Patents by Inventor Shih Yao Chen

Shih Yao Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240154025
    Abstract: A method of forming a semiconductor device includes: forming a fin protruding above a substrate; forming isolation regions on opposing sides of the fin; forming a dummy gate electrode over the fin; removing lower portions of the dummy gate electrode proximate to the isolation regions, where after removing the lower portions, there is a gap between the isolation regions and a lower surface of the dummy gate electrode facing the isolation regions; filling the gap with a gate fill material; after filling the gap, forming gate spacers along sidewalls of the dummy gate electrode and along sidewalls of the gate fill material; and replacing the dummy gate electrode and the gate fill material with a metal
    Type: Application
    Filed: January 10, 2024
    Publication date: May 9, 2024
    Inventors: Shih-Yao Lin, Kuei-Yu Kao, Chih-Han Lin, Ming-Ching Chang, Chao-Cheng Chen
  • Publication number: 20240131655
    Abstract: The present disclosure provides a chemical mechanical polishing device including a retaining ring and a wafer carrier and a polishing method. The retaining ring is configured on a polishing pad and includes an inner sidewall defining an opening and an outer sidewall opposite to the inner sidewall. The wafer carrier is configured on the polishing pad and is capable of placing a wafer disposed thereon into the opening and facing the polishing pad. The retaining ring has a notch at the corner adjacent to the wafer and the polishing pad.
    Type: Application
    Filed: November 28, 2022
    Publication date: April 25, 2024
    Applicant: Powerchip Semiconductor Manufacturing Corporation
    Inventors: Ming-Hsiang Chen, Shih-Ci Yen, Kai-Yao Shih
  • Publication number: 20240128324
    Abstract: A field effect transistor includes a substrate having a transistor forming region thereon; an insulating layer on the substrate; a first graphene layer on the insulating layer within the transistor forming region; an etch stop layer on the first graphene layer within the transistor forming region; a first inter-layer dielectric layer on the etch stop layer; a gate trench recessed into the first inter-layer dielectric layer and the etch stop layer within the transistor forming region; a second graphene layer on interior surface of the gate trench; a gate dielectric layer on the second graphene layer and on the first inter-layer dielectric layer; and a gate electrode on the gate dielectric layer within the gate trench.
    Type: Application
    Filed: November 21, 2022
    Publication date: April 18, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Kuo-Chih Lai, Shih-Min Chou, Nien-Ting Ho, Wei-Ming Hsiao, Li-Han Chen, Szu-Yao Yu, Chung-Yi Chiu
  • Patent number: 11961899
    Abstract: A semiconductor device includes a gate structure extending along a first lateral direction. The semiconductor device includes a source/drain structure disposed on one side of the gate structure along a second lateral direction, the second lateral direction perpendicular to the first lateral direction. The semiconductor device includes an air gap disposed between the gate structure and the source/drain structure along the second lateral direction, wherein the air gap is disposed over the source/drain structure.
    Type: Grant
    Filed: January 23, 2023
    Date of Patent: April 16, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shih-Yao Lin, Hsiao Wen Lee, Yu-Shan Cheng, Chao-Cheng Chen
  • Patent number: 11955385
    Abstract: A semiconductor device includes a first stack structure, a second stack structure, and a third stack structure. Each of the stack structure includes semiconductor layers vertically spaced from one another. The first, second, and third stack structures all extend along a first lateral direction. The second stack structure is disposed between the first and third stack structures. The semiconductor device includes a first gate structure that extends along a second lateral direction and wraps around each of the semiconductor layers. The semiconductor layers of the first stack structure are coupled with respective source/drain structures. The semiconductor layers of the second stack structure are coupled with respective source/drain structures. The semiconductor layers of the third stack structure are coupled with a dielectric passivation layer.
    Type: Grant
    Filed: August 27, 2021
    Date of Patent: April 9, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shih-Yao Lin, Chih-Han Lin, Chen-Ping Chen, Hsiao Wen Lee
  • Publication number: 20240107755
    Abstract: Various embodiments of the present disclosure are directed towards a semiconductor structure including a first well region disposed within a substrate and comprising a first doping type. A conductive structure overlies the first well region. A pair of first doped regions is disposed within the first well region on opposing sides of the conductive structure. The pair of first doped regions comprise a second doping type opposite the first doping type. A pair of second doped regions is disposed within the first well region on the opposing sides of the conductive structure. The pair of second doped regions comprise the second doping type and are laterally offset from the pair of first doped regions by a non-zero distance.
    Type: Application
    Filed: December 11, 2023
    Publication date: March 28, 2024
    Inventors: Shih-Hsien Chen, Chun-Yao Ko, Felix Ying-Kit Tsui
  • Patent number: 11942363
    Abstract: A method includes etching a semiconductor substrate to form a trench, with the semiconductor substrate having a sidewall facing the trench, and depositing a first semiconductor layer extending into the trench. The first semiconductor layer includes a first bottom portion at a bottom of the trench, and a first sidewall portion on the sidewall of the semiconductor substrate. The first sidewall portion is removed to reveal the sidewall of the semiconductor substrate. The method further includes depositing a second semiconductor layer extending into the trench, with the second semiconductor layer having a second bottom portion over the first bottom portion, and a second sidewall portion contacting the sidewall of the semiconductor substrate. The second sidewall portion is removed to reveal the sidewall of the semiconductor substrate.
    Type: Grant
    Filed: August 9, 2022
    Date of Patent: March 26, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shih-Yao Lin, Kuei-Yu Kao, Chen-Ping Chen, Chih-Han Lin
  • Publication number: 20240096893
    Abstract: A semiconductor device includes a substrate. The semiconductor device includes a fin that is formed over the substrate and extends along a first direction. The semiconductor device includes a gate structure that straddles the fin and extends along a second direction perpendicular to the first direction. The semiconductor device includes a first source/drain structure coupled to a first end of the fin along the first direction. The gate structure includes a first portion protruding toward the first source/drain structure along the first direction. A tip edge of the first protruded portion is vertically above a bottom surface of the gate structure.
    Type: Application
    Filed: November 24, 2023
    Publication date: March 21, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Shih-Yao Lin, Chao-Cheng Chen, Chih-Han Lin, Ming-Ching Chang, Wei-Liang Lu, Kuei-Yu Kao
  • Patent number: 11923440
    Abstract: A method of fabricating a semiconductor device is disclosed. The method includes forming semiconductor fins on a substrate. A first dummy gate is formed over the semiconductor fins. A recess is formed in the first dummy gate, and the recess is disposed between the semiconductor fins. A dummy fin material is formed in the recess. A portion of the dummy fin material is removed to expose an upper surface of the first dummy gate and to form a dummy fin. A second dummy gate is formed on the exposed upper surface of the first dummy gate.
    Type: Grant
    Filed: July 26, 2022
    Date of Patent: March 5, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shih-Yao Lin, Chen-Ping Chen, Kuei-Yu Kao, Hsiao Wen Lee, Chih-Han Lin
  • Publication number: 20220281643
    Abstract: A retractable carrying container is provided, comprising an outer shell, an inner shell, and corresponding first and second threads. The outer shell is a hollow cylinder, and the inner shell is arranged inside the outer shell. An application head is installed on the inner shell. The outer surface of the inner shell has an upper stopper and a lower stopper, the upper stopper is arranged on the upper edge of the second thread, the lower stopper is arranged at the lower edge of the second thread, and the outer shell and the inner shell move with respect to each other by the interaction of the first thread and the second thread.
    Type: Application
    Filed: March 8, 2021
    Publication date: September 8, 2022
    Inventor: Shih-Yao CHEN
  • Publication number: 20190186969
    Abstract: The disclosure provides a sensing device including a supporting member, a thermal resistance portion, a sensing unit and a heating unit. The supporting member has a supporting surface. The thermal resistance portion is located within the supporting member, wherein a thermal conductivity of the thermal resistance portion is less than a thermal conductivity of the supporting member. The sensing unit is disposed on the supporting surface. The heating unit is disposed on the supporting surface, wherein the heating unit is configured to heat the sensing unit, and an orthogonal projection of the heating unit on the supporting surface overlaps an orthogonal projection of the thermal resistance portion on the supporting surface. In addition, the disclosure also provides a method for manufacturing the sensing device.
    Type: Application
    Filed: January 30, 2018
    Publication date: June 20, 2019
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Shih-Yao Chen, Kuan-Wei Chen, Pei-Jer Tzeng, Wen Wang
  • Publication number: 20140207461
    Abstract: A car A/V system head unit includes a text message receiving and decoding device for receiving a text message sent by an external communication device and decoding the text message into a decoded data signal, a display device including a display zone for display the decoded data signal and function selection touch zones selectively touchable by a person to select different functions, a text/voice converter for converting the decoded data signal into a voice signal, and a voice output system for outputting the voice signal. Thus, the car A/V system head unit can convert each received text message into a voice signal and output the voice signal directly in the car, avoiding distracted driving and enhancing driver safety.
    Type: Application
    Filed: January 24, 2013
    Publication date: July 24, 2014
    Inventor: Shih-Yao CHEN
  • Publication number: 20140121858
    Abstract: A car central locking system remote controller includes a smart phone, tablet PC. Notebook or any other wireless communication device, a central locking system driver for driving a pull rod to move a mechanical locking mechanism of a central locking system of a car to lock or unlock the doors of the car, and a main control box carrying a micro controller unit for controlling the central locking system driver and a wireless communication module electrically connected to the micro controller unit and adapted for establishing a communication protocol interface with the wireless communication device for enabling the micro controller unit to be controlled by the wireless communication device to drive the central locking system driver.
    Type: Application
    Filed: October 31, 2012
    Publication date: May 1, 2014
    Inventor: Shih-Yao CHEN
  • Publication number: 20140107820
    Abstract: An audio equipment and wireless electronic device combination system includes an audio equipment having set therein an audio player system, a wireless electronic device, a data stream connected between the wireless electronic device and the audio player system of the audio equipment using Wi-Fi (Wireless Fidelity) or data packet transmission technology. The audio player system includes a CPU for processing the data stream.
    Type: Application
    Filed: October 16, 2012
    Publication date: April 17, 2014
    Inventor: Shih-Yao CHEN
  • Publication number: 20140097945
    Abstract: A wireless digital signal-controlled switch system includes a Wi-Fi embedded RF module for receiving a RF signal from a mobile communication device, a control module with a CPU electrically connected to the Wi-Fi embedded RF module for receiving the RF signal from the Wi-Fi embedded RF module and processing the RF signal, and a relay module electrically connected between a power source and electrical home appliances and controllable by the CPU of the control module to turn on/off the electrical home appliances and to control the operation of the electrical home appliances.
    Type: Application
    Filed: October 9, 2012
    Publication date: April 10, 2014
    Inventor: Shih-Yao CHEN
  • Publication number: 20140092304
    Abstract: A TV and wireless electronic device combination system includes a TV monitor having set therein a TV display system, a wireless electronic device, a data stream connected between the wireless electronic device and the TV display system of the TV monitor using Wi-Fi (Wireless Fidelity) or data packet transmission technology. The TV display system includes a CPU for processing data stream, and a mirror image transmission device for feeding back mirror image picture to the wireless electronic device.
    Type: Application
    Filed: October 2, 2012
    Publication date: April 3, 2014
    Inventor: Shih-Yao CHEN
  • Publication number: 20140038527
    Abstract: A car A/V system for wireless communication application includes a head unit consisting of a first wireless communication module and a multimedia processing device and installed in a car, a smart phone, and a speaker system. The touch panel of the smart phone is operable to generate a command for transmission to the multimedia processing device of the head unit to run a predetermined audio/video data, enabling the processed video data to be transmitted to the smart phone wirelessly for display on the display of the smart phone and the processed audio data to be transmitted to the speaker system for output.
    Type: Application
    Filed: August 6, 2012
    Publication date: February 6, 2014
    Inventor: Shih-Yao CHEN
  • Publication number: 20140009569
    Abstract: A panoramic camera system used in a vehicle event data recorder in a car is disclosed to include front-facing and rear-facing camera lenses respectively installed in opposing front and rear sides of the and electrically connected to the vehicle event data recorder, and a side-facing camera lens mounted inside each of opposing left and right steering lamps of the car and electrically connected to the vehicle event data recorder.
    Type: Application
    Filed: July 5, 2012
    Publication date: January 9, 2014
    Inventor: Shih-Yao CHEN
  • Publication number: 20130182065
    Abstract: A vehicle event data recorder and anti-theft alarm system consisting of a power management system, a 360 degree panoramic lens, a digital data storage unit, a mini display, an operating unit and a wireless communication module is disclosed. When the car is running, the 360 degree panoramic lens picks up images in front of the car for processing through the digital signal processor for enabling the processed image data to be recorded in the digital data storage unit and displayed on the mini display. When the car is parked in a parking place or area, the 360 degree panoramic lens keeps picking up surrounding images, and the digital signal processor immediately actuates an external car anti-theft alarm system/car anti-theft ignition switch cutoff system and drives the wireless communication module to actuate a wireless alarm system in giving off an alarm signal upon occurrence of an abnormal condition.
    Type: Application
    Filed: January 17, 2012
    Publication date: July 18, 2013
    Inventor: Shih-Yao CHEN
  • Publication number: 20130176231
    Abstract: A car stereo head unit includes a control system coupled to the car control computer of the car carrying the car stereo head unit by a CAN BUS, a front face panel electrically coupled with the control system and providing a touchscreen, a display driver module system, an intelligent computer system module, an antenna embedded GPS receiver system and a wireless communication module system, and a FM/AM radio receiver module, a DVD/SD/USB player module, a digital TV receiver and player module and an audio output system electrically coupled to the control system. Subject to touch control through the touchscreen, the control system controls the audio output system to play sound and the touchscreen to play videos. By means of the intelligent computer system module and the wireless communication module system, the car stereo head unit is allowed for mobile phone application and internet access.
    Type: Application
    Filed: January 9, 2012
    Publication date: July 11, 2013
    Inventor: Shih-Yao CHEN