and the second side includes a groove. The pivot assembly includes a container, a first gear, a second gear and a third gear. The container includes an accommodating space and a side wall. The first gear is disposed in the accommodating space and connected to the groove. The second gear is disposed in the accommodating space, pivotally disposed at the side wall and engaged with the first gear. The third gear is disposed in the accommodating space, pivotally disposed at the side wall and engaged with the second gear. The second body is pivotally disposed at the container and connected to the third gear.

Abstract: The light emitting device includes a substrate, a light-emitting semiconductor structure, conductive pillars, an insulating layer, and first and second electrodes. The light-emitting semiconductor structure includes a first-type semiconductor layer, a light-emitting layer and a second-type semiconductor layer disposed on the substrate from bottom to top. The conductive pillars are disposed in the light-emitting semiconductor structure. The conductive pillars penetrates is in contact with the second-type semiconductor layer and electrically connected to the substrate. A first portion of the insulating layer is disposed between the first-type semiconductor layer and the substrate, and a second portion of the insulating layer electrically insulates the first-type semiconductor layer and the light emitting-layer from the conductive pillars. The first electrode is electrically connected to the first-type semiconductor layer and electrically insulated from the conductive pillars.

Abstract: A system for controlling an information handling system is disclosed that includes a central processing unit, a memory device, a power supply and a memory speed controller configured to determine one or more system parameters of the central processing unit, the memory device and the power supply, to store a boot setting as a function of the one or more system parameters and to cause a system reboot after storing the boot setting.

Abstract: The flip-chip light emitting diode structure includes a substrate, a first patterned current blocking layer, a second patterned current blocking layer, a first semiconductor layer, an active layer and a second semiconductor layer. The first patterned current blocking layer is disposed on the substrate. The second patterned current blocking layer is disposed on the first patterned current blocking layer, in which the first patterned current blocking layer and the second patterned current blocking layer are located on different planes, and patterns of the first patterned current blocking layer and patterns of the second current blocking layer are substantially complementary. The first semiconductor layer is disposed on the second patterned current blocking layer. The active layer is disposed on the first semiconductor layer. The second semiconductor layer is disposed on the active layer, in which electrical properties of the second semiconductor layer and the first semiconductor layer are different.

Abstract: A method and device for fisheye camera automatic calibration is disclosed. A first straight line and a second straight line are respectively moved to generate a first fisheye line and a second fisheye line being straight lines. At least two symmetric points are generated on the second straight line based on an intersection of the first straight line and the second straight line as a symmetric central point, so as to correspondingly generate at least two fisheye symmetric points. The second straight line rotates until a distance between the first fisheye line and each of two fisheye symmetric points is equal. Then, central intersection coordinates, fisheye symmetric coordinates, a fisheye symmetric distance are retrieved and used to calculate fisheye parameters.

Abstract: A touch panel includes a substrate, a light-shielding layer, a patterned transparent layer, a reflecting layer, at least one first sensing series, and at least one second sensing series. The substrate has a touch sensing region and a peripheral region. The light-shielding layer is disposed in the periphery region. The light-shielding layer has a patterned opening and a sidewall adjacent to the patterned opening. The patterned opening is configured to provide a mark identifiable by human eyes. The patterned transparent layer is disposed in the peripheral region, and the patterned transparent layer covers a portion of the patterned opening. The patterned transparent layer has an inclined sidewall positioned in the patterned opening. The reflecting layer covers the inclined sidewall and the patterned opening. The first sensing series and the second sensing series are arranged in the touch sensing region to detect a position of a touch point.

Abstract: An information handling system can include a base, a printed circuit board including a capacitive switch, and a cover. The printed circuit board can be attached to the base, and the cover can lie adjacent to the printed circuit board. The capacitive switch can be configured to change state when an object is close to the cover. The cover can be configured such that it can be detached from the remainder of the information handling system while the printed circuit board remains attached to the base. The configuration of the printed circuit board and cover can be particularly useful when maintaining a keyboard or a touch pad or when replacing the cover.