Patents by Inventor Shih Y. Lee

Shih Y. Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4168518
    Abstract: A pressure sensing transducer and method of construction therefor. The device includes a pair of contoured dielectric plates joined together at their periphery and having a central portion with conductive film on opposed portions of the inner surfaces of the dielectric plates. One or more regions between the central portion and the periphery are of reduced thickness and pressure or force loading of the transducer causes deformation to occur in the dielectric elements to cause the spacing between the conductive films to vary in relationship to the applied pressure or force. The regions of reduced cross-section serve to reduce the stress setting up in the joint and to reduce the distortion of the central portion due to the application of pressure or force. The device further includes means for electrically coupling each of the conductive films to an associated terminal exterior of the transducer.
    Type: Grant
    Filed: May 10, 1977
    Date of Patent: September 18, 1979
    Inventor: Shih Y. Lee
  • Patent number: 4168517
    Abstract: A pressure-sensing transducer and method of construction therefor. The device includes a dielectric plate joined to the periphery of a diaphragm and having a central portion with conductive film which serves as a capacitor plate and faces the diaphragm which forms the other capacitor plate. A deep convolution formed near the rim of the diaphragm provides a relatively rigid ring-shaped structure in comparison to the relatively flexible central portion of the diaphragm. As the central portion deflects under pressure, the rigid convolution serves to prevent the motion from being transmitted to the outer rim of the diaphragm and thus to minimize hysteresis. The device further includes a relatively thin annular structure against which the dielectric plate and diaphragm are clamped directly or through the use of a clamping collar. The conductive film and diaphragm are connected to exterior terminals.
    Type: Grant
    Filed: November 10, 1977
    Date of Patent: September 18, 1979
    Inventor: Shih Y. Lee