Patents by Inventor Shih-Yi Lu

Shih-Yi Lu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12002768
    Abstract: A semiconductor package and a manufacturing method for the semiconductor package are provided. The semiconductor package includes a molded semiconductor device, a first redistribution structure, and conductive vias. The molded semiconductor device comprises a sensor die with a first surface and a second surface opposite the first surface, wherein the sensor die has an input/output region and a sensing region at the first surface. The first redistribution structure is disposed on the first surface of the sensor die, wherein the first redistribution structure covers the input/output region and exposes the sensing region, and the first redistribution structure comprises a conductive layer having a redistribution pattern and a ring structure. The redistribution pattern is electrically connected with the sensor die. The ring structure surrounds the sensing region and is separated from the redistribution pattern, wherein the ring structure is closer to the sensing region than the redistribution pattern.
    Type: Grant
    Filed: August 27, 2021
    Date of Patent: June 4, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yu-Chih Huang, Chih-Hao Chang, Po-Chun Lin, Chun-Ti Lu, Zheng-Gang Tsai, Shih-Wei Chen, Chia-Hung Liu, Hao-Yi Tsai, Chung-Shi Liu
  • Publication number: 20240178102
    Abstract: A package includes a frontside redistribution layer (RDL) structure, a semiconductor die on the frontside RDL structure, and a backside RDL structure on the semiconductor die including a first RDL, and a backside connector extending from a distal side of the first RDL and including a tapered portion having a width that decreases in a direction away from the first RDL, wherein the tapered portion includes a contact surface at an end of the tapered portion. A method of forming the package may include forming the backside redistribution layer (RDL) structure, attaching a semiconductor die to the backside RDL structure, forming an encapsulation layer around the semiconductor die on the backside RDL structure, and forming a frontside RDL structure on the semiconductor die and the encapsulation layer.
    Type: Application
    Filed: April 21, 2023
    Publication date: May 30, 2024
    Inventors: Chun-Ti LU, Hao-Yi TSAI, Chiahung LIU, Ken-Yu CHANG, Tzuan-Horng LIU, Chih-Hao CHANG, Bo-Jiun LIN, Shih-Wei CHEN, Pei-Rong NI, Hsin-Wei HUANG, Zheng GangTsai, Tai-You LIU, Steve SHIH, Yu-Ting HUANG, Steven SONG, Yu-Ching WANG, Tsung-Yuan YU, Hung-Yi KUO, CHung-Shi LIU, Tsung-Hsien CHIANG, Ming Hung TSENG, Yen-Liang LIN, Tzu-Sung HUANG, Chun-Chih CHUANG
  • Publication number: 20240100553
    Abstract: A sprayer, comprising: a container, configured to contain liquid; a passage, comprising a first opening, a second opening, a resonator and a mesh, when the liquid is passed through the resonator, the liquid is emitted as a gas; a first optical sensor, configured to sense first optical data of at least portion of the mesh or at least portion of a surface of the container; and a processing circuit, configured to compute a foaming level of the mesh or of the surface according to the first optical data, and configured to determine whether the resonator should be turned off or not according to the foaming level. In another aspect, the processing circuit estimates a liquid level of the liquid but does not correspondingly turn off the resonator. By this way, the resonator may be turned on or turned off more properly and the liquid level may be more precisely estimated.
    Type: Application
    Filed: December 5, 2023
    Publication date: March 28, 2024
    Applicant: PixArt Imaging Inc.
    Inventors: Shih-Jen Lu, Yang-Ming Chou, Chih-Hao Wang, Chien-Yi Kao, Hsin-Yi Lin
  • Publication number: 20240096781
    Abstract: A package structure including a semiconductor die, a redistribution circuit structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution circuit structure includes a colored dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the inter-dielectric layers. The electronic device is disposed over the colored dielectric layer and electrically connected to the redistribution circuit structure.
    Type: Application
    Filed: March 20, 2023
    Publication date: March 21, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Ti Lu, Hao-Yi Tsai, Chia-Hung Liu, Yu-Hsiang Hu, Hsiu-Jen Lin, Tzuan-Horng Liu, Chih-Hao Chang, Bo-Jiun Lin, Shih-Wei Chen, Hung-Chun Cho, Pei-Rong Ni, Hsin-Wei Huang, Zheng-Gang Tsai, Tai-You Liu, Po-Chang Shih, Yu-Ting Huang
  • Patent number: 11202728
    Abstract: A transmission apparatus for a leveraged wheelchair may include a wheelchair, a driving mechanism, a driving wheels set, and a transmission wheels set. The driving mechanism has a first tube and a second tube which are pivotally connected, and with the relative movements between the first tube and the second tube, the driving wheels set can have forward or rearward rotation so as to achieve bi-direction driving effect of the wheelchair. Also, the relative movement between the first tube and the second tube is cooperated with a flexible connecting head such that a handle of the wheelchair is adapted to be forward and rearward pulled or rotated axially so to achieve the moving and turning actions of the wheelchair with one hand.
    Type: Grant
    Filed: August 29, 2019
    Date of Patent: December 21, 2021
    Inventors: Junghsen Lieh, Shih-Yi Lu, Shi-Chang Tseng
  • Publication number: 20210059877
    Abstract: A transmission apparatus for a leveraged wheelchair may include a wheelchair, a driving mechanism, a driving wheels set, and a transmission wheels set. The driving mechanism has a first tube and a second tube which are pivotally connected, and with the relative movements between the first tube and the second tube, the driving wheels set can have forward or rearward rotation so as to achieve bi-direction driving effect of the wheelchair. Also, the relative movement between the first tube and the second tube is cooperated with a flexible connecting head such that a handle of the wheelchair is adapted to be forward and rearward pulled or rotated axially so to achieve the moving and turning actions of the wheelchair with one hand.
    Type: Application
    Filed: August 29, 2019
    Publication date: March 4, 2021
    Inventors: Junghsen Lieh, Shih-Yi Lu, Shi-Chang Tseng