Patents by Inventor SHIH-WEN PENG

SHIH-WEN PENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160103508
    Abstract: A transparent conductive film includes a transparent substrate. A support layer is formed on one surface of the substrate. A surface of the support layer away from the substrate defines grooves formed in a mesh pattern. An ink layer is formed at a bottom of the grooves. A conductive layer is formed on the ink layer and in a mesh pattern. A top of the conductive layer protrudes out of the grooves.
    Type: Application
    Filed: November 28, 2014
    Publication date: April 14, 2016
    Inventors: TEN-HSING JAW, CHIN-YANG WU, CHIU-CHI CHEN, SHIH-WEN PENG, TE-JEN TSENG, CHENG-HSIN CHUANG