Abstract: Some embodiments relate an integrated circuit (IC) including a first substrate. An interconnect structure is disposed over the first substrate. The interconnect structure includes a plurality of metal features that are stacked over one another. A lowermost metal feature of the plurality of metal features is closest to the first substrate, an uppermost metal feature of the plurality of metal features is furthest from the first substrate, and intermediate metal features are disposed between the lowermost metal feature and the uppermost metal feature. A recess extends into the interconnect structure and terminates at a bond pad. A lower surface of the bond pad directly contacts an upper surface of the lowermost metal feature.

Abstract: The present invention provides an inspection apparatus for osseointegration of implants, which comprises an inspection base, a holding end, and an inspection end. The holding end is disposed at one end of the inspection base; the inspection end is disposed at the other end of the inspection base. Beside, the inspection end is disposed on one side of the holding end. The holding end includes a signal processing module and a wireless transmission module therein. The inspection end includes an inspection probe, disposed at one end of the inspection end. The inspection probe includes one or more excitation device and a receiver located on the same side of the inspection probe. According to the present invention, the inspection apparatus detects the condition of an object under inspection in a non-contact manner by using an excitation source. An acquired displacement difference is then transmitted to an electronic apparatus through wireless transmission.

Abstract: The present invention provides an inspection apparatus for osseointegration of implants, which comprises an inspection base, a holding end, and an inspection end. The holding end is disposed at one end of the inspection base; the inspection end is disposed at the other end of the inspection base. Beside, the inspection end is disposed on one side of the holding end. The holding end includes a signal processing module and a wireless transmission module therein. The inspection end includes an inspection probe, disposed at one end of the inspection end. The inspection probe includes one or more excitation device and a receiver located on the same side of the inspection probe. According to the present invention, the inspection apparatus detects the condition of an object under inspection in a non-contact manner by using an excitation source. An acquired displacement difference is then transmitted to an electronic apparatus through wireless transmission.

Abstract: A method for generating a parity check matrix to decode a plurality of underdetermined nodes, includes the steps of: determining a plurality of specific nodes according to a predetermined parity check matrix; determining a plurality of weightings corresponding to the plurality of specific nodes; and sorting the plurality of specific nodes according to the plurality of weightings to generate the parity check matrix to store in a storage device.

Abstract: A method for generating a parity check matrix to decode a plurality of underdetermined nodes, includes the steps of: determining a plurality of specific nodes according to a predetermined parity check matrix; determining a plurality of weightings corresponding to the plurality of specific nodes; and sorting the plurality of specific nodes according to the plurality of weightings to generate the parity check matrix to store in a storage device.