Patents by Inventor Shih-Yen Peng

Shih-Yen Peng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PACKAGE STRUCTURE
    Publication number: 20240128151
    Abstract: A package structure includes a bonding substrate, an integrated circuit, and a heat sink metal. The integrated circuit includes an active region facing the bonding substrate. The heat sink metal is located between the bonding substrate and the active region of the integrated circuit. The heat sink metal is electrically insulated with the integrated circuit.
    Type: Application
    Filed: October 16, 2023
    Publication date: April 18, 2024
    Inventors: Chun-Yen PENG, Kuo-Bin HONG, Shih-Chen CHEN, Hao-Chung KUO
  • Wide band antenna
    Patent number: 8378896
    Abstract: A wide band antenna includes a radiation element, a ground surface, a dielectric element, a connector; a first microstrip feeder and a second microstrip feeder. The radiation element is a rectangle shaped and includes a first side and a second side. The lengths of the first side and the second side are not equal. The dielectric element is positioned between the radiation element and the ground surface. One end of the first microstrip feeder is connected to the first side of the radiation element. One end of the second microstrip feeder is connected to the second side of the radiation element, the other ends of the first and second microstrip feeder are connected to the connector.
    Type: Grant
    Filed: July 22, 2010
    Date of Patent: February 19, 2013
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Chih-Yuan Yang, Shih-Yen Peng, Chien-Tang Lin, Hung-Chang Ko
  • WIDE BAND ANTENNA
    Publication number: 20110156961
    Abstract: A wide band antenna includes a radiation element, a ground surface, a dielectric element, a connector; a first microstrip feeder and a second microstrip feeder. The radiation element is a rectangle shaped and includes a first side and a second side. The lengths of the first side and the second side are not equal. The dielectric element is positioned between the radiation element and the ground surface. One end of the first microstrip feeder is connected to the first side of the radiation element. One end of the second microstrip feeder is connected to the second side of the radiation element, the other ends of the first and second microstrip feeder are connected to the connector.
    Type: Application
    Filed: July 22, 2010
    Publication date: June 30, 2011
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: CHIH-YUAN YANG, SHIH-YEN PENG, CHIEN-TANG LIN, HUNG-CHANG KO