Patents by Inventor Shih-yi Chang
Shih-yi Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12046663Abstract: A method includes forming a first fin and a second fin over a substrate. The method includes forming a first dummy gate structure that straddles the first fin and the second fin. The first dummy gate structure includes a first dummy gate dielectric and a first dummy gate disposed over the first dummy gate dielectric. The method includes replacing a portion of the first dummy gate with a gate isolation structure. The portion of the first dummy gate is disposed over the second fin. The method includes removing the first dummy gate. The method includes removing a first portion of the first dummy gate dielectric around the first fin, while leaving a second portion of the first dummy gate dielectric around the second fin intact. The method includes forming a gate feature straddling the first fin and the second fin, wherein the gate isolation structure intersects the gate feature.Type: GrantFiled: March 23, 2023Date of Patent: July 23, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITEDInventors: Shih-Yao Lin, Chih-Han Lin, Shu-Uei Jang, Ya-Yi Tsai, Chi-Hsiang Chang, Tzu-Chung Wang, Shu-Yuan Ku
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Patent number: 12040561Abstract: An antenna module includes a transceiver chip, a transmitting array antenna, a receiving array antenna, two bandpass filters, and two capacitors. The transmitting array antenna and the receiving array antenna are symmetrically disposed at the two opposite sides of the transceiver chip. One of the bandpass filters is disposed between the transceiver chip and the transmitting array antenna and connected to the transceiver chip and the transmitting array antenna. The other bandpass filter is disposed between the transceiver chip and the receiving array antenna and connected to the transceiver chip and the receiving array antenna. One of the capacitors is disposed between the transmitting array antenna and the corresponding bandpass filter and connected to the transmitting array antenna and the corresponding bandpass filter. The other capacitor is disposed between the receiving array antenna and the corresponding bandpass filter and connected to the receiving array antenna and the corresponding bandpass filter.Type: GrantFiled: October 17, 2022Date of Patent: July 16, 2024Assignee: PEGATRON CORPORATIONInventors: Tse-Hsuan Wang, Chien-Yi Wu, Chih-Fu Chang, Chao-Hsu Wu, Chih-Yi Chiu, Wei-Han Yen, Tsung-Chi Tsai, Shih-Keng Huang, I-Shu Lee
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Publication number: 20230232871Abstract: The present invention discloses a UV sterilization fresh-keeping box, including an accommodating box and a UV sterilization device removably disposed on a top side of the accommodating box. The accommodating box includes a box body with a storage space, and a lid disposed on the box body. The lid has a light transmission part to allow UV light to pass through, and a first assembling part disposed on a peripheral side of the light transmission part. The UV sterilization device includes a case, a UV module disposed in the case, a control module electrically connected to the UV module, and a second assembling part disposed on a bottom side of the case. The UV sterilization device is mounted onto the lid by combining the second assembling part with the first assembling part. The UV module is controlled by the control module to emit UV light towards the light transmission part, so as to sterilize the storage space.Type: ApplicationFiled: January 20, 2023Publication date: July 27, 2023Inventors: Tung-Yang Wu, Shih-Yi Chang, Hsuan-Hui Wang
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Publication number: 20230027808Abstract: A safe sterilization unit includes a bearing portion, a light source portion and at least one safety switch. The bearing portion includes two surfaces corresponding to each other; the light source portion is configured to generate sterilization light, and is disposed on one surface of the bearing portion; and the safety switch is disposed on one side surface, provided with the light source portion, of the bearing portion, and is connected with the light source portion. The safety switch is disposed to sense light to generate a sensing message, and to regulate power supply of the light source portion according to the sensing message.Type: ApplicationFiled: July 22, 2022Publication date: January 26, 2023Inventors: Hsuan-Hui Wang, Shih-Yi Chang, Jung-Chen Liao, Tung-Yang Wu
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Patent number: 11235999Abstract: A water treatment system is provided with an untreated water reservoir having a cavity through which a filter assembly may traverse such that untreated water in the cavity passes through the filter assembly into a treated water reservoir. Removal of the filter assembly may be facilitated by a seal disengagement element operable to unseat a seal formed during efforts to direct untreated water through the filter assembly.Type: GrantFiled: October 23, 2020Date of Patent: February 1, 2022Assignee: Access Business Group International LLCInventors: Ziqi Wu, Karlis Vecziedins, Shih-Yi Chang, Tianxiong Zeng, Terry L Lautzenheiser, Daniel L. Schlenk, Bradley J. Pippel
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Publication number: 20210171384Abstract: A water treatment system is provided with an untreated water reservoir having a cavity through which a filter assembly may traverse such that untreated water in the cavity passes through the filter assembly into a treated water reservoir. Removal of the filter assembly may be facilitated by a seal disengagement element operable to unseat a seal formed during efforts to direct untreated water through the filter assembly.Type: ApplicationFiled: October 23, 2020Publication date: June 10, 2021Inventors: Ziqi Wu, Karlis Vecziedins, Shih-Yi Chang, Tianxiong Zeng, Terry L. Lautzenheiser, Daniel L. Schlenk, Bradley J. Pippel
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Patent number: 9982896Abstract: A water supply structure of a liquid cooling device, a pump and a liquid cooling device having the water supply structure are disclosed. The water supply structure, disposed on the cooling device or on the pump, includes a lower lid, an upper lid, and a pressure control member. An outlet is in the lower lid and communicates with the cooling device or with the pump. The upper lid is combined on the lower lid. A chamber, formed between the lower lid and the upper lid, communicates with the outlet and accommodates a coolant. The pressure control member is moveable in the chamber and includes a piston and an elastic part controlling the piston to move inside the chamber. The elastic part pushes against the piston to move inside the chamber such that the coolant is injected into the cooling device until hydraulic pressure equilibrium is achieved.Type: GrantFiled: September 25, 2015Date of Patent: May 29, 2018Assignee: COOLER MASTER CO., LTD.Inventors: Hsin-Hung Chen, Shui-Fa Tsai, Shih-Yi Chang
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Publication number: 20160313067Abstract: A heat dissipating device includes a heat dissipating fin and a heat pipe. The heat dissipating fin includes a fin body, a through hole, a first arc-shaped portion and a second arc-shaped portion. The through hole is formed on the fin body and has a central line. The first arc-shaped portion extends from the through hole in a first direction and the second arc-shaped portion extends from the through hole in a second direction, wherein the first direction is opposite to the second direction. The first arc-shaped portion and the second arc-shaped portion are located at opposite sides of the central line. The heat pipe is disposed in the through hole.Type: ApplicationFiled: April 27, 2015Publication date: October 27, 2016Inventors: Tung-Yang Shieh, Shih-Yi Chang
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Publication number: 20160309619Abstract: A liquid cooling heat dissipation structure includes a heat conduction module, a heat dissipation module, and a liquid supply module. The heat conduction module includes a first heat-conducting substrate contacting at least one heat-generating source and a second heat-conducting substrate disposed on the first heat-conducting substrate. The heat dissipation module is disposed on the heat conduction module. The liquid supply module is detachably disposed on the heat conduction module to cover the heat dissipation module. The liquid supply module includes an external cover body and a radial-flow centrifugal impeller detachably disposed on the external cover body. The heat conductivity coefficient and the temperature uniformity of the heat conduction module is larger than the heat conductivity coefficient and the temperature uniformity of the heat dissipation module, and the heat-dissipating area of the heat dissipation module is larger than the heat-dissipating area of the heat conduction module.Type: ApplicationFiled: April 17, 2015Publication date: October 20, 2016Inventors: SHUI-FA TSAI, SHIH-YI CHANG
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Publication number: 20160115676Abstract: A water supply structure of a liquid cooling device, a pump and a liquid cooling device having the water supply structure are disclosed. The water supply structure, disposed on the cooling device or on the pump, includes a lower lid, an upper lid, and a pressure control member. An outlet is in the lower lid and communicates with the cooling device or with the pump. The upper lid is combined on the lower lid. A chamber, formed between the lower lid and the upper lid, communicates with the outlet and accommodates a coolant. The pressure control member is moveable in the chamber and includes a piston and an elastic part controlling the piston to move inside the chamber. The elastic part pushes against the piston to move inside the chamber such that the coolant is injected into the cooling device until hydraulic pressure equilibrium is achieved.Type: ApplicationFiled: September 25, 2015Publication date: April 28, 2016Inventors: Hsin-Hung CHEN, Shui-Fa TSAI, Shih-Yi CHANG
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Patent number: 9063701Abstract: A handheld operation device includes a casing, a plurality of counterweight blocks and a counterweight module. The counterweight module is disposed on the casing. The counterweight module includes a base and a block plate. The block plate covers the base. One of the base and the block plate is capable of rotating with respect to the casing. The base has a plurality of accommodating recesses. The block plate has a broken hole formed thereon. One of the accommodating recesses is exposed in the broken hole such that one of the counterweight blocks is capable of passing through the broken hole and then being disposed in the accommodating recess.Type: GrantFiled: March 31, 2013Date of Patent: June 23, 2015Assignee: COOLER MASTER DEVELOPMENT CORPORATIONInventors: Yi-Hsien Lai, Carter Williams Salley, Lung-Yuan Chen, Jhih-Wei Rao, Shih-Yi Chang
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Publication number: 20140328009Abstract: A portable power supply device includes a power casing, a power module, a first rotating member and a first electric connector. The power module is disposed in the power casing, wherein the power module at least includes a battery unit and a charge/discharge unit. The first rotating member is pivotally connected to a first end of the power casing. The first electric connector is disposed on the first rotating member and electrically connected to the power module. The first rotating member is capable of rotating with respect to the power casing, so as to orientate the first electric connector in a first direction or a second direction.Type: ApplicationFiled: May 5, 2013Publication date: November 6, 2014Applicant: Cooler Master Co., Ltd.Inventors: Shih-Yi Chang, Yi-Hsuan Huang
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Publication number: 20140290917Abstract: A heat dissipating pad includes a pad body and a fan. The pad body has a hollow accommodating recess and a first fixing structure disposed on a side of the hollow accommodating recess. The fan includes a fan frame. The fan frame is detachably disposed in the hollow accommodating recess and has a second fixing structure. When the fan frame is disposed at a predetermined position in the hollow accommodating recess, the first fixing structure and the second fixing structure are fixed with each other so as to prevent the fan frame from coming off the hollow accommodating recess.Type: ApplicationFiled: March 31, 2013Publication date: October 2, 2014Applicant: COOLER MASTER CO., LTD.Inventors: Shih-Yi Chang, Ying-Chun Chen, Yuan-Chin Chen, XIAOBIN YAN, Yi-Hsuan Huang, Ben-Tien Lin, Ching-Feng Shih
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Publication number: 20140290426Abstract: A handheld operation device includes a casing, a plurality of counterweight blocks and a counterweight module. The counterweight module is disposed on the casing. The counterweight module includes a base and a block plate. The block plate covers the base. One of the base and the block plate is capable of rotating with respect to the casing. The base has a plurality of accommodating recesses. The block plate has a broken hole formed thereon. One of the accommodating recesses is exposed in the broken hole such that one of the counterweight blocks is capable of passing through the broken hole and then being disposed in the accommodating recess.Type: ApplicationFiled: March 31, 2013Publication date: October 2, 2014Applicant: COOLER MASTER CO., LTD.Inventors: Yi-Hsien Lai, Carter Williams Salley, Lung-Yuan Chen, Jhih-Wei Rao, Shih-Yi Chang
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Publication number: 20140195503Abstract: A method and a system for managing cache files, adapted for a local end apparatus to manage files cached from a service end apparatus, are provided. In the method, a file is divided into a plurality of segments, and a part of the segments are downloaded from the service end apparatus and stored in the local end apparatus. Then, the segments of the file to be downloaded are increased or decreased according to a utility rate of the file.Type: ApplicationFiled: May 13, 2013Publication date: July 10, 2014Applicant: COMPAL ELECTRONICS, INC.Inventors: Chen-Li Kao, Yu-Ting Lai, Ko-Chun Lin, Shih-Yi Chang, Pei-Ching Hu, Po-Chao Wang, Ching-Tien Nien, Yu-Hung Chen, Chin-Hsun Wu
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Patent number: 7187064Abstract: A transistor structure includes at least one chip; a packaging insulating layer, a first adhesive layer, a conducting layer, and a second adhesive layer sequentially provided on one side of the chip having electrical contacts thereon, so that the conducting layer is bonded between the first and the second adhesive layer; and a leadframe bonded to an outer side of the second adhesive layer. The conducting layer may be a metal sheet, a metal film, or a type of conducting fiber. The leadframe is connected to the electrical contacts on the chip via lead wires, and at least one of the electrical contacts on the chip is connected to the conducting layer via a conductor, so that the conducting layer is able to isolate electrical noises and reduce electromagnetic interferences, improve rates of transmission and heat release, strengthen chip packaging structure, and serve as a common grounding circuit.Type: GrantFiled: February 7, 2005Date of Patent: March 6, 2007Assignee: Domintech Co., Ltd.Inventors: Chung-Hsing Tzu, Shih-yi Chang
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Publication number: 20060175317Abstract: The prevent invention discloses a lifespan monitoring apparatus and method for a filter of an unboiled water pitcher. The pitcher comprises an interior for holding a quantity of liquid, a bottom base with an orifice, a pressure-measuring device disposed in the bottom base and communicating with the orifice to measure weight of the liquid held in the interior, a microprocessor device coupled with the pressure-measuring device. The prevent invention also discloses a monitoring method comprising the following steps: measuring a first added weight of the liquid and storing a first data, transformed from the first added weight, by the microprocessor device; pouring out the liquid held in the interior; measuring a second added weight of the liquid and accumulating a second data, transformed from the second added weight, with the first data by the microprocessor device to form an accumulated data; comparing the accumulated data with a standard data.Type: ApplicationFiled: February 9, 2005Publication date: August 10, 2006Inventor: Shih-Yi Chang
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Publication number: 20060017146Abstract: An IC with stably mounted chip includes a chip, a leadframe, a bridge, and an encapsulating compound. The bridge is a flat arch made of a sheet material and includes a horizontal fixing section and a supporting section downward extended from each end of the fixing section. The chip is adhered to a bottom side of the fixing section of the bridge. The leadframe includes a plurality of leads arranged at two opposite sides of the chip. The encapsulating compound is applied to cover the chip, the bridge, and inner portions of the leads to complete a compact IC having a stably mounted chip and a reduced overall thickness. An additional chip may be adhered to a top of the bridge.Type: ApplicationFiled: August 10, 2005Publication date: January 26, 2006Inventors: Chung-Hsing Tzu, Shih-Yi Chang
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Patent number: D908078Type: GrantFiled: August 19, 2019Date of Patent: January 19, 2021Assignee: FEDERAL CORPORATIONInventor: Shih-Yi Chang
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Patent number: D948285Type: GrantFiled: December 2, 2019Date of Patent: April 12, 2022Assignee: Access Business Group International LLCInventors: Ziqi Wu, Zane Hoekstra, Timothy P Bower, Shih-Yi Chang, Tianxiong Zeng