Abstract: An inductor package is described comprising a mold interconnection substrate having an embedded spiral coil inductor, a fan-out redistribution layer connected to the spiral coil inductor by a copper post wiring structure, a ferrite toroid coil in between the copper posts, and a semiconductor die mounted on the mold interconnection substrate and connected to the fan-out redistribution layer.

Abstract: A single-side stack up system in package is described. The system in package comprises a first interconnection having redistribution layers therein and having a top surface and a bottom surface, at least one first silicon die mounted on the top surface of the first interconnection and embedded in a first molding compound, at least one first passive component mounted on the top surface of the first interconnection side-by-side with the at least one first silicon die and embedded in a second molding compound, and solder balls mounted on the bottom surface of the first interconnection wherein the solder balls provide package output.