Abstract: A hollow polymeric fiber includes: a tetragonal shape sectional area having four corner points and four edges. The four corner points form a square. All four edges are concave or straight. The fiber has a cross sectional area hollowness ranging from 12 to 25%. The fiber has a titer in a range of from 4 to 16 dtex.

Abstract: A sample chip for electron microscope includes a first substrate having a film layer, a buffer layer, and a body layer, a spacing layer positioned below the first substrate, and a second substrate positioned below the spacing layer. The buffer layer is positioned on the film layer and has a buffer opening corresponding to an area of the film layer, the body layer is positioned on the buffer layer and has a body opening corresponding to the buffer opening of the buffer layer to expose the area of the film layer corresponding to the buffer opening, the body layer has a thickness of 10 ?m-800 ?m, and etching properties of the film layer, the buffer layer, and the body layer are different. A specimen accommodating space is defined in the spacing layer to correspond to the area of the film layer corresponding to the buffer opening.

Abstract: A solid polymeric fiber includes: a six- to ten-fingered sectional area having fingers having central axes. The fingers are positioned unsymmetrically to each of the central axes, and/or the sectional area of the fiber has no rotational axis. In an embodiment, the six- to ten-fingered sectional area is a six-fingered sectional area.

Abstract: A chip packaging device is provided, which includes a main body unit, packaging unit and an aligning unit. The main body unit includes a mounting base, holder and a rotational platform. The packaging unit includes upper and lower bonding elements, upper and lower chips and a mask; a vertical axis is at the middle of the upper and the lower bonding elements, and a horizontal axis is above the lower bonding element. The aligning unit includes an aligning detector and a first focusing detector. When the lower chip and the mask are disposed on the lower bonding element, place the liquid sample in the mask and spread a packaging adhesive over the surface thereof; then, remove the mask and use the aligning detector and the first focusing detector to detect the position of the lower chip respectively, such that the chips can be aligned and bonded with each other.

Abstract: A chip packaging device is provided, which includes a main body unit, packaging unit and an aligning unit. The main body unit includes a mounting base, holder and a rotational platform. The packaging unit includes upper and lower bonding elements, upper and lower chips and a mask; a vertical axis is at the middle of the upper and the lower bonding elements, and a horizontal axis is above the lower bonding element. The aligning unit includes an aligning detector and a first focusing detector. When the lower chip and the mask are disposed on the lower bonding element, place the liquid sample in the mask and spread a packaging adhesive over the surface thereof; then, remove the mask and use the aligning detector and the first focusing detector to detect the position of the lower chip respectively, such that the chips can be aligned and bonded with each other.

Abstract: A sample chip for electron microscope includes a first substrate having a film layer, a buffer layer, and a body layer, a spacing layer positioned below the first substrate, and a second substrate positioned below the spacing layer. The buffer layer is positioned on the film layer and has a buffer opening corresponding to an area of the film layer, the body layer is positioned on the buffer layer and has a body opening corresponding to the buffer opening of the buffer layer to expose the area of the film layer corresponding to the buffer opening, the body layer has a thickness of 10 ?m-800 ?m, and etching properties of the film layer, the buffer layer, and the body layer are different. A specimen accommodating space is defined in the spacing layer to correspond to the area of the film layer corresponding to the buffer opening.

Abstract: The present invention provides a packaging unit for liquid sample loading devices applied in an electron microscope. The liquid sample loading devices may be easily, rapidly, precisely and stably aligned and packaged by an engagement of an upper jig and a bottom jig as well as a first fixing pillar supported in a slide track of the packaging unit. Accordingly, efficiency and a yield of packaging the liquid sample loading devices may be improved. In addition, the packaging unit for the liquid sample loading devices of the present invention may directly package a liquid sample, and thus the liquid sample may maintain its original state.

Abstract: A liquid sample carrier includes a first base that includes a first carrying portion having a first sample holding surface, and a second base that is connectable to the first base and that includes a second carrying portion, a support layer, and a second sample holding surface. The second carrying portion is stackable on the first carrying portion, and has a surrounding wall defining a through hole. The support layer is connected to the second carrying portion and has a window area corresponding to the through hole, and a peripheral area surrounding the window area. The second sample holding surface is connected to the support layer. A sample receiving area is formed between the first and second sample holding surfaces.

Abstract: The present invention provides a packaging unit for liquid sample loading devices applied in an electron microscope. The liquid sample loading devices may be easily, rapidly, precisely and stably aligned and packaged by an engagement of an upper jig and a bottom jig as well as a first fixing pillar supported in a slide track of the packaging unit. Accordingly, efficiency and a yield of packaging the liquid sample loading devices may be improved. In addition, the packaging unit for the liquid sample loading devices of the present invention may directly package a liquid sample, and thus the liquid sample may maintain its original state.

Abstract: A method for preparing an inorganic nano-material is provided. The method includes steps of providing a first solution including plural metal ions; mixing the first solution with a surfactant and adding a reduction agent to generate a second solution, wherein the second solution generates plural metal atoms reduced from the plural metal ions; and adding an oxidation agent into the second solution for oxidizing the plural metal atoms so as to generate plural metal oxides and form the inorganic nano-material.