Abstract: A light source module comprises a first light source, a second light source, a first heat sink structure, and a second heat sink structure. The second light source disposed downstream of a main airflow flowing through the first light source module. The first heat sink structure has a plurality of first heat sink fins. The second heat sink structure has a plurality of second heat sink fins, wherein the first light source and the second light source are disposed along a first direction. The first heat sink structure and the second heat sink structure are disposed along the first direction, the first heat sink fins are arranged along the first direction, the second heat sink fins are arranged along a second direction, and the first direction is different from the second direction. A projection apparatus comprising the light source module is also provided.

Abstract: A light source module comprises a first light source, a second light source, a first heat sink structure, and a second heat sink structure. The second light source disposed downstream of a main airflow flowing through the first light source module. The first heat sink structure has a plurality of first heat sink fins. The second heat sink structure has a plurality of second heat sink fins, wherein the first light source and the second light source are disposed along a first direction. The first heat sink structure and the second heat sink structure are disposed along the first direction, the first heat sink fins are arranged along the first direction, the second heat sink fins are arranged along a second direction, and the first direction is different from the second direction. A projection apparatus comprising the light source module is also provided.

Abstract: An optical engine module including a casing, a light valve, and a compensating module is provided. The casing includes an opening. The light valve includes an active surface and is disposed on the casing. The active surface of the light valve is exposed from the opening of the casing and is used for providing a light beam. The compensating module is disposed on the casing and includes an optical compensating element located on a transmission path of the light beam and a heat dissipating support for holding the optical compensating element. When a portion of the active surface is in a first state, the light beam is transmitted to and passes through the optical compensating element. When a portion of the active surface is in a second state, the light beam is transmitted to the heat dissipating support. The optical engine module provided by the disclosure provides good optical effect.

Abstract: An optical engine module including a casing, a light valve, and a compensating module is provided. The casing includes an opening. The light valve includes an active surface and is disposed on the casing. The active surface of the light valve is exposed from the opening of the casing and is used for providing a light beam. The compensating module is disposed on the casing and includes an optical compensating element located on a transmission path of the light beam and a heat dissipating support for holding the optical compensating element. When a portion of the active surface is in a first state, the light beam is transmitted to and passes through the optical compensating element. When a portion of the active surface is in a second state, the light beam is transmitted to the heat dissipating support. The optical engine module provided by the disclosure provides good optical effect.

Abstract: A projection apparatus includes a casing, a light source module, an optical engine module, a heat dissipation module and a projection lens. The casing has multiple air inlets and an air outlet. The light source module is disposed in the casing, and is configured to provide an illumination beam, wherein the light source module includes multiple light sources. The optical engine module is disposed in the casing, and is located on a transmission path of the illumination beam, and is configured to convert the illumination beam into an image beam. The heat dissipation module is disposed in the casing, and is connected to the light sources, where the heat dissipation module includes multiple heat sinks located close to the air inlets, respectively. The projection lens is disposed in the casing, and is connected to the optical engine module, and is configured to project the image beam out of the casing.

Abstract: A projection apparatus includes a casing, a light source module, an optical engine module, a heat dissipation module and a projection lens. The casing has multiple air inlets and an air outlet. The light source module is disposed in the casing, and is configured to provide an illumination beam, wherein the light source module includes multiple light sources. The optical engine module is disposed in the casing, and is located on a transmission path of the illumination beam, and is configured to convert the illumination beam into an image beam. The heat dissipation module is disposed in the casing, and is connected to the light sources, where the heat dissipation module includes multiple heat sinks located close to the air inlets, respectively. The projection lens is disposed in the casing, and is connected to the optical engine module, and is configured to project the image beam out of the casing.

Abstract: The invention discloses a heat dissipation module, comprising a plurality of heat dissipation fins and a plurality of heat pipes. The heat dissipation fins are spaced apart from each other and disposed side by side. A gas flow passageway is formed between two adjacent heat dissipation fins. The gas flow passageway has an inlet end and an outlet end. The outlet end is opposite to the inlet end. Each of the heat pipes is threaded through the heat dissipation fins along an extension direction. In a cross section of each of the heat pipes perpendicular to the extension direction, a maximum length in a first longitudinal direction is L1, a maximum length in a second longitudinal direction is L2, and L1>L2. The invention further provides a heat dissipation module for a projector. The heat dissipation module of the invention is used for enhancing the efficiency of heat dissipation.

Abstract: Method for manufacturing a heat pipe is disclosed. A tube and a vessel mesh are provided. Solder paste in a pattern is coated on the vessel mesh. The vessel mesh is rolled into a vessel and the vessel is placed in the tube. The tube is heat to weld to the vessel to the tube. The present disclosure also provides an exemplary heat pipe having a vessel welded therein.

Abstract: An exemplary electronic device includes a printed circuit board, electronic components mounted on a top surface of the printed circuit board, and a heat dissipation device. The heat dissipation device contacts the electronic components to absorb heat generated from the electronic components and dissipate the heat by natural convection and thermal radiation. The heat dissipation device includes a base plate contacting the electronic components to absorb heat generated therefrom and thermal hairs mounted on a top surface of the base plate. The thermal hairs wave with heated airflow at an inner of the electronic device to dissipate heat transferred from the base plate.

Abstract: An exemplary electronic device includes an electronic component, a heat dissipation device, a fixing member and a casing contained the electronic component, the heat dissipation device and the fixing member therein. The heat dissipation device thermally contacts the electronic component. The fixing member includes a main body and an engaging portion extending from the main body. The engaging portion fixes the heat dissipation device to the fixing member. Fasteners extend through the casing and engage the main body of the fixing member to secure the fixing member on the casing.

Abstract: An exemplary heat sink assembly includes a base plate for thermally contacting an electronic component and fins protruded from the base plate to dissipate heat transferred from the base plate by nature convection and thermal radiation. A heat conductive film is formed on an outer surface of the heat sink. A thermal radiation wavelength region of a far and middle infrared ray is located in a thermal radiation wavelength region of the heat conductive film.

Abstract: An exemplary electronic device includes an electronic component, a heat dissipation device, a fixing member and a casing contained the electronic component, the heat dissipation device and the fixing member therein. The heat dissipation device thermally contacts the electronic component. The fixing member includes a main body and an engaging portion extending from the main body. The engaging portion fixes the heat dissipation device to the fixing member. Fasteners extend through the casing and engage the main body of the fixing member to secure the fixing member on the casing.

Abstract: A heat dissipation device assembly for dissipating heat from an electronic component located on a printed circuit board (PCB), includes a heat dissipation module and a fixing device for fixing the heat dissipation module to the PCB board. The heat dissipation module includes a heat pipe, and the heat pipe includes an evaporating section for directly contacting the electronic component and a condensing section. The fixing device includes a base, and a plurality of latches extending from a bottom surface of the base. The latches cooperatively define a space matching with the evaporating section of the heat pipe and partially receiving the evaporating section. The base abuts on the evaporating section thereby pressing the evaporating section to firmly and directly contact the electronic component.

Abstract: An exemplary electronic device includes a printed circuit board, electronic components mounted on a top surface of the printed circuit board, and a heat dissipation device. The heat dissipation device contacts the electronic components to absorb heat generated from the electronic components and dissipate the heat by natural convection and thermal radiation. The heat dissipation device includes a base plate contacting the electronic components to absorb heat generated therefrom and thermal hairs mounted on a top surface of the base plate. The thermal hairs wave with heated airflow at an inner of the electronic device to dissipate heat transferred from the base plate.

Abstract: A heat dissipation device includes a bracket, a fan with an air inlet and an air outlet, and a heat sink mounted on the bracket. The bracket includes a plurality of rivets and clasps. Each of the clasps includes a mounting portion, an arm extending upwards from the mounting portion, and a hook portion extending from a top end of the arm and towards the mounting portion. The mounting portion is riveted on the bracket by a corresponding rivet. The fan includes a plurality of ears corresponding to the clasps. The hook portions of the clasps abut on top surfaces of the ears to fix the fan on the bracket. The fan defines a plurality of channels communicating the outlet of the fan.

Abstract: An exemplary heat dissipation device includes a heat absorbing base, a heat pipe thermally connected to the heat absorbing base, and a fixing member including a main body abutting to the heat absorbing base and two clamps extending from the main body, the heat pipe is sandwiched between the main body and the heat absorbing base, each of the clamps includes an arm portion and a curved portion extending from the arm portion toward the heat absorbing base, the arm portions of the two clamps clamp two opposite lateral sides of the heat absorbing base, the curved portions of the two clamps elastically clamp edges of the heat absorbing base away from the main body.

Abstract: An exemplary can heating and cooling device includes a container made of thermally conductive material, a heat spreader with a heat spreading portion and a heat exchanging portion, and a heat exchanger with a thermoelectric cooling chip and a heat sink. The container includes an outer side wall with a planar thermal contacting section of the container. The heat spreading portion of the heat spreader contacts the outer side wall of the container. The heat exchanging portion of the heat spreader contacts the planar thermal contacting section of the container. The thermoelectric cooling chip includes a first surface thermally connected with the heat exchanging portion of the heat spreader, and a second surface thermally connected with the heat sink.