Abstract: A device a includes a substrate, two source/drain (S/D) features over the substrate, and semiconductor layers suspended over the substrate and connecting the two S/D features. The device further includes a dielectric layer disposed between two adjacent layers of the semiconductor layers and an air gap between the dielectric layer and one of the S/D features, where a ratio between a length of the air gap to a thickness of the first dielectric layer is in a range of 0.1 to 1.0.

Abstract: A display may have an array of pixels. Display driver circuitry may supply data and control signals to the pixels. Each pixel may have seven transistors, a capacitor, and a light-emitting diode such as an organic light-emitting diode. The seven transistors may receive control signals using horizontal control lines. Each pixel may have first and second emission enable transistors that are coupled in series with a drive transistor and the light-emitting diode of that pixel. The first and second emission enable transistors may be coupled to a common control line or may be separately controlled so that on-bias stress can be effectively applied to the drive transistor. The display driver circuitry may have gate driver circuits that provide different gate line signals to different rows of pixels within the display. Different rows may also have different gate driver strengths and different supplemental gate line loading structures.

Abstract: Disclosed is a semiconductor fabrication method. The method includes forming a gate stack in an area previously occupied by a dummy gate structure; forming a first metal cap layer over the gate stack; forming a first dielectric cap layer over the first metal cap layer; selectively removing a portion of the gate stack and the first metal cap layer while leaving a sidewall portion of the first metal cap layer that extends along a sidewall of the first dielectric cap layer; forming a second metal cap layer over the gate stack and the first metal cap layer wherein a sidewall portion of the second metal cap layer extends further along a sidewall of the first dielectric cap layer; forming a second dielectric cap layer over the second metal cap layer; and flattening a top layer of the first dielectric cap layer and the second dielectric cap layer using planarization operations.

Abstract: An electrical connector assembly includes: a bracket; and at least one transmission assembly mounted to the bracket and including an internal printed circuit board (PCB), a board-mount connector connected to a first row of conductive pads disposed at a bottom end portion of the PCB, and a plug-in connector connected to a second row of conductive pads disposed at a front end portion of the PCB, wherein the PCB has a third row of conductive pads disposed at a rear end portion thereof.

Abstract: A tube cutter includes a handle, a carrier, a circular knife, a knob, a threaded rod and a spring. The handle includes an aperture. The carrier is movably connected to the handle, and includes a screw hole. The circular knife is supported on the carrier. The knob is rotationally connected to the handle and includes a non-circular recess. The threaded rod includes a threaded section inserted in the screw hole, a shank inserted in the aperture, and a non-circular head inserted in the non-circular recess. The spring is compressed between the handle and the non-circular head to render the threaded rod smoothly movable relative to the handle.

Abstract: A method for manufacturing a dull polyamide 56 fiber includes steps as follows. Bright polyamide 56 chips are provided. A viscosity adjusting step is provided, wherein a relative viscosity in sulfuric acid of the bright polyamide 56 chips is adjusted to a range of 2.90 to 3.00. A moisture adjusting step is provided, wherein a moisture content of the bright polyamide 56 chips is adjusted to a range of 350 to 550 ppm. A spinning step is provided, which includes providing dull polyamide 6 chips and a blending step. The dull polyamide 6 chips include TiO2. In the blending step, the dull polyamide 6 chips and the bright polyamide 56 chips dealt with the viscosity adjusting step and the moisture adjusting step are melted and blended, and then spun at a temperature ranging from 275° C. to 285° C., thus the dull polyamide 56 fiber is obtained.

Abstract: A method for manufacturing a dull polyamide 56 fiber includes steps as follows. Bright polyamide 56 chips are provided. A viscosity adjusting step is provided, wherein a relative viscosity in sulfuric acid of the bright polyamide 56 chips is adjusted to a range of 2.90 to 3.00. A moisture adjusting step is provided, wherein a moisture content of the bright polyamide 56 chips is adjusted to a range of 350 to 550 ppm. A spinning step is provided, which includes providing dull polyamide 6 chips and a blending step. The dull polyamide 6 chips include TiO2. In the blending step, the dull polyamide 6 chips and the bright polyamide 56 chips dealt with the viscosity adjusting step and the moisture adjusting step are melted and blended, and then spun at a temperature ranging from 275° C. to 285° C., thus the dull polyamide 56 fiber is obtained.

Abstract: A steam cleaner includes a housing, a head cleaning member fitted to an upper end opening of the housing, an electric heater received in the housing, a pump also received in the housing, and a water container secured to the bottom of the housing. The pump has an inlet connected to the water container, and an outlet connected to a water pipe passing through the electric heater. A nozzle is connected to the upper end of the water pipe. When the pump and the heater are activated, the pump forces the water in the container through the water pipe for allowing the water to be heated to become steam by the electric heater. The steam is sent out via both the nozzle and the head member to help kill bacteria when the head member is rubbed against an object in cleaning.